公开(公告)号：US08204816B2

公开(公告)日：2012-06-19

申请号：US13210588

申请日：2011-08-16

申请人： William Brodsky ,  William Speth

发明人： William Brodsky ,  William Speth

IPC分类号： G06Q40/00 ,  G06F19/00

CPC分类号： G06Q40/04 ,  G06Q20/10 ,  G06Q40/00 ,  G06Q40/06 ,  G06Q40/08

摘要： A method and system for creating a stock index for a group of investment management companies is disclosed. The method may include obtaining first trade information for each security representative of the group of investment management companies during a first time period, aggregating the first trade information for a predetermined time period, storing the aggregated first trade information, calculating from the aggregated first trade information an index for the group of investment management companies, determining a standardized measure of the index based on the aggregated first trade information obtained in the first time period, and periodically recalculating the index based on second trade information for each security representative of the group of investment management companies during a second time period.

摘要翻译： 披露了一批投资管理公司创建股票指数的方法和制度。 该方法可以包括在第一时间段期间为投资管理公司组的每个安全代表获取第一交易信息，将预定时间段内的第一交易信息聚合，存储聚合的第一交易信息，从汇总的第一交易信息 投资管理公司集团的指标，根据第一期获得的第一批交易信息确定标准化指标，并根据投资集团各证券代理人的第二交易信息定期重新计算指标 管理公司在第二时期。

公开(公告)号：US20080013294A1

公开(公告)日：2008-01-17

申请号：US11774967

申请日：2007-07-09

申请人： William Brodsky

发明人： William Brodsky

IPC分类号： H05K1/11

CPC分类号： H05K3/366 ,  H05K2201/10189 ,  H05K2201/10818

摘要： Electrically conductive L-shaped blades are disposed in an insulative body as a mechanism for mechanically and electrically connecting circuit cards to circuit boards. In particular, the interconnection device herein provides a mechanism for providing greater thermal and electrical properties for connections from voltage regulator modules to high current conducting planes within a printed wire board while at the same time increasing the available bulk material cross-sectional area available for current flow.

摘要翻译： 导电L形叶片设置在绝缘体中，作为将电路卡机械地和电连接到电路板的机构。 特别地，本文中的互连装置提供了一种机制，用于为印刷线路板内的电压调节器模块到高电流传导平面的连接提供更大的热和电特性，同时增加可用于电流的可用体积材料横截面积 流。

公开(公告)号：US20070224845A1

公开(公告)日：2007-09-27

申请号：US11386343

申请日：2006-03-22

申请人： Wiren Becker ,  William Brodsky ,  Evan Colgan ,  Michael McAllister ,  Edward Seminaro ,  John Torok

发明人： Wiren Becker ,  William Brodsky ,  Evan Colgan ,  Michael McAllister ,  Edward Seminaro ,  John Torok

IPC分类号： H01R12/00

CPC分类号： H01L23/49838 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/09701 ,  H05K1/141 ,  H05K3/325 ,  H05K3/368

摘要： Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.

摘要翻译： 提供的装置和方法用于构建使用LGA（地面栅格阵列）模块到板连接器的电子封装结构，其被设计为通过扩展LGA面积来提供更高计数的I / O互连，但不必增加芯片模块占用面积或减少 LGA插入器或电路板的面积阵列I / O触点的间距超出实际限制。

公开(公告)号：US20070134948A1

公开(公告)日：2007-06-14

申请号：US11297307

申请日：2005-12-08

申请人： William Brodsky ,  John Colbert ,  Roger Hamilton ,  Amanda Elisa Mikhail ,  Mark Plucinski

发明人： William Brodsky ,  John Colbert ,  Roger Hamilton ,  Amanda Elisa Mikhail ,  Mark Plucinski

IPC分类号： H01R12/00

CPC分类号： H01R13/2407 ,  H01R12/52 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49208

摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

公开(公告)号：US20060030197A1

公开(公告)日：2006-02-09

申请号：US11242228

申请日：2005-10-03

申请人： William Brodsky

发明人： William Brodsky

IPC分类号： H01R13/648

CPC分类号： H01L23/4006 ,  H01L23/562 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/72 ,  H01R12/714 ,  H01R13/6315 ,  H01R33/7664 ,  H01R33/975 ,  H05K3/325 ,  H05K2201/10378 ,  H05K2201/10719 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913

摘要： An electronic subassembly comprises a printed circuit board and an electronic module, particularly a ceramic module, electrically connected to one another through a planar interposer. The interposer comprises an insulator sheet and electrical spring elements joining contact sites on the module with contact pads on the PCB. The invention includes modifications that improve the integrity of electrical connections between the printed circuit board and the electronic module. This is achieved by compensating for non-planarity between the surfaces of the interposer and the module, particularly resulting from a convex curvature of the module, by minimizing relative movement, such as rocking in the x-z and y-z planes. It also includes modifications to the suspension of the module within the interposer housing to reduce the effects caused by any sliding that may occur between the interposer and the module in the x-y plane.

公开(公告)号：US20070226997A1

公开(公告)日：2007-10-04

申请号：US11760925

申请日：2007-06-11

申请人： William Brodsky ,  John Colbert ,  Roger Hamilton ,  Amanda Mikhail ,  Mark Plucinski

发明人： William Brodsky ,  John Colbert ,  Roger Hamilton ,  Amanda Mikhail ,  Mark Plucinski

IPC分类号： H01R43/00 ,  H05K3/36

CPC分类号： H01R13/2407 ,  H01R12/52 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49208

摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

摘要翻译： 一种使用通过保持膜捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置。 插入器包括具有从表面到表面延伸的两个表面和孔的非导电载体。 弹性线束设置在每个孔中。 非导电保持膜与载体的一个或两个表面相关联并且具有覆盖每个孔的孔口。 每个孔的宽度小于下面的孔的宽度，从而增强弹性线束在孔内的保持力。 一个或两个基板的引脚触点通过延伸穿过保持膜的孔并部分地穿过孔而与弹性线束电接触。 在一个实施例中，插入器是连接电子模块和印刷电路板（PCB）的平面栅格阵列（LGA）连接器。

公开(公告)号：US07197723B2

公开(公告)日：2007-03-27

申请号：US10953480

申请日：2004-09-29

申请人： Christopher P. Braun ,  William Brodsky ,  Gerard Joseph Krupka ,  William Perry Wilkinson ,  Thomas Allen Polk ,  Gregory Paul Van Allen ,  John M. Sosik ,  Evelyn E. Roadcap

发明人： Christopher P. Braun ,  William Brodsky ,  Gerard Joseph Krupka ,  William Perry Wilkinson ,  Thomas Allen Polk ,  Gregory Paul Van Allen ,  John M. Sosik ,  Evelyn E. Roadcap

IPC分类号： G06F17/50

CPC分类号： G06F17/50 ,  G06F2217/12 ,  Y02P90/265

摘要： In a system including a plurality of diverse semiconductor manufacturing facilities, each of the facilities having a respective manufacturing process requiring semiconductor specific design information in a corresponding diverse format, a method for supplying data to each of the facilities in an appropriate format includes establishing a database for each of the plurality of facilities, the database identifying the appropriate format for each of the facilities. The method also includes receiving semiconductor specific design information and converting the design information in accordance with the appropriate format for one of selected ones of the facilities. The method further includes providing a respective tapeout to said one of the selected ones of the facilities, each tapeout comprising the design information formatted in the appropriate format for the respective facility receiving the tapeout.

