公开(公告)号：US20090014843A1

公开(公告)日：2009-01-15

申请号：US12133828

申请日：2008-06-05

申请人： Michihiro KAWASHITA ,  Yasuhiro Yoshimura ,  Naotaka Tanaka ,  Takahiro Naito ,  Takashi Akazawa

发明人： Michihiro KAWASHITA ,  Yasuhiro Yoshimura ,  Naotaka Tanaka ,  Takahiro Naito ,  Takashi Akazawa

IPC分类号： H01L23/52 ,  H01L21/60 ,  H01L21/4763

CPC分类号： H01L21/76898 ,  H01L21/6835 ,  H01L24/05 ,  H01L24/90 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05553 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/90 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/05042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05552

摘要： A through silicon via reaching a pad from a second surface of a semiconductor substrate is formed. A penetration space in the through silicon via is formed of a first hole and a second hole with a diameter smaller than that of the first hole. The first hole is formed from the second surface of the semiconductor substrate to the middle of the interlayer insulating film. Further, the second hole reaching the pad from the bottom of the first hole is formed. Then, the interlayer insulating film formed on the first surface of the semiconductor substrate has a step shape reflecting a step difference between the bottom surface of the first hole and the first surface of the semiconductor substrate. More specifically, the thickness of the interlayer insulating film between the bottom surface of the first hole and the pad is smaller than that in other portions.

摘要翻译： 形成从半导体衬底的第二表面到达焊盘的通硅。 贯穿硅通孔中的穿透空间由直径小于第一孔直径的第一孔和第二孔形成。 第一孔由半导体衬底的第二表面到层间绝缘膜的中间形成。 此外，形成从第一孔的底部到达垫的第二孔。 然后，形成在半导体衬底的第一表面上的层间绝缘膜具有反映第一孔的底表面和半导体衬底的第一表面之间的台阶差的台阶形状。 更具体地说，第一孔的底表面和垫之间的层间绝缘膜的厚度小于其它部分的厚度。

公开(公告)号：US07226150B2

公开(公告)日：2007-06-05

申请号：US10890261

申请日：2004-07-14

申请人： Yasuhiro Yoshimura ,  Jun Nagata ,  Osamu Machida ,  Tatsuya Nagata

发明人： Yasuhiro Yoshimura ,  Jun Nagata ,  Osamu Machida ,  Tatsuya Nagata

IPC分类号： B41J2/045

CPC分类号： B41J2/14274 ,  B41J2002/14419

摘要： An inkjet head is provided and includes: a chamber substrate for forming an ink flow passage; a diaphragm substrate including a diaphragm for pressurizing a pressure chamber disposed in the chamber substrate; and a nozzle substrate for jetting ink pressurized by the diaphragm, wherein the diaphragm substrate is made of silicon, the diaphragm is made of a material selected from the group of silicon oxide film and metal film, and the diaphragm is formed in the diaphragm substrate. A method of manufacturing the inkjet head is also provided.

摘要翻译： 提供一种喷墨头，包括：用于形成油墨流动通道的室基板; 膜片基板，包括用于对设置在所述室基板中的压力室进行加压的隔膜; 以及用于喷射由所述隔膜加压的墨的喷嘴基板，其中所述隔膜基板由硅制成，所述隔膜由选自氧化硅膜和金属膜的材料制成，并且所述隔膜形成在所述隔膜基板中。 还提供了制造喷墨头的方法。

公开(公告)号：US20060088327A1

公开(公告)日：2006-04-27

申请号：US11254706

申请日：2005-10-21

申请人： Takahiro Nakase ,  Yasuo Nami ,  Naoyuki Yamamoto ,  Hitoshi Suzuki ,  Toshiharu Kondo ,  Yasuhiro Yoshimura

发明人： Takahiro Nakase ,  Yasuo Nami ,  Naoyuki Yamamoto ,  Hitoshi Suzuki ,  Toshiharu Kondo ,  Yasuhiro Yoshimura

IPC分类号： G03G15/20

CPC分类号： H05B6/02 ,  G03G15/2042 ,  G03G15/2053

摘要： An image heating apparatus includes a coil for generating a magnetic flux by a current flowing therethrough; an image heating member having an electroconductive layer in which an eddy current is produced by the magnetic flux by which heat is generated, the image heating member being effective to heat an image on a recording material; an electroconductive magnetic flux adjusting member movable from a first position and a second position to decrease the eddy current produced in the image heating member by the magnetic flux; a temperature sensor for sensing a temperature of image heating member; electric power control means for control electric power supplied to the coil on the basis of an output of the temperature sensor, wherein the electric power control means changes an electric power condition to be supplied to the coil before start of the movement from the first position to the second position of magnetic flux adjusting member.

