公开(公告)号：US20070224845A1

公开(公告)日：2007-09-27

申请号：US11386343

申请日：2006-03-22

申请人： Wiren Becker ,  William Brodsky ,  Evan Colgan ,  Michael McAllister ,  Edward Seminaro ,  John Torok

发明人： Wiren Becker ,  William Brodsky ,  Evan Colgan ,  Michael McAllister ,  Edward Seminaro ,  John Torok

IPC分类号： H01R12/00

CPC分类号： H01L23/49838 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/09701 ,  H05K1/141 ,  H05K3/325 ,  H05K3/368

摘要： Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.

摘要翻译： 提供的装置和方法用于构建使用LGA（地面栅格阵列）模块到板连接器的电子封装结构，其被设计为通过扩展LGA面积来提供更高计数的I / O互连，但不必增加芯片模块占用面积或减少 LGA插入器或电路板的面积阵列I / O触点的间距超出实际限制。

公开(公告)号：US20060260123A1

公开(公告)日：2006-11-23

申请号：US11414020

申请日：2006-04-28

申请人： Michael McAllister ,  John Torok

发明人： Michael McAllister ,  John Torok

IPC分类号： H05K3/10

CPC分类号： H05K3/225 ,  H05K1/0231 ,  H05K1/0292 ,  H05K1/141 ,  H05K3/321 ,  H05K2201/09309 ,  H05K2201/0959 ,  H05K2201/10378 ,  H05K2201/10719 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49718 ,  Y10T29/4973 ,  Y10T29/49737

摘要： A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both, using a removable and restorable engineering change plug.

摘要翻译： 使用柔性膜插入器增强了栅格阵列结构，不仅在多芯片模块（MCM）和下一级集成（例如系统板）之间提供了一个栅格阵列（LGA）电连接，而且提供了一个 可靠的手段来实现所需的工程变更（EC）能力，以及将功率与地面结构分离的手段，以最小化对系统的开关活动影响。 所描述的发明可以实现用于EC修复，用于电容去耦或两者，使用可拆卸和可恢复的工程更换插头。

公开(公告)号：US20070266420A1

公开(公告)日：2007-11-15

申请号：US11382971

申请日：2006-05-12

申请人： Jennifer Hawkins ,  Darshanand Khusial ,  Kelly Lyons ,  Michael McAllister ,  Jacob Slonim ,  Michael Smit

发明人： Jennifer Hawkins ,  Darshanand Khusial ,  Kelly Lyons ,  Michael McAllister ,  Jacob Slonim ,  Michael Smit

IPC分类号： H04L9/00

CPC分类号： G06F21/552 ,  G06F21/577 ,  G06Q10/10

摘要： Embodiments of the present invention address deficiencies of the art in respect to privacy compliance assessment for computer software and provide a method, system and computer program product for a privacy model framework for software applications. In one embodiment, a privacy modeling data processing system can be provided. The privacy modeling data processing system can include a modeling framework configured for communicative coupling to a software application. The modeling framework can capture information flows from requests to and responses from a coupled software application, and can rules-based process the captured information flows for privacy rules to generate a privacy compliance report for the software application.

摘要翻译： 本发明的实施例解决了关于计算机软件的隐私合规性评估的本领域的缺陷，并提供了用于软件应用的隐私模型框架的方法，系统和计算机程序产品。 在一个实施例中，可以提供隐私建模数据处理系统。 隐私建模数据处理系统可以包括被配置用于与软件应用程序的通信耦合的建模框架。 建模框架可以捕获来自耦合的软件应用程序的请求和响应的信息流，并且可以基于规则的处理捕获的信息流以进行隐私规则，以生成针对软件应用程序的隐私合规性报告。

公开(公告)号：US20070069754A1

公开(公告)日：2007-03-29

申请号：US11234986

申请日：2005-09-26

申请人： Michael McAllister ,  Harald Pross ,  Gerhard Ruehle ,  Wolfgang Scholz ,  Gerhard Schoor

发明人： Michael McAllister ,  Harald Pross ,  Gerhard Ruehle ,  Wolfgang Scholz ,  Gerhard Schoor

IPC分类号： G01R31/26

CPC分类号： H05K7/1061 ,  H05K1/0271 ,  H05K3/0058 ,  H05K3/325 ,  H05K2201/10719 ,  H05K2201/2009 ,  Y10T29/49126 ,  Y10T29/49128

