公开(公告)号：US20220415687A1

公开(公告)日：2022-12-29

申请号：US17756217

申请日：2020-11-20

Applicant: Tokyo Electron Limited

Inventor： Tatsuo HATANO ,  Tetsuya MIYASHITA ,  Naoki WATANABE ,  Naoyuki SUZUKI

IPC: H01L21/677 ,  H01L21/67 ,  H02K41/03

Abstract: A substrate transfer device, includes: a first planar motor installed in a first chamber and having an array of coils; a second planar motor installed in a second chamber connected to the first chamber and having an array of coils; a pair of transfer units configured to move on at least one of the first planar motor and the second planar motor and configured to transfer a substrate; and a controller configured to control supply of electric current to the coils of the first planar motor and the second planar motor.

公开(公告)号：US20180366641A1

公开(公告)日：2018-12-20

申请号：US16008659

申请日：2018-06-14

Applicant: Tokyo Electron Limited

Inventor： Hiroki MAEHARA ,  Naoki WATANABE ,  Kanto NAKAMURA

IPC: H01L43/12 ,  H01L43/10

CPC classification number: H01L43/12 ,  H01L43/10

Abstract: A method for manufacturing a magnetoresistive element, includes: a first step of preparing a wafer including a first ferromagnetic layer and a first oxide layer provided directly on the first ferromagnetic layer; a second step of forming, after the first step, a second ferromagnetic layer directly on the first oxide layer; a third step of forming, after the second step, an absorbing layer directly on the second ferromagnetic layer; and a fourth step of crystallizing, after the third step, the second ferromagnetic layer by heat treatment. The second ferromagnetic layer contains boron, and the absorbing layer contains a material for absorbing boron from the second ferromagnetic layer by the heat treatment in the fourth step.

公开(公告)号：US20230183854A1

公开(公告)日：2023-06-15

申请号：US18074261

申请日：2022-12-02

Applicant: Tokyo Electron Limited

Inventor： Tatsuo HATANO ,  Naoki WATANABE

IPC: C23C14/34 ,  H01L21/683 ,  H01L21/687 ,  H01L21/02 ,  H01J37/32 ,  H01J37/34 ,  C23C14/35 ,  C23C14/50

CPC classification number: C23C14/3428 ,  H01L21/6831 ,  H01L21/68764 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/02631 ,  H01J37/32724 ,  H01J37/3244 ,  H01J37/3426 ,  C23C14/35 ,  C23C14/505 ,  H01J2237/002 ,  H01J2237/20214 ,  H01J2237/2007 ,  H01J2237/332

Abstract: A substrate processing apparatus includes: a tray provided in a vacuum processing container and having a recess that accommodates a target made of a low-melting-point material; a refrigerator that cools the tray; a substrate holder that holds a substrate; a reversal driver that reverses the position of the substrate holder upside down; and a rotation driver that rotates the substrate holder in a circumferential direction of the substrate.

公开(公告)号：US20230051865A1

公开(公告)日：2023-02-16

申请号：US17975619

申请日：2022-10-28

Applicant: Tokyo Electron Limited

Inventor： Takuya SEINO ,  Yasushi KODASHIMA ,  Naoki WATANABE ,  Hiroyuki TOSHIMA ,  Masato SHINADA ,  Tetsuya MIYASHITA

IPC: C23C14/56 ,  C23C14/50

Abstract: The PVD apparatus includes a chamber, a plurality of stages, a first target holder, a power supply mechanism, and a shield. The plurality of stages are provided inside the chamber, and each of the plurality of stages is configured to place at least one substrate on an upper surface thereof. The first target holder is configured to hold at least one target provided for one stage, the target being exposed to a space inside the chamber. The power supply mechanism supplies power to the target via the first target holder. The shield is provided inside the chamber and a part of the shield is disposed between a first stage and a second stage in the plurality of stages, and between a first processing space on the first stage and a second processing space on the second stage.

公开(公告)号：US20220016786A1

公开(公告)日：2022-01-20

申请号：US17371901

申请日：2021-07-09

Applicant: Tokyo Electron Limited

Inventor： Tatsuo HATANO ,  Naoki WATANABE

IPC: B25J11/00 ,  B25J19/00 ,  B25J21/00

Abstract: A vacuum transfer device includes: a main body including an arm unit with an internal mechanical part therein and a vacuum seal, and configured to transfer a high temperature substrate in a vacuum; a substrate holder connected to the main body to hold the substrate; a heat transport member provided on a surface of the main body and made of a material having a higher thermal conductivity than that of a material constituting the main body in a creeping direction to transport heat transferred from the substrate to the substrate holder; and a heat radiator configured to dissipate heat transported by the heat transport member.