摘要翻译： 图像加热装置包括用于通过流过其中的电流产生磁通量的线圈; 具有导电层的图像加热构件，其中通过产生热量的磁通产生涡流，所述图像加热构件有效地加热记录材料上的图像; 导电磁通调节构件，其从第一位置和第二位置移动，以通过磁通减少图像加热构件中产生的涡流; 用于感测图像加热部件的温度的温度传感器; 电力控制装置，用于根据温度传感器的输出控制提供给线圈的电力，其中电力控制装置将开始运动前的线圈的电力状况从第一位置改变为 磁通量调节构件的第二位置。

公开(公告)号：US06283730B1

公开(公告)日：2001-09-04

申请号：US09441230

申请日：1999-11-16

申请人： Yasuhiko Sasaki ,  Yasuhiro Yoshimura ,  Akira Koide ,  Ryo Miyake ,  Naruo Watanabe ,  Takao Terayama ,  Hiroshi Mitsumaki ,  Yasuhiko Ishida ,  Tomonari Morioka

发明人： Yasuhiko Sasaki ,  Yasuhiro Yoshimura ,  Akira Koide ,  Ryo Miyake ,  Naruo Watanabe ,  Takao Terayama ,  Hiroshi Mitsumaki ,  Yasuhiko Ishida ,  Tomonari Morioka

IPC分类号： F04B1700

CPC分类号： F04B43/043

摘要： A micro pump is made compact and can prevent members constituting the micro pump from being chemically reacted with a working fluid, and a method of producing the same. After each of substrates constituting the micro pump is formed by a member containing a silicone as a main composition and a plurality of metal membranes are formed on a whole of a bonding surface of each of the substrates so as to form bonding surfaces, the bonding surfaces are cleaned, and the bonding surfaces are opposed to each other under a vacuum condition, overlapped, heated and pressed so as to be bonded. The valve portion has a beam and a protrusion for sealing as provided in the valve side, whereby a pressure applied to the protrusion becomes smaller than the bonding pressure.

摘要翻译： 微型泵制造紧凑，并且可以防止构成微型泵的构件与工作流体发生化学反应，及其制造方法。 在构成微型泵的基板的每一个由含有硅酮作为主要成分的构件形成，并且在每个基板的整个接合表面上形成多个金属膜以形成接合表面， 被清洁，并且粘合表面在真空条件下彼此相对，重叠，加热和压制以便粘合。 阀部具有设置在阀侧的梁和用于密封的突起，由此施加到突起的压力变得小于接合压力。

公开(公告)号：US06249403B1

公开(公告)日：2001-06-19

申请号：US09080417

申请日：1998-05-18

申请人： Hiromitsu Tokisue ,  Sunao Yonekawa ,  Nobuyuki Ishii ,  Yasuyuki Horiguchi ,  Yoshishige Endo ,  Yasuhiro Yoshimura ,  Yutaka Ito ,  Osamu Narisawa ,  Hiroshi Yuyama ,  Youichi Inoue ,  Yukiko Ikeda

发明人： Hiromitsu Tokisue ,  Sunao Yonekawa ,  Nobuyuki Ishii ,  Yasuyuki Horiguchi ,  Yoshishige Endo ,  Yasuhiro Yoshimura ,  Yutaka Ito ,  Osamu Narisawa ,  Hiroshi Yuyama ,  Youichi Inoue ,  Yukiko Ikeda

IPC分类号： G11B5255

CPC分类号： G11B5/6005 ,  G11B5/10 ,  G11B5/40 ,  G11B5/41

摘要： A magnetic hard disk drive comprising a magnetic disk and a magnetic head slider, characterized in that said magnetic head slider is coated with a layer having a contact angle of 50° or more when measured by using a lubricant coated on the magnetic disk, is free from start failure due to stiction caused by adhesion of the lubricant to the slider surface.

