公开(公告)号：US11901258B2

公开(公告)日：2024-02-13

申请号：US17227790

申请日：2021-04-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hao-Jan Pei ,  Wei-Yu Chen ,  Chia-Shen Cheng ,  Chih-Chiang Tsao ,  Cheng-Ting Chen ,  Chia-Lun Chang ,  Chih-Wei Lin ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chung-Shi Liu

IPC: H01L23/373 ,  H01L23/50 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L25/10 ,  H01L23/367 ,  H01L23/538 ,  H01L23/498

CPC classification number: H01L23/3736 ,  H01L21/486 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/83 ,  H01L25/105 ,  H01L23/49816 ,  H01L2224/18 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099

Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.

公开(公告)号：US11646293B2

公开(公告)日：2023-05-09

申请号：US16935465

申请日：2020-07-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Shen Cheng ,  Wei-Yu Chen ,  Philip Yu-Shuan Chung ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chen-Hua Yu

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L24/13 ,  H01L24/75 ,  H01L2224/81224 ,  H01L2224/81939

Abstract: A method for bonding semiconductor substrates includes placing a die on a substrate and performing a heating process on the die and the substrate to bond the respective first connectors with the respective second connectors. Respective first connectors of a plurality of first connectors on the die contact respective second connectors of a plurality of second connectors on the substrate. The heating process includes placing a mask between a laser generator and the substrate and performing a laser shot. The mask includes a masking layer and a transparent layer. Portions of the masking layer are opaque. The laser passes through a first gap in the masking layer and through the transparent layer to heat a first portion of a top side of the die opposite the substrate.

公开(公告)号：US11462507B2

公开(公告)日：2022-10-04

申请号：US17034917

申请日：2020-09-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Yu Chen ,  Chia-Shen Cheng ,  Hao-Jan Pei ,  Philip Yu-Shuan Chung ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chen-Hua Yu ,  Chung-Shi Liu

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56

Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.

公开(公告)号：US11211341B2

公开(公告)日：2021-12-28

申请号：US16719984

申请日：2019-12-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hao-Jan Pei ,  Ching-Hua Hsieh ,  Hsiu-Jen Lin ,  Wei-Yu Chen ,  Chia-Shen Cheng ,  Chih-Chiang Tsao ,  Jen-Jui Yu ,  Cheng-Shiuan Wong

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

Abstract: Provided is a package structure, including a die, a plurality of through vias, an encapsulant, a plurality of first connectors, a warpage control material and a protection material. The plurality of through vias are disposed around the die. The encapsulant laterally encapsulate the die and the plurality of through vias. The plurality of first connectors are electrically connected to the plurality of through vias. The warpage control material is disposed over a first surface of the die. The protection material is disposed over the encapsulant, around the plurality of first connectors and the warpage control material.

公开(公告)号：US20190139886A1

公开(公告)日：2019-05-09

申请号：US15877398

申请日：2018-01-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Yu Chen ,  Chih-Hua Chen ,  Ching-Hua Hsieh ,  Hsiu-Jen Lin ,  Yu-Chih Huang ,  Yu-Peng Tsai ,  Chia-Shen Cheng ,  Chih-Chiang Tsao ,  Jen-Jui Yu

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/522

Abstract: A package structure includes an insulating encapsulation, at least one die, and conductive structures. The at least one die is encapsulated in the insulating encapsulation. The conductive structures are located aside of the at least one die and surrounded by the insulating encapsulation, and at least one of the conductive structures is electrically connected to the at least one die. Each of the conductive structures has a first surface, a second surface opposite to the first surface and a slant sidewall connecting the first surface and the second surface, and each of the conductive structures has a top diameter greater than a bottom diameter thereof, and wherein each of the conductive structures has a plurality of pores distributed therein.

公开(公告)号：US20250093593A1

公开(公告)日：2025-03-20

申请号：US18403531

申请日：2024-01-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wen-Chih Lin ,  Cheng-Yu Kuo ,  Yen-Hung Chen ,  Hsuan-Ting Kuo ,  Chia-Shen Cheng ,  Chao-Wei Li ,  Ching-Hua Hsieh ,  Wen-Chih Chiou ,  Ming-Fa Chen ,  Shang-Yun Hou

IPC: G02B6/42

Abstract: Optical devices and methods of manufacture are presented in which a mirror structure is utilized to transmit and receive optical signals to and from an optical device. In embodiments the mirror structure receives optical signals from outside of an optical device and directs the optical signals through at least one mirror to an optical component of the optical device.

公开(公告)号：US20250087652A1

公开(公告)日：2025-03-13

申请号：US18405844

申请日：2024-01-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Yu Chen ,  Cheng-Shiuan Wong ,  Chia-Shen Cheng ,  Hsuan-Ting Kuo ,  Hao-Jan Pei ,  Hsiu-Jen Lin ,  Mao-Yen Chang

IPC: H01L25/18 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/00

Abstract: A semiconductor package includes an interposer that has a first side and a second side opposing the first side. A semiconductor device that is on the first side of the interposer and an optical device that is on the first side of the interposer and next to the semiconductor device. A first encapsulant layer includes a first portion and a second portion. The first portion of the first encapsulant layer is on the first side of the interposer and along sidewalls of the semiconductor device. A gap is between a first sidewall of the optical device and a second sidewall of the first portion of the first encapsulant layer. A substrate is over the second side of the interposer. The semiconductor device and the optical device are electrically coupled to the substrate through the interposer.

公开(公告)号：US20210013173A1

公开(公告)日：2021-01-14

申请号：US17034917

申请日：2020-09-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Yu Chen ,  Chia-Shen Cheng ,  Hao-Jan Pei ,  Philip Yu-Shuan Chung ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chen-Hua Yu ,  Chung-Shi Liu

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56

Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.

公开(公告)号：US20240234365A1

公开(公告)日：2024-07-11

申请号：US18613954

申请日：2024-03-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Yu Chen ,  Chia-Shen Cheng ,  Hao-Jan Pei ,  Philip Yu-Shuan Chung ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chen-Hua Yu ,  Chung-Shi Liu

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L23/3114 ,  H01L23/49822 ,  H01L24/17 ,  H01L2224/175 ,  H01L2224/81224 ,  H01L2924/3511

Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.

公开(公告)号：US20210233829A1

公开(公告)日：2021-07-29

申请号：US17227790

申请日：2021-04-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hao-Jan Pei ,  Wei-Yu Chen ,  Chia-Shen Cheng ,  Chih-Chiang Tsao ,  Cheng-Ting Chen ,  Chia-Lun Chang ,  Chih-Wei Lin ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chung-Shi Liu

IPC: H01L23/373 ,  H01L23/50 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L25/10 ,  H01L23/367 ,  H01L23/538

Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.