Nitride semiconductor light emitting device and epitaxial substrate
    11.
    发明授权
    Nitride semiconductor light emitting device and epitaxial substrate 失效
    氮化物半导体发光器件和外延衬底

    公开(公告)号:US08748868B2

    公开(公告)日:2014-06-10

    申请号:US13294010

    申请日:2011-11-10

    IPC分类号: H01L29/06 H01L31/00

    摘要: For a nitride semiconductor light emitting device, a c-axis vector of hexagonal GaN of a support substrate is inclined to an X-axis direction with respect to a normal axis Nx normal to a primary surface. In a semiconductor region an active layer, a first gallium nitride-based semiconductor layer, an electron block layer, and a second gallium nitride-based semiconductor layer are arranged along the normal axis on the primary surface of the support substrate. A p-type cladding layer is comprised of AlGaN, and the electron block layer is comprised of AlGaN. The electron block layer is subject to tensile strain in the X-axis direction. The first gallium nitride-based semiconductor layer is subject to compressive strain in the X-axis direction. The misfit dislocation density at an interface is smaller than that at an interface. A barrier to electrons at the interface is raised by piezoelectric polarization.

    摘要翻译: 对于氮化物半导体发光器件,支撑衬底的六边形GaN的c轴矢量相对于垂直于主表面的法线轴Nx相对于X轴方向倾斜。 在半导体区域中,在支撑基板的主表面上沿着法线布置有源层,第一氮化镓基半导体层,电子阻挡层和第二氮化镓基半导体层。 p型覆层由AlGaN构成,电子阻挡层由AlGaN构成。 电子阻挡层在X轴方向上受到拉伸应变。 第一氮化镓基半导体层在X轴方向上受到压应变。 界面处的错配位错密度小于界面处的位错密度。 在界面处的电子势垒由压电极化引起。

    III-nitride semiconductor laser, and method for fabricating III-nitride semiconductor laser
    12.
    发明授权
    III-nitride semiconductor laser, and method for fabricating III-nitride semiconductor laser 有权
    III族氮化物半导体激光器和III族氮化物半导体激光器的制造方法

    公开(公告)号:US08548021B2

    公开(公告)日:2013-10-01

    申请号:US13211858

    申请日:2011-08-17

    IPC分类号: H01S5/00

    摘要: Provided is a III-nitride semiconductor laser allowing for provision of a low threshold with use of a semipolar plane. A primary surface 13a of a semiconductor substrate 13 is inclined at an angle of inclination AOFF in the range of not less than 50 degrees and not more than 70 degrees toward the a-axis direction of GaN with respect to a reference plane perpendicular to a reference axis Cx along the c-axis direction of GaN. A first cladding layer 15, an active layer 17, and a second cladding layer 19 are provided on the primary surface 13a of the semiconductor substrate 13. The well layers 23a of the active layer 17 comprise InGaN. A polarization degree P in the LED mode of emission from the active layer of the semiconductor laser that reaches lasing is not less than −1 and not more than 0.1. The polarization degree P of the III-nitride semiconductor laser is defined by P=(I1−I2)/(I1+I2), using an electric field component I1 in the X1 direction and an electric field component I2 in the X2 direction of light in the LED mode.

    摘要翻译: 提供了允许使用半极性平面提供低阈值的III族氮化物半导体激光器。 半导体基板13的主表面13a相对于垂直于参考的参考平面朝向a轴方向的不小于50度且不超过70度的范围内以倾斜角AOFF倾斜 沿着C轴方向的C x轴。 在半导体衬底13的主表面13a上设置第一覆层15,有源层17和第二覆层19.有源层17的阱层23a包括InGaN。 来自激光器的半导体激光器的有源层的发光LED的偏振度P不小于-1且不大于0.1。 III族氮化物半导体激光器的偏振度P通过使用X1方向的电场分量I1和X2方向的电场分量I2由P =(I1-I2)/(I1 + I2)定义 在LED模式下。

    Group III nitride semiconductor laser diode, and method for producing group III nitride semiconductor laser diode
    13.
    发明授权
    Group III nitride semiconductor laser diode, and method for producing group III nitride semiconductor laser diode 失效
    III族氮化物半导体激光二极管,以及III族氮化物半导体激光二极管的制造方法

    公开(公告)号:US08483251B2

    公开(公告)日:2013-07-09

    申请号:US13294378

    申请日:2011-11-11

    IPC分类号: H01S5/00

    摘要: Provided is a Group III nitride semiconductor laser diode with a cladding layer capable of providing high optical confinement and carrier confinement. An n-type Al0.08Ga0.92N cladding layer is grown so as to be lattice-relaxed on a (20-21)-plane GaN substrate. A GaN optical guiding layer is grown so as to be lattice-relaxed on the n-type cladding layer. An active layer, a GaN optical guiding layer, an Al0.12Ga0.88N electron blocking layer, and a GaN optical guiding layer are grown so as not to be lattice-relaxed on the optical guiding layer. A p-type Al0.08Ga0.92N cladding layer is grown so as to be lattice-relaxed on the optical guiding layer. A p-type GaN contact layer is grown so as not to be lattice-relaxed on the p-type cladding layer, to produce a semiconductor laser. Dislocation densities at junctions are larger than those at the other junctions.

