公开(公告)号：US20090022949A1

公开(公告)日：2009-01-22

申请号：US12086152

申请日：2006-11-28

申请人： Yoshihito Horita ,  Shiyuki Kanisawa ,  Takahiro Asada ,  Yoshihiro Yoneda

发明人： Yoshihito Horita ,  Shiyuki Kanisawa ,  Takahiro Asada ,  Yoshihiro Yoneda

IPC分类号： B32B3/10 ,  B05D5/06 ,  C08F2/48 ,  B31B1/60

CPC分类号： H01L21/56 ,  B81B7/0067 ,  B81C2203/0109 ,  B81C2203/032 ,  H01L23/24 ,  H01L24/48 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/16195 ,  H01L2924/1815 ,  Y10T156/10 ,  Y10T428/24273 ,  Y10T428/24331 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Opposed to a substrate (2) having a functional element (1) with a functional portion (1a) mounted thereon, there is disposed a resin sealing plate (3) provided with an opening (3a) corresponding to the functional portion (1a) of the functional element (1) with a given spacing therebetween. Impregnation and filling of a sealing resin (5) in the spacing between the substrate (2) and the resin sealing plate (3) are carried out by the use of the capillary phenomenon. Thus, resin sealing of the functional element (1) can be realized without damaging to the function of the functional portion (1a).

摘要翻译： 与具有安装有功能部分（1a）的功能元件（1）的基板（2）相对，设置有树脂密封板（3），其具有与功能部分（1a）对应的开口（3a） 功能元件（1）之间具有给定的间隔。 通过使用毛细管现象，进行衬底（2）和树脂密封板（3）之间的间隔中的密封树脂（5）的浸渍和填充。 因此，可以实现功能元件（1）的树脂密封，而不损害功能部分（1a）的功能。

公开(公告)号：US20080311707A1

公开(公告)日：2008-12-18

申请号：US12222437

申请日：2008-08-08

申请人： Yoshihiro Yoneda ,  Takahiro Asada

发明人： Yoshihiro Yoneda ,  Takahiro Asada

IPC分类号： H01L21/00

CPC分类号： H01L31/0203 ,  H01L23/3185 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/8592 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01S5/005 ,  H01S5/02216 ,  H01S5/02228 ,  H01S5/02296 ,  H01S5/32341 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present disclosure provides an optical functional device-mounted module which needs no expensive or special members, can be reduced in size, and provide a producing process thereof. A bank to dam a liquid sealing resin is provided on a substrate around an optical functional device, the substrate being formed with a predetermined wiring pattern and having the optical functional device mounted thereon. The liquid sealing resin is filled between the functional device and the bank by dropping the liquid sealing resin therebetween. A package component member having a light transmission hole corresponding to an optical function part of the optical functional device is brought into contact with the bank such that the light transmission hole is opposed to the function part of the optical functional device, thereby causing the package component member to contact with the liquid sealing resin. The package component member is fixed onto the substrate by curing the liquid sealing resin and the bank is finally cut off and removed.

摘要翻译： 本公开提供了一种不需要昂贵或特殊构件的光学功能装置安装模块，可以减小尺寸并提供其制造方法。 在光学功能器件周围的基板上设置有用于防止液体密封树脂的堤坝，该基板由预定的布线图案形成并且安装有光学功能元件。 液体密封树脂通过在其间滴落液体密封树脂而填充在功能元件和堤岸之间。 具有与光功能元件的光学功能部分相对应的透光孔的封装部件与堤相接触，使得透光孔与光功能元件的功能部分相对，从而使封装元件 与液体密封树脂接触的部件。 通过固化液体密封树脂将封装构件部件固定在基板上，最后切断并移除堤岸。

公开(公告)号：US20130044402A1

公开(公告)日：2013-02-21

申请号：US13578865

申请日：2010-12-29

申请人： Koichi Mukai ,  Masahiko Ishimaru ,  Takahiro Asada ,  Chisato Komori ,  Yoshihiro Yoneda ,  Yuuji Kimura ,  Shoko Nagaki

发明人： Koichi Mukai ,  Masahiko Ishimaru ,  Takahiro Asada ,  Chisato Komori ,  Yoshihiro Yoneda ,  Yuuji Kimura ,  Shoko Nagaki

IPC分类号： H02H5/04

CPC分类号： H01M2/348 ,  H01M10/0525 ,  H01M10/443 ,  H01M10/48 ,  H02H7/18 ,  H02J7/0031 ,  Y02E60/12

摘要： A protective circuit capable of coping with broad voltage variations of a battery unit to interrupt its charging/discharging current path as damages to the heating unit are prevented from occurrence is disclosed. The protective circuit includes fuses, connected to a charging/discharging current path in series between a battery unit and a charging/discharging control circuit, and a heating unit composed by a series connection of resistors. One of two ends of the resistor which is not connected to the peer resistor is connected to a current path of the fuses. The ends of the resistors not connected to the fuses, are provided with a plurality of terminals selected for connection to a current control element that controls the current flowing through the heating unit, as a range of voltage variations of the battery unit is taken into account.

