摘要:
An isolation insulating film (5) of partial-trench type is selectively formed in an upper surface of a silicon layer (4). A power supply line (21) is formed above the isolation insulating film (5). Below the power supply line (21), a complete isolation portion (23) reaching an upper surface of an insulating film (3) is formed in the isolation insulating film (5). In other words, a semiconductor device comprises a complete-isolation insulating film which is so formed as to extend from the upper surface of the silicon layer (4) and reach the upper surface of insulating film (3) below the power supply line (21). With this structure, it is possible to obtain the semiconductor device capable of suppressing variation in potential of a body region caused by variation in potential of the power supply line.
摘要:
A semiconductor device including a transistor having an SOI structure the operating speed of which is not affected is provided. A MOS transistor having the SOI structure is formed which satisfies R·C·f
摘要:
The present invention is to provide a process for producing a composite of an aluminum material and a synthetic resin molding that can be produced at a high efficiency and to provide a stable and fast composite that is large in a peel strength and a mechanical strength. The process for producing a composite according to the present invention is characterized in that an aluminum raw material is oxidized in an electrolytic bath of phosphoric acid or sodium hydride, thereby an anodic oxidation coating provided with innumerable pores 3 having a diameter of 25 nm or more made open in the surface thereof is formed thereon, and a synthetic resin mold 6 is coupled with the anodic oxidation coating 2 in such a condition that the part 6a thereof is intruded in the innumerable pores.
摘要:
An electric drive control apparatus which prevents the voltage from being saturated and does not cause the driver to feel uncomfortable during driving. The electric drive control apparatus includes an electrically operated machine, an instruction value calculation processing unit that calculates an instruction value based on a target electrically operated machine torque and on the rotational speed of the electrically operated machine, an output signal calculation processing unit that calculates an output signal based on the instruction value, a current generating unit that generates a current based on the output signal and supplies the current to the electrically operated machine, a change-in-the-voltage-saturation calculation processing unit that calculates a change in the voltage saturation that varies depending upon the degree of occurrence of the voltage saturation accompanying the drive of the electrically operated machine, and a change-in-the-control-quantity correction processing unit correcting a magnetic pole position depending upon the change in the voltage saturation.
摘要:
A semiconductor device includes a semiconductor layer, a plurality of semiconductor elements formed on the semiconductor layer, and an isolation film provided in a surface of the semiconductor layer, semiconductor elements being electrically isolated from each other by the isolation film. The semiconductor device also includes a PN junction portion provided under the isolation film and formed by two semiconductor regions of different conductivity types in the semiconductor layer. The isolation film includes a nitride film provided in a position corresponding to a top of the PN junction portion and has a substantially uniform thickness across the two semiconductor regions and an upper oxide film and a lower oxide film which are provided in upper and lower portions of the nitride film. The surface of the semiconductor layer is silicidized in such a state that a surface of the isolation film is exposed.
摘要:
To improve the radiation property without inhibiting miniaturization of the device, heat generated at a heat generating layer (5) is radiated to a substrate (1) via plugs (7, 17), wiring layers (8, 18), and plugs (9, 19). A cross sectional along the principal plane of the substrate (1) of the plugs (7, 9, 17, 19) is set to be a rectangle, and the long sides of the rectangle are parallel to the direction perpendicular to the direction connecting one end and the other end of the heat generating layer (5). Between the plugs (9, 19) and the semiconductor layer (2) is interposed n-type semiconductor layers (3, 13).
摘要:
A motor has a rotatably supported rotor core and permanent magnets disposed at equal intervals at a plurality of positions in a circumferential direction of the rotor core. The rotor core has projecting poles formed at equal intervals at a center between each permanent magnet. Furthermore, an opening angle center line of each projecting pole conforms to a center line of an angle created by each opening angle center line of two adjacent permanent magnets. Additionally, each projecting pole is shaped asymmetrical to a line connecting a center of the projecting pole in the rotational direction of the rotor core and an axis center of the rotor core.
摘要:
According to a semiconductor device of the present invention, a field oxide film is formed so as to cover the main surface of an SOI layer and to reach the main surface of a buried oxide film. As a result, a pMOS active region of the SOI and an nMOS active region of the SOI can be electrically isolated completely. Therefore, latchup can be prevented completely. As a result, it is possible to provide a semiconductor device using an SOI substrate which can implement high integration by eliminating reduction of the breakdown voltage between source and drain, which was a problem of a conventional SOI field effect transistor, as well as by efficiently disposing a body contact region, which hampers high integration, and a method of manufacturing the same.
摘要:
A sealing material in a plate form is placed on a frame wherein a recess is provided. A semiconductor chip and the frame are overlapped via the sealing material in a plate form within a thermostatic chamber of which the temperature is higher than the temperature at the time of the sealing of the semiconductor chip and the frame in a resin. After that, the semiconductor chip and the frame, which overlap each other, are taken out of the thermostatic chamber so as to be cooled down in the atmosphere. After that, they are sealed in a molding resin. The semiconductor chip is secured to the frame due to the differential pressure (negative pressure) between the pressure within the airtight space and atmospheric pressure. Thereby, a resin mold semiconductor device is gained wherein a semiconductor chip is secured to a frame without using a die bonding material.
摘要:
A semiconductor device in which parasitic resistance of source/drain regions can be reduced than the parasitic resistance of the drain region, and manufacturing method thereof, can be obtained. In the semiconductor device, inactivating ions are implanted only to the source region of the semiconductor layer, so as to damage the crystal near the surface of the semiconductor layer, whereby siliciding reaction is promoted. Therefore, in the source region, a titanium silicide film which is thicker can be formed.