公开(公告)号：US20200232090A1

公开(公告)日：2020-07-23

申请号：US16488217

申请日：2018-02-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroki MAEHARA ,  Naoki WATANABE ,  Toru ISHII ,  Kanto NAKAMURA ,  Makoto SAITO ,  David HURLEY ,  Ian COLGAN

IPC: C23C14/54 ,  H01L21/683 ,  H01L21/67 ,  H01L21/677 ,  H01L43/12 ,  C23C14/56 ,  C23C14/50 ,  C23C14/52

Abstract: A substrate processing device and a processing system process substrates each having a magnetic layer individually and are provided with: a support unit for supporting a substrate; a heating unit for heating the substrate supported on the support unit; a cooling unit for cooling the substrate supported on the support unit; a magnet unit for generating a magnetic field; and a processing chamber accommodating the support unit, the heating unit, and the cooling unit. The magnet unit includes a first and a second end surface which extend in parallel. The first and the second end surface are opposite to each other while being spaced apart from each other. The first end surface corresponds to a first magnetic pole of the magnet unit. The second end surface corresponds to a second magnetic pole of the magnet unit. The processing chamber is disposed between the first and the second end surface.

公开(公告)号：US20230377927A1

公开(公告)日：2023-11-23

申请号：US18230929

申请日：2023-08-07

Applicant: Tokyo Electron Limited

Inventor： Tatsuo HATANO ,  Tetsuya MIYASHITA ,  Naoki WATANABE ,  Naoyuki SUZUKI

IPC: H01L21/677 ,  B25J9/02 ,  B25J9/12 ,  B25J11/00 ,  H02K7/14 ,  H02K41/02

CPC classification number: H01L21/67742 ,  B25J9/02 ,  B25J9/12 ,  B25J11/0095 ,  H02K7/14 ,  H02K41/02 ,  H01L21/67167

Abstract: A substrate transfer apparatus includes: a planar motor provided in a transfer chamber and having coils arranged therein; a transfer unit movable on the planar motor; and a control unit configured to control an energization of the coils. The transfer unit includes two bases having magnets arranged thereon and configured to be movable on the planar motor, a substrate support member configured to support a substrate, and a link mechanism configured to connect the two bases and the substrate support member to each other.

公开(公告)号：US20220270866A1

公开(公告)日：2022-08-25

申请号：US17676411

申请日：2022-02-21

Applicant: Tokyo Electron Limited

Inventor： Tetsuya MIYASHITA ,  Naoki WATANABE

IPC: H01J37/34 ,  H01J37/32 ,  C23C14/35

Abstract: An apparatus for performing a sputtering process on a substrate includes: a processing container configured to accommodate a plurality of substrates; a plurality of stages provided inside the processing container to respectively place the plurality of substrates thereon and disposed to be arranged along a circle surrounding a preset center position; and a target disposed at a position above the stages to cause target particles to be emitted by plasma formed inside the processing container such that the target particles adhere to the substrates respectively placed on the stages, wherein the stages are arranged such that an emission region in which the target particles are emitted from the target and overlapping regions in which the substrates respectively placed on the stages overlap are arranged at positions that are rotationally symmetrical around the preset center position when viewed in a plan view from above the target.

公开(公告)号：US20220037181A1

公开(公告)日：2022-02-03

申请号：US17381813

申请日：2021-07-21

Applicant: Tokyo Electron Limited

Inventor： Tatsuo HATANO ,  Naoki WATANABE ,  Tetsuya MIYASHITA

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/683

Abstract: A vacuum transfer device configured to transfer a substrate in a vacuum includes: a flat motor including a body, a plurality of electromagnetic coils arrayed in the body, and a current controller that controls a current supplied to the electromagnetic coil; a transfer unit including a substrate holder configured to hold a substrate, and a base having a plurality of magnets arrayed therein and magnetically levitating from a surface of the body by a magnetic field generated by the electromagnetic coil, and move in a magnetically levitating state thereby moving the substrate holder; and a temperature controller configured to adjust temperature of at least a portion of the body. The temperature of the transfer unit is adjusted by stopping the magnetic levitation of the base by controlling the current supplied to the electromagnetic coil, and bringing the base into contact with a temperature-adjusted portion of the body.

公开(公告)号：US20200373133A1

公开(公告)日：2020-11-26

申请号：US16881693

申请日：2020-05-22

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tatsuo HATANO ,  Naoki WATANABE ,  Koji MAEDA

IPC: H01J37/32 ,  H01L21/687 ,  H01J37/34 ,  H01L43/12 ,  C23C14/34 ,  C23C14/50

Abstract: A stage device for holding a substrate in a processing apparatus for processing the substrate includes a stage, a stage rotating mechanism, and a cold heat transfer mechanism. The stage is configured to hold the substrate in a processing chamber. The stage rotating mechanism includes a rotation shaft extending downward from a center of a bottom surface of the stage and a motor configured to rotate the stage via the rotation shaft. The cold heat transfer mechanism includes at least one cold heat transfer body that is fixedly disposed at a position spaced away from the rotation shaft below the stage and is configured to transfer cold heat of a chiller. The cold heat transfer mechanism is disposed with a gap between the cold heat transfer mechanism and the stage.