摘要： A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

公开(公告)号：US5757079A

公开(公告)日：1998-05-26

申请号：US577677

申请日：1995-12-21

申请人： Michael McAllister ,  James McDonald ,  Eric Daniel Perfecto ,  Chandrika Prasad ,  Keshav Prasad ,  Gordon J. Robbins ,  Madhavan Swaminathan ,  George Eugene White

发明人： Michael McAllister ,  James McDonald ,  Eric Daniel Perfecto ,  Chandrika Prasad ,  Keshav Prasad ,  Gordon J. Robbins ,  Madhavan Swaminathan ,  George Eugene White

IPC分类号： H01L21/48 ,  H01L23/538 ,  H05K3/00 ,  H05K3/22 ,  H05K3/46 ,  H01L23/48 ,  H01L23/52 ,  H01L23/58 ,  H01L29/40

CPC分类号： H01L23/5382 ,  H01L21/485 ,  H05K3/225 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2203/162 ,  H05K3/0082 ,  H05K3/4644

摘要： A multi-layer thin film structure having defined repair lines thereon and a method for repairing interconnections in the multi-layer thin film structure (MLTF) and/or making engineering charges (EC) are provided. The method comprises determining any interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, using lithography, e.g., direct write expose technology, to define the top surface connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization and repair lines using additive or substractive metallization techniques.

摘要翻译： 提供了一种具有定义的修补线的多层薄膜结构和用于修复多层薄膜结构（MLTF）中的互连和/或制造工程电荷（EC）的方法。 该方法包括使用光刻技术（例如直接写入曝光技术）来确定在与结构的顶部金属层相邻的薄膜层处的MLTF中的任何互连缺陷，以限定修复互连所需的顶面连接和/或使EC ，并使用添加剂或阴极金属化技术形成顶表面金属化和修补线。

公开(公告)号：USD387807S

公开(公告)日：1997-12-16

申请号：US62453

申请日：1996-11-15

申请人： Michael McAllister

设计人： Michael McAllister

公开(公告)号：US5683064A

公开(公告)日：1997-11-04

申请号：US476813

申请日：1995-06-07

申请人： Stephan Copeland ,  Michael McAllister

发明人： Stephan Copeland ,  Michael McAllister

IPC分类号： A47B21/03 ,  F16M11/12 ,  F16M13/00

CPC分类号： A47B21/0314 ,  F16M11/08 ,  F16M11/2057 ,  F16M11/2064 ,  A47B2021/0321 ,  A47B2021/0335 ,  A47B2021/0342 ,  A47B2200/009 ,  A47B2210/15 ,  F16M2200/041 ,  F16M2200/044 ,  Y10S248/918 ,  Y10T403/32991

摘要： A movable support arm positions a surface platform for a keyboard, display monitor, pointing device, wrist support or the like relative to a base structure such as the underside of a desk top. Articulated members between a base member and the platform are coupled by joints having rotational couplings on two mutually perpendicular axes, forming universal joints. The joints have axially facing rotational engagement surfaces that can be splined or otherwise made engageable, and are displaceable toward and away from one another, the latter preferably by a spring coupling that is axially limited in extension. The rotational engagement surfaces resist rotation when engaged. A line such as a cable traverses the joints and normally applies tension via a spring, causing all the joints to lock and to hold the supporting platform at a given position and orientation. A manually operable control is provided to extend the length of the line and disengage all the joints simultaneously, whereupon the support platform can be moved freely to a new position anywhere in a three dimensional range, as well as tilted, etc. The control is released at the new position to again hold the platform in place. The line runs centrally through the joints. A counterbalance spring and line are displaced from the centerline, the cable winding around a horizontal one of the joints to vary tension on the spring for offsetting part of the weight of the support.

摘要翻译： 可移动支撑臂相对于诸如桌面的底面的基座结构定位用于键盘，显示监视器，指示装置，手腕支架等的表面平台。 基座部件与平台之间的铰接部件通过在两个相互垂直的轴线上具有旋转联轴器的接头联接，形成万向接头。 接头具有轴向面向的旋转接合表面，其可以花键化或以其它方式制造成可接合的，并且可以朝向和远离彼此移动，后者优选地通过延伸轴向限制的弹簧联接。 当接合时，旋转接合表面抵抗旋转。 诸如电缆的线穿过接头，并且通常通过弹簧施加张力，导致所有接头锁定并将支撑平台保持在给定的位置和方向。 提供手动操作的控制以延长线的长度并同时脱开所有接头，于是可将支撑平台自由移动到三维范围任何地方的新位置以及倾斜等。控制被释放 在新的位置上再次举办了平台。 线路通过关节中心运行。 平衡弹簧和线从中心线移开，电缆绕着水平的一个接头缠绕，以改变弹簧上的张力，以抵消支撑件的重量的一部分。

