METHOD FOR MANUFACTURING MOLDED ARTICLE

    公开(公告)号:US20210001536A1

    公开(公告)日:2021-01-07

    申请号:US16976838

    申请日:2019-03-28

    Abstract: Provided is a method for producing a molded article obtained by integrating a decoration layer onto a surface of a porous body including a reinforcing fiber. The method includes: a preheating process at which the decoration layer is preheated; and a shaping and integrating process at which the porous body is pressed to the decoration layer or the decoration layer is pressed to the porous body to shape the decoration layer, and the porous body and the decoration layer are integrated to each other.

    Housing
    13.
    发明授权
    Housing 有权

    公开(公告)号:US10571963B2

    公开(公告)日:2020-02-25

    申请号:US15760333

    申请日:2016-09-06

    Abstract: A housing includes: a top cover; a bottom cover having a rising wall member erected toward the top cover and joined to the top cover at a rim; and a reinforcing structure which is disposed in a space divided by the top cover and the bottom cover, and has an opening, the reinforcing structure being joined to the bottom cover. The bottom cover is formed of a material having a thickness of 0.1 mm or more and 0.8 mm or less and an elastic modulus of 20 GPa or more and 120 GPa or less.

    Electronic device housing and method for producing same

    公开(公告)号:US11799199B2

    公开(公告)日:2023-10-24

    申请号:US16325341

    申请日:2017-09-25

    CPC classification number: H01Q1/40 G06F1/1633 H05K5/0217 H05K5/0247 H01Q1/22

    Abstract: The present invention aims to provide an electronic device housing that is able to maintain the antenna performance without deteriorating the radio communication performance, excellent in terms of the degree of warpage and dimensional accuracy, and mass productivity. The electronic device housing includes a fiber reinforcing member (a) and a fiber reinforcing member (b), wherein the fiber reinforcing member (a) contains a resin (a1) and a fiber (a2), the fiber (a2) being in the form of discontinuous fibers; the fiber reinforcing member (b) contains a resin (b1) and a fiber (b2), the fiber (b2) being in the form of continuous fibers; the projected area of the fiber reinforcing member (a) accounts for 60% or more of the total projected area, which accounts for 100%, of the housing projected onto the plane of the top face; and requirements (i) and/or (ii) given below are met: (i) the resin (a1) is a thermoplastic resin having a melting point of more than 265° C., and (ii) the resin (a1) is a thermoplastic resin having a water absorption rate of 0.4% or less.

    Electronic device housing
    19.
    发明授权

    公开(公告)号:US10908651B2

    公开(公告)日:2021-02-02

    申请号:US15760735

    申请日:2016-09-06

    Abstract: An electronic device housing includes: a bottom cover; a top cover; a partition structure that is disposed in a space divided by the bottom cover and the top cover and has an opening; and a heat generation member. The partition structure is joined to the bottom cover or the top cover to form a hollow structure, and the heat generation member is disposed on a surface of the partition structure on the hollow structure side.

Patent Agency Ranking