摘要翻译： 在包括多个不同的半导体制造设备的系统中，每个设备具有相应的制造过程，需要相应的不同格式的半导体特定设计信息，以适当格式向每个设施提供数据的方法包括建立数据库 对于多个设施中的每一个，数据库标识每个设施的适当格式。 该方法还包括接收半导体特定设计信息并根据所选择的设施之一的适当格式转换设计信息。 该方法还包括向所选择的一个设施中的所述一个提供相应的流标，每个流标包括用于接收流标的相应设施的适当格式格式化的设计信息。

公开(公告)号：US20070052111A1

公开(公告)日：2007-03-08

申请号：US11162389

申请日：2005-09-08

申请人： David Long ,  William Brodsky ,  Jason Miller ,  John Torok ,  Jeffrey Zitz

发明人： David Long ,  William Brodsky ,  Jason Miller ,  John Torok ,  Jeffrey Zitz

IPC分类号： H01L23/48

CPC分类号： H01L23/4093 ,  H01L23/16 ,  H01L2224/16 ,  H01L2224/32014 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/00

摘要： An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric structure is placed between the circuit board and the base member. The elastomeric structure has voids between a first defining plane adjacent the circuit board and a second defining plane adjacent the base member, with the voids adapted to permit local deformation of elastomeric material in the structure. The method includes applying a compressive force between the circuit board and base member to at least partially compressing the elastomeric structure to improve load equalization on the circuit board.

摘要翻译： 电子模块和组装电子模块的方法。 电路板通过连接器阵列连接到芯片基板，并且基座部件位于电路板的远离芯片基板和连接器阵列的一侧。 弹性体结构被放置在电路板和基底构件之间。 弹性体结构在邻近电路板的第一限定平面和邻近基底构件的第二限定平面之间具有空隙，空隙适于允许弹性材料在结构中的局部变形。 该方法包括在电路板和基底构件之间施加压缩力以至少部分地压缩弹性体结构以改善电路板上的负载均衡。

公开(公告)号：US20060199406A1

公开(公告)日：2006-09-07

申请号：US11381230

申请日：2006-05-02

申请人： William Brodsky

发明人： William Brodsky

IPC分类号： H01R4/58

CPC分类号： H05K3/4069 ,  B29C45/0013 ,  B29C45/14344 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K3/101 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2203/0113 ,  H01L2924/00

摘要： An interposer comprising a non-conductive carrier sheet with a pre-arranged pattern of conductive interconnect members positioned therethrough and formed from an elastomeric thermoplastic with suspended spherical and non-spherical conductive particles. The non-spherical conductive particles of the present invention are positioned, substantially perpendicularly to and partially through the contact faces of the interconnect member, thereby resulting in higher conductivity and efficiency. The interposer is formed by a mold comprising two sections with first and second sets of vias formed in the first and second mold sections, respectively, which permit the injected elastomer mixture to flow completely through the mold cavity and thereby aligns the non-spherical conductive particles. The exit side of the mold is further contacted by support posts of a separable mold interface creating a network of vent passages for venting of air and the elastomer mixture, resulting in less pressure within the mold and less mold flash.

摘要翻译： 一种插入器，其包括非导电载体片，其具有穿过其定位的导电互连构件的预先布置图案，并由具有悬浮的球形和非球形导电颗粒的弹性体热塑性材料形成。 本发明的非球形导电颗粒基本上垂直于并且部分地穿过互连构件的接触面，从而导致更高的导电性和效率。 插入件由包括两个部分的模具形成，该部分分别形成在第一和第二模具部分中的第一和第二组通孔，这允许注入的弹性体混合物完全流过模腔，从而使非球形导电颗粒 。 模具的出口侧通过可分离的模具接口的支撑柱进一步接触，形成用于排出空气和弹性体混合物的通风通道网络，导致模具内的压力较小并且模具闪光较少。

公开(公告)号：US20060166522A1

公开(公告)日：2006-07-27

申请号：US11043573

申请日：2005-01-26

申请人： William Brodsky ,  Amanda Mikhail

发明人： William Brodsky ,  Amanda Mikhail

IPC分类号： H01R12/00

CPC分类号： H01R13/2421

摘要： A contact assembly including an insulative carrier having a plurality of passages formed therein. A spring contact is positioned in the plurality of passages. The spring contact includes a helical spring and a contact plate affixed to one end of the helical spring. The contact plate has a plurality of portions extending away from the contact plate and extending away from the helical spring.