公开(公告)号：US20140124713A1

公开(公告)日：2014-05-08

申请号：US14008346

申请日：2012-03-29

申请人： Diptarka Majumdar ,  Hsien Ker ,  Philippe Schottland ,  Michael McAllister

发明人： Diptarka Majumdar ,  Hsien Ker ,  Philippe Schottland ,  Michael McAllister

IPC分类号： H01B1/22 ,  H01L29/45 ,  H05K1/09 ,  H01L31/0224

CPC分类号： H01B1/22 ,  H01L29/45 ,  H01L31/022425 ,  H05K1/092 ,  H05K1/097 ,  Y02E10/50

摘要： Provided are high-aspect ratio printable thick film metal paste compositions that can be deposited onto a substrate using, for example, screening printing techniques; and methods of preparing and using thick film printable metal pastes; and methods of screen printing of the thick film metal paste compositions onto a substrate to produce printed circuits, conductive lines or features on the substrate and/or a conductive surface on a solar cell device. Also provided are printed substrates containing an electronic feature produced by the high-aspect ratio printable thick film metal paste compositions.

摘要翻译： 提供了可以使用例如筛选印刷技术沉积到基底上的高纵横比可印刷的厚膜金属糊剂组合物; 以及制备和使用厚膜可印刷金属浆料的方法; 以及将厚膜金属糊剂组合物丝网印刷到基材上以在基板和/或太阳能电池装置上的导电表面上产生印刷电路，导电线或特征的方法。 还提供了包含由高纵横比可印刷的厚膜金属膏组合物制成的电子特征的印刷基板。

公开(公告)号：US20070069358A1

公开(公告)日：2007-03-29

申请号：US11234884

申请日：2005-09-26

申请人： Michael McAllister ,  Harald Pross ,  Gerhard Ruehle ,  Wolfgang Scholz ,  Gerhard Schoor

发明人： Michael McAllister ,  Harald Pross ,  Gerhard Ruehle ,  Wolfgang Scholz ,  Gerhard Schoor

IPC分类号： H01L23/24

CPC分类号： H05K1/0271 ,  H01L23/3737 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01075 ,  H01L2924/14 ,  H05K3/0058 ,  H05K3/325 ,  H05K2201/10719 ,  H05K2201/2009

摘要： A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

公开(公告)号：US5747095A

公开(公告)日：1998-05-05

申请号：US800945

申请日：1997-02-14

申请人： Michael McAllister ,  Eric Daniel Perfecto ,  James McDonald ,  Keshav Prasad ,  Gordon J. Robbins ,  Chandrika Prasad ,  Madhavan Swaminathan ,  George Eugene White

发明人： Michael McAllister ,  Eric Daniel Perfecto ,  James McDonald ,  Keshav Prasad ,  Gordon J. Robbins ,  Chandrika Prasad ,  Madhavan Swaminathan ,  George Eugene White

IPC分类号： H01L21/48 ,  H01L23/538 ,  H05K3/00 ,  H05K3/22 ,  H05K3/46 ,  B05D5/12

CPC分类号： H01L23/5382 ,  H01L21/485 ,  H05K3/225 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2203/162 ,  H05K3/0082 ,  H05K3/4644

摘要： A multi-layer thin film structure having defined repair lines thereon and a method for repairing interconnections in the multi-layer thin film structure (MLTF) and/or making engineering charges (EC) are provided. The method comprises determining any interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, using lithography, e.g., direct write expose technology, to define the top surface connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization and repair lines using additive or substractive metallization techniques.

摘要翻译： 提供了一种具有定义的修补线的多层薄膜结构和用于修复多层薄膜结构（MLTF）中的互连和/或制造工程电荷（EC）的方法。 该方法包括使用光刻技术（例如直接写入曝光技术）来确定在与结构的顶部金属层相邻的薄膜层处的MLTF中的任何互连缺陷，以限定修复互连所需的顶面连接和/或使EC ，并使用添加剂或阴极金属化技术形成顶表面金属化和修补线。