公开(公告)号：US08816506B2

公开(公告)日：2014-08-26

申请号：US13340165

申请日：2011-12-29

申请人： Michihiro Kawashita ,  Yasuhiro Yoshimura ,  Naotaka Tanaka ,  Takahiro Naito ,  Takashi Akazawa

发明人： Michihiro Kawashita ,  Yasuhiro Yoshimura ,  Naotaka Tanaka ,  Takahiro Naito ,  Takashi Akazawa

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L25/0657 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/5386 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/81 ,  H01L24/94 ,  H01L25/074 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/06181 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/13009 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16058 ,  H01L2224/16112 ,  H01L2224/16146 ,  H01L2224/274 ,  H01L2224/81136 ,  H01L2224/81345 ,  H01L2224/81365 ,  H01L2224/81801 ,  H01L2224/81898 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1205 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/1451 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/35121 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

摘要： In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode.

摘要翻译： 在层叠多个半导体芯片的半导体装置中，不会降低生产率而提高性能。 半导体器件具有多个元件，层间绝缘膜，焊盘和与依次形成在硅基板的主表面上的焊盘电连接的凸块电极，并且具有形成在硅衬底的背面上的背面电极 硅基板并与凸块电极电连接。 凸块电极具有贯穿焊盘并朝向硅衬底侧突出的突出部分。 背面电极形成为从硅衬底的背面侧朝向主面侧到达突起电极的突出部，并覆盖未到达的背面电极孔部的内侧 垫，使得背面电极与凸块电极电连接。

公开(公告)号：US20120320417A1

公开(公告)日：2012-12-20

申请号：US13478473

申请日：2012-05-23

申请人： Yasuhiro Yoshimura ,  Naohiro Isobe

发明人： Yasuhiro Yoshimura ,  Naohiro Isobe

IPC分类号： G06K15/02

CPC分类号： G06F3/1205 ,  G06F3/1243 ,  G06F3/1245 ,  G06F3/1285

摘要： An information processing apparatus includes a control unit configured to receive first PDL data including a first bookmark and a second bookmark from a user, create a first node mapped to a page which is the reference of the first bookmark and a second node mapped to a page which is the reference of the second bookmark, and create second PDL data having a hierarchical structure for the pages by including the first node and the second node. The first bookmark is different from the second bookmark, the first node is different from the second node, and the first PDL data is different from the second PDL data wherein the second PDL data includes the page which is the reference of the first bookmark and the page which is the reference of the second bookmark.

摘要翻译： 信息处理装置包括：控制单元，被配置为从用户接收包括第一书签和第二书签的第一PDL数据，创建映射到作为第一书签的引用的页面的第一节点和映射到页面的第二节点 其是第二书签的参考，并且通过包括第一节点和第二节点来创建具有用于页面的分层结构的第二PDL数据。 第一书签与第二书签不同，第一节点与第二节点不同，并且第一PDL数据与第二PDL数据不同，其中第二PDL数据包括作为第一书签的引用的页和 页面是第二个书签的参考。

公开(公告)号：US08178977B2

公开(公告)日：2012-05-15

申请号：US12483751

申请日：2009-06-12

申请人： Michihiro Kawashita ,  Yasuhiro Yoshimura ,  Naotaka Tanaka ,  Takahiro Naito ,  Takashi Akazawa

发明人： Michihiro Kawashita ,  Yasuhiro Yoshimura ,  Naotaka Tanaka ,  Takahiro Naito ,  Takashi Akazawa

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05553 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/05552

摘要： When a through-hole electrode and a rear-surface wire are formed on a rear surface of a chip, a convex portion is formed on the rear surface of the chip due to a rear-surface wiring pad which is a part of the through-hole electrode and the rear-surface wire. This causes the air leakage when the chip is sucked, and therefore, the reduction of the sucking force of the chip occurs. A concave portion is formed in advance in a region where a rear-surface wiring pad and a rear-surface wire are formed. The rear-surface wiring pad and the rear-surface wire are provided inside the concave portion. Thus, a flatness of the rear surface of the chip is ensured by a convex portion caused by thicknesses of the rear-surface wiring pad and the rear-surface wire, so that the reduction of the sucking force does not occur when the chip is handled.

