Abstract:
A molded article includes a continuous porous body provided with a thin film layer, the continuous porous body having a void that is continuous in a thickness direction of the continuous porous body, the thin film layer including a solid additive and a resin. A permeation rate of water from a surface of the molded article on a side of the thin film layer is 10% or less.
Abstract:
Provided is a method for producing a molded article obtained by integrating a decoration layer onto a surface of a porous body including a reinforcing fiber. The method includes: a preheating process at which the decoration layer is preheated; and a shaping and integrating process at which the porous body is pressed to the decoration layer or the decoration layer is pressed to the porous body to shape the decoration layer, and the porous body and the decoration layer are integrated to each other.
Abstract:
A housing includes: a top cover; a bottom cover having a rising wall member erected toward the top cover and joined to the top cover at a rim; and a reinforcing structure which is disposed in a space divided by the top cover and the bottom cover, and has an opening, the reinforcing structure being joined to the bottom cover. The bottom cover is formed of a material having a thickness of 0.1 mm or more and 0.8 mm or less and an elastic modulus of 20 GPa or more and 120 GPa or less.
Abstract:
A molded product and a unified molded product that are lightweight and also high in rigidity to meet the requirements from the market can be produced from a molded product comprising: a first member (I) containing a planar surface layer part and a protruding core part, and a second member (II) unified therewith, the first member (I) being of a fiber-reinforced resin (A) formed mainly of a reinforcing fiber (a1) and a matrix resin (a2), part of the threads of the reinforcing fiber (a1) extending penetratingly between the surface layer part and the core part, the part of the threads of the reinforcing fiber (a1) extending penetratingly at a rate of 400 threads/mm2 or more through the boundary surface between the surface layer part and the core part, the reinforcing fiber (a1) having a number-average fiber length Ln of 1 mm or more, and the core part forming a hollow structure.
Abstract:
Provided is a method for producing a molded article having a thin film layer (B) formed on a surface of a porous body (A). The method includes a process (I) and a process (II) described below in this order:
process (I): forming the thin film layer (B) on a surface of a precursor (a) of the porous body (A) to obtain a preform, and process (II): expanding and molding the precursor (a) to the porous body (A).
Abstract:
A fiber-reinforced resin substrate is described in which a plurality of resins having differing properties are strongly composited, wherein the fiber-reinforced resin substrate is obtained by impregnating a thermoplastic resin (A) and a thermoplastic resin (B) into continuous reinforcement fibers, wherein a thermoplastic resin (A) layer, which comprises the thermoplastic resin (A) and is exposed at one surface, and a thermoplastic resin (B) layer, which comprises the thermoplastic resin (B) and is exposed at the other surface, form a boundary region, where at least some of the continuous reinforcement fibers exist in a manner spanning across the boundary region and both the thermoplastic resin (A) and the thermoplastic resin (B) are crystalline resins having a melting point of not less than 200° C.
Abstract:
The present invention aims to provide an electronic device housing that is able to maintain the antenna performance without deteriorating the radio communication performance, excellent in terms of the degree of warpage and dimensional accuracy, and mass productivity. The electronic device housing includes a fiber reinforcing member (a) and a fiber reinforcing member (b), wherein the fiber reinforcing member (a) contains a resin (a1) and a fiber (a2), the fiber (a2) being in the form of discontinuous fibers; the fiber reinforcing member (b) contains a resin (b1) and a fiber (b2), the fiber (b2) being in the form of continuous fibers; the projected area of the fiber reinforcing member (a) accounts for 60% or more of the total projected area, which accounts for 100%, of the housing projected onto the plane of the top face; and requirements (i) and/or (ii) given below are met: (i) the resin (a1) is a thermoplastic resin having a melting point of more than 265° C., and (ii) the resin (a1) is a thermoplastic resin having a water absorption rate of 0.4% or less.
Abstract:
Provided is a mountain-shaped structure material being excellent in stiffness and lightness. The present invention is a structure material including a resin, reinforced fibers and voids. The structure material has a specific bending stiffness represented as Ec1/3·ρ−1 being 2.5 or more where a bending modulus is Ec and a density is ρ. The structure material has a mountain shape.
Abstract:
An electronic device housing includes: a bottom cover; a top cover; a partition structure that is disposed in a space divided by the bottom cover and the top cover and has an opening; and a heat generation member. The partition structure is joined to the bottom cover or the top cover to form a hollow structure, and the heat generation member is disposed on a surface of the partition structure on the hollow structure side.
Abstract:
A resin supply material is used for molding a fiber-reinforced resin and includes a continuous porous material and a resin. The continuous porous material has a bending resistance Grt of 10 mN·cm or more at 23° C., and a bending resistance ratio Gr of 0.7 or less, the bending resistance ratio Gr being expressed by the formula: Gr=Gmt/Grt Gmt: bending resistance of continuous porous material at 70° C.