    摘要翻译: 提供了具有能够提供高的光学限制和载流子限制的包层的III族氮化物半导体激光二极管。 生长n型Al0.08Ga0.92N包覆层,使其在(20-21)面GaN衬底上晶格弛豫。 在n型包覆层上生长GaN光引导层以使其晶格弛豫。 生长活性层,GaN光引导层,Al0.12Ga0.88N电子阻挡层和GaN光引导层,使得在导光层上不会格子弛豫。 生长p型Al0.08Ga0.92N覆层,使其在光导层上格子弛豫。 生长p型GaN接触层,以便在p型覆层上不会发生晶格弛豫,以产生半导体激光器。 交界处的位错密度大于其他路口的位错密度。

    Method of fabricating group III nitride semiconductor device
    15.
    发明授权
    Method of fabricating group III nitride semiconductor device 有权
    制备III族氮化物半导体器件的方法

    公开(公告)号:US08304269B2

    公开(公告)日:2012-11-06

    申请号:US13112714

    申请日:2011-05-20

    IPC分类号: H01L21/00

    摘要: A group III nitride semiconductor device having a gallium nitride based semiconductor film with an excellent surface morphology is provided. A group III nitride optical semiconductor device 11a includes a group III nitride semiconductor supporting base 13, a GaN based semiconductor region 15, an active layer active layer 17, and a GaN semiconductor region 19. The primary surface 13a of the group III nitride semiconductor supporting base 13 is not any polar plane, and forms a finite angle with a reference plane Sc that is orthogonal to a reference axis Cx extending in the direction of a c-axis of the group III nitride semiconductor. The GaN based semiconductor region 15 is grown on the semipolar primary surface 13a. A GaN based semiconductor layer 21 of the GaN based semiconductor region 15 is, for example, an n-type GaN based semiconductor, and the n-type GaN based semiconductor is doped with silicon. A GaN based semiconductor layer 23 of an oxygen concentration of 5×1016 cm−3 or more provides an active layer 17 with an excellent crystal quality, and the active layer 17 is grown on the primary surface of the GaN based semiconductor layer 23.

    摘要翻译: 提供具有优异表面形态的具有氮化镓基半导体膜的III族氮化物半导体器件。 III族氮化物光半导体器件11a包括III族氮化物半导体支撑基底13,GaN基半导体区域15,有源层有源层17和GaN半导体区域19.第III族氮化物半导体支撑基底13的主表面13a 基座13不是任何极性平面,并且与参考平面Sc形成有限的角度,该参考平面Sc与在III族氮化物半导体的c轴方向上延伸的基准轴Cx正交。 在半极性主表面13a上生长GaN基半导体区域15。 GaN系半导体区域15的GaN系半导体层21例如为n型GaN系半导体,n型GaN系半导体掺杂有硅。 氧浓度为5×1016cm-3以上的GaN系半导体层23提供具有优异晶体质量的有源层17,并且在GaN基半导体层23的主表面上生长有源层17。

    GROUP III NITRIDE SEMICONDUCTOR OPTICAL DEVICE
    17.
    发明申请
    GROUP III NITRIDE SEMICONDUCTOR OPTICAL DEVICE 有权
    III类氮化物半导体光学器件

    公开(公告)号:US20110121265A1

    公开(公告)日:2011-05-26

    申请号:US13055690

    申请日:2010-02-26

    IPC分类号: H01L29/66

    摘要: A group III nitride semiconductor optical device 11a has a group III nitride semiconductor substrate 13 having a main surface 13a forming a finite angle with a reference plane Sc orthogonal to a reference axis Cx extending in a c-axis direction of the group III nitride semiconductor and an active layer 17 of a quantum-well structure, disposed on the main surface 13a of the group III nitride semiconductor substrate 13, including a well layer 28 made of a group III nitride semiconductor and a plurality of barrier layers 29 made of a group III nitride semiconductor. The main surface 13a exhibits semipolarity. The active layer 17 has an oxygen content of at least 1×1017 cm−3 but not exceeding 8×1017 cm−3. The plurality of barrier layers 29 contain an n-type impurity other than oxygen by at least 1×1017 cm−3 but not exceeding 1×1019 cm−3 in an upper near-interface area 29u in contact with a lower interface 28Sd of the well layer 28 on the group III nitride semiconductor substrate side.