摘要翻译： 当在芯片的后表面上形成通孔电极和后表面线时，由于作为通孔的一部分的后表面布线板，在芯片的后表面上形成凸部， 孔电极和后表面电线。 这导致当芯片被吸入时的空气泄漏，因此发生芯片的吸力的降低。 预先在形成背面布线衬垫和背面导线的区域中形成凹部。 后表面布线板和后表面布线设置在凹部内。 因此，通过由背面布线衬垫和后表面线的厚度引起的凸部来确保芯片的后表面的平坦度，使得当处理芯片时不会发生吸力的降低 。

公开(公告)号：US20110071396A1

公开(公告)日：2011-03-24

申请号：US12992683

申请日：2009-05-13

申请人： Shuzo Sano ,  Yasuhiro Yoshimura ,  Tatsuya Nagata ,  Makoto Fukada ,  Akifumi Sako

发明人： Shuzo Sano ,  Yasuhiro Yoshimura ,  Tatsuya Nagata ,  Makoto Fukada ,  Akifumi Sako

IPC分类号： A61B8/14 ,  G10K9/12 ,  H04R31/00

CPC分类号： B06B1/0292 ,  A61B8/06 ,  A61B8/13 ,  A61B8/4455 ,  G01N29/2406 ,  Y10T29/49005

摘要： An ultrasonic probe is provided with a CMUT chip having a plurality of transducer elements that change electromechanical coupling coefficients or sensitivities in accordance with a bias voltage to transmit and receive ultrasonic waves, an electric conducting layer formed on the ultrasonic irradiation side of the CMUT chip, an acoustic lens arranged on the ultrasonic irradiation side of the CMUT chip, an insulating layer formed in the direction opposite to the ultrasonic irradiation side of the acoustic lens, a housing unit that stores the CMUT chip in which the electric conducting layer and the insulating layer are fixed with an adhesive and the acoustic lens, wherein the insulating layer is formed by the material that includes at least either silicon oxide or paraxylene to prevent a solvent of the adhesive from soaking into the adhered portion.

摘要翻译： 超声波探头设置有具有多个换能器元件的CMUT芯片，该多个换能器元件根据用于发送和接收超声波的偏置电压来改变机电耦合系数或灵敏度，形成在CMUT芯片的超声照射侧上的导电层， 布置在CMUT芯片的超声波照射侧的声透镜，与声透镜的超声波照射侧相反的方向形成的绝缘层，存储CMUT芯片的壳体单元，其中导电层和绝缘层 用粘合剂和声透镜固定，其中绝缘层由至少包含氧化硅或对二甲苯的材料形成，以防止粘合剂的溶剂浸入粘附部分。

公开(公告)号：US07689136B2

公开(公告)日：2010-03-30

申请号：US11252609

申请日：2005-10-19

申请人： Takahiro Nakase ,  Naoyuki Yamamoto ,  Hitoshi Suzuki ,  Toshiharu Kondo ,  Yasuhiro Yoshimura

发明人： Takahiro Nakase ,  Naoyuki Yamamoto ,  Hitoshi Suzuki ,  Toshiharu Kondo ,  Yasuhiro Yoshimura

IPC分类号： G03G15/00

CPC分类号： G03G15/50 ,  G03G21/203

摘要： The present invention aims to reduce the time period of the start up operation of an image forming apparatus corresponding to an image forming apparatus operating environment. The present invention provides an image forming apparatus includes an image bearing member; a toner image forming unit for forming a toner image on the image bearing member; an image condition detection member for detecting an image condition of the image bearing member; a setting unit for setting a plurality of toner image forming conditions determined based on the output of the image condition detection member; an environment detection member for detecting an environment condition of outside air of the image forming apparatus; and a selection unit for selecting the toner image forming conditions set by the setting unit based on the output of the environment detection device from when the power is turned on to when transitioned to an image formable state.

摘要翻译： 本发明旨在减少对应于图像形成装置操作环境的图像形成装置的启动操作的时间段。 本发明提供一种图像形成装置，包括：图像承载部件; 调色剂图像形成单元，用于在图像承载部件上形成调色剂图像; 图像条件检测部件，用于检测图像承载部件的图像状态; 设置单元，用于设置基于图像条件检测构件的输出确定的多个调色剂图像形成条件; 环境检测构件，用于检测图像形成装置的外部空气的环境状况; 以及选择单元，用于基于环境检测装置的输出从打开电源到转换到可形成图像状态时选择由设置单元设置的调色剂图像形成条件。