Atomic layer deposition of noble metal oxides
    12.
    发明申请
    Atomic layer deposition of noble metal oxides 审中-公开
    原子层沉积贵金属氧化物

    公开(公告)号:US20070014919A1

    公开(公告)日:2007-01-18

    申请号:US11182734

    申请日:2005-07-15

    IPC分类号: C23C16/00

    CPC分类号: C23C16/40 C23C16/45525

    摘要: Electrically conductive noble metal oxide films can be deposited by atomic layer deposition (ALD)-type processes. In preferred embodiments, Re, Ru, Os and Ir oxides are deposited by alternately and sequentially contacting a substrate with vapor phase pulses of a noble metal precursor and an oxygen source. The noble metal precursor is preferably a betadiketonate compound and the oxygen source is preferably ozone or oxygen plasma. The deposition temperature may be less than about 200° C.

    摘要翻译: 导电性贵金属氧化物膜可以通过原子层沉积(ALD)型工艺沉积。 在优选的实施方案中,通过交替地和顺序地使基底与贵金属前体和氧源的气相脉冲接触来沉积Re,Ru,Os和Ir氧化物。 贵金属前体优选为betadiketonate化合物,氧源优选为臭氧或氧等离子体。 沉积温度可以低于约200℃