    摘要翻译: III族氮化物半导体光学元件11a具有III族氮化物半导体衬底13,该III族氮化物半导体衬底13具有与在III族氮化物半导体的c轴方向上延伸的参考轴Cx正交的参考平面Sc形成有限角度的主表面13a; 设置在III族氮化物半导体衬底13的主表面13a上的量子阱结构的有源层17,包括由III族氮化物半导体制成的阱层28和由III族组成的多个势垒层29 氮化物半导体。 主表面13a具有半极性。 活性层17的氧含量至少为1×1017cm-3,但不超过8×1017cm-3。 多个势垒层29在上接近界面区域29u中含有除氧之外的至少1×1017cm-3但不超过1×1019cm-3的n型杂质,该上接近界面区29u与下界面28Sd接触 III族氮化物半导体衬底侧的阱层28。

    Group III nitride semiconductor laser diode
    19.
    发明授权
    Group III nitride semiconductor laser diode 失效
    III族氮化物半导体激光二极管

    公开(公告)号:US08619828B2

    公开(公告)日:2013-12-31

    申请号:US12836065

    申请日:2010-07-14

    IPC分类号: H01S5/343

    摘要: A group III nitride substrate has a semi-polar primary surface. A first cladding layer has a first conductivity type, and comprises aluminum-containing group III nitride. The first cladding layer is provided on the substrate. An active layer is provided on the first cladding layer. A second cladding layer has a second conductivity type, and comprises aluminum-containing group III nitride. The second cladding layer is provided on the active layer. An optical guiding layer is provided between the first cladding layer and the active layer and/or between the second cladding layer and the active layer. The optical guiding layer comprises a first layer comprising Inx1Ga1-x1N (0≦x1

    摘要翻译: III族氮化物衬底具有半极性主表面。 第一包层具有第一导电类型,并且包括含铝的III族氮化物。 第一包层设置在基板上。 在第一包层上设置有源层。 第二包层具有第二导电类型,并且包括含铝的III族氮化物。 第二包覆层设置在有源层上。 在第一包层和有源层之间和/或第二包层和有源层之间设置光导层。 光引导层包括包含In x Ga 1-x N(0 @ x1 <1)的第一层和包括In x 2 Ga 1-x 2 N(x 1

    Group-III nitride semiconductor device, epitaxial substrate, and method of fabricating group-III nitride semiconductor device
    20.
    发明授权
    Group-III nitride semiconductor device, epitaxial substrate, and method of fabricating group-III nitride semiconductor device 失效
    III族氮化物半导体器件,外延衬底以及III族氮化物半导体器件的制造方法

    公开(公告)号:US08487327B2

    公开(公告)日:2013-07-16

    申请号:US13484776

    申请日:2012-05-31

    IPC分类号: H01L33/00 H01L29/04

    摘要: A III-nitride semiconductor device has a support base comprised of a III-nitride semiconductor and having a primary surface extending along a first reference plane perpendicular to a reference axis inclined at a predetermined angle with respect to a c-axis of the III-nitride semiconductor, and an epitaxial semiconductor region provided on the primary surface of the support base. The epitaxial semiconductor region includes GaN-based semiconductor layers. The reference axis is inclined at a first angle from the c-axis of the III-nitride semiconductor toward a first crystal axis, either the m-axis or a-axis. The reference axis is inclined at a second angle from the c-axis of the III-nitride semiconductor toward a second crystal axis, the other of the m-axis and a-axis. Morphology of an outermost surface of the epitaxial semiconductor region includes a plurality of pits. A pit density of the pits is not more than 5×104 cm−2.

    摘要翻译: III族氮化物半导体器件具有由III族氮化物半导体构成的支撑基底,其具有沿与第一参考平面垂直的第一参考平面延伸的第一表面,所述第一参考平面垂直于相对于III族氮化物的c轴以预定角度倾斜的参考轴 半导体和设置在支撑基体的主表面上的外延半导体区域。 外延半导体区域包括GaN基半导体层。 基准轴从III族氮化物半导体的c轴朝向第一晶轴倾斜第一角度,即m轴或a轴。 基准轴从III族氮化物半导体的c轴向第二晶轴倾斜第二角度,m轴和a轴的另一方倾斜。 外延半导体区域的最外表面的形态包括多个凹坑。 坑的坑密度不大于5×104cm-2。