摘要翻译： 公开了一种能够应对电池单元的宽电压变化以防止其充电/放电电流路径作为对加热单元的损坏的保护电路。 保护电路包括连接到电池单元和充电/放电控制电路之间串联的充电/放电电流路径的熔断器和由电阻器的串联连接构成的加热单元。 未连接到对等电阻的电阻的两端之一连接到保险丝的当前路径。 未连接到保险丝的电阻器的端部设置有多个端子，其被选择用于连接到控制流过加热单元的电流的电流控制元件，因为电池单元的电压变化的范围被考虑 。

公开(公告)号：US09401969B2

公开(公告)日：2016-07-26

申请号：US13065215

申请日：2011-03-16

申请人： Yoshihiro Yoneda ,  Naoki Miyabayashi

发明人： Yoshihiro Yoneda ,  Naoki Miyabayashi

IPC分类号： H04B5/00 ,  H04L29/08

CPC分类号： H04L67/303 ,  H04L67/14 ,  H04L67/34

摘要： A system and method for information processing is provided. In an embodiment of the present system and method, a connection target apparatus is detected at an information processing apparatus. Upon detection, the information processing apparatus generates apparatus information and transmits the apparatus information to a server via a communication path. Based on the apparatus information, the server generates connection information and transmits the connection information to the information processing apparatus. The information processing apparatus may use the connection information to establish communication with the connection target apparatus via another communication path.

摘要翻译： 提供了一种用于信息处理的系统和方法。 在本系统和方法的实施例中，在信息处理装置处检测连接目标装置。 检测时，信息处理装置生成装置信息，并通过通信路径将装置信息发送到服务器。 基于设备信息，服务器生成连接信息，并将连接信息发送到信息处理设备。 信息处理装置可以使用连接信息，经由另一通信路径与连接对象装置建立通信。

公开(公告)号：US09396477B2

公开(公告)日：2016-07-19

申请号：US13463457

申请日：2012-05-03

申请人： Isao Soma ,  Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Kazuo Takada

发明人： Isao Soma ,  Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Kazuo Takada

IPC分类号： G06Q30/02 ,  H04W88/04

CPC分类号： H04W88/04 ,  G06Q30/02 ,  H04W4/80 ,  H04W76/14 ,  H04W76/30

摘要： There is provided an information processing system including a service provider unit, a communication terminal and an information processing unit. The communication terminal includes a terminal first communication section, a terminal second communication section to communicate with the information processing unit through a first communication channel, a terminal third communication section to communicate with the information processing unit through a second communication channel, and a terminal communication control section. The information processing unit includes a unit first communication section to communicate with the communication terminal through the first communication channel, a unit second communication section to communicate with the communication terminal through the second communication channel, a unit communication control section to switch communication channels with the communication terminal from the first communication channel to the second communication channel, and a unit processing section to perform service processing with the service provider unit.

摘要翻译： 提供了一种包括服务提供商单元，通信终端和信息处理单元的信息处理系统。 通信终端包括终端第一通信部，通过第一通信信道与信息处理部通信的终端第二通信部，通过第二通信信道与信息处理部通信的终端第三通信部，以及终端通信 控制部分。 信息处理单元包括通过第一通信信道与通信终端进行通信的单元第一通信部，通过第二通信信道与通信终端通信的单位第二通信部，与通信终端通过第二通信信道进行通信的单元通信控制部， 通信终端从第一通信信道到第二通信信道，以及单元处理部，用于与服务提供者单元进行服务处理。

公开(公告)号：US08637329B2

公开(公告)日：2014-01-28

申请号：US13537221

申请日：2012-06-29

申请人： Yoshihiro Yoneda ,  Hirohiko Kobayashi ,  Kenji Koyama ,  Masaki Yanagisawa ,  Kenji Hiratsuka

发明人： Yoshihiro Yoneda ,  Hirohiko Kobayashi ,  Kenji Koyama ,  Masaki Yanagisawa ,  Kenji Hiratsuka

IPC分类号： H01L21/027 ,  H01L33/00

CPC分类号： H01S5/0265 ,  B82Y20/00 ,  H01S5/0425 ,  H01S5/12 ,  H01S5/2224 ,  H01S5/2275 ,  H01S5/34306 ,  H01S2301/176

摘要： A method for producing a semiconductor optical integrated device includes the steps of forming a substrate product including first and second stacked semiconductor layer portions; forming a first mask on the first and second stacked semiconductor layer portions, the first mask including a stripe-shaped first pattern region and a second pattern region, the second pattern region including a first end edge; forming a stripe-shaped mesa structure; removing the second pattern region of the first mask; forming a second mask on the second stacked semiconductor layer portion; and selectively growing a buried semiconductor layer with the first and second masks. The second mask includes a second end edge separated from the first end edge of the first mask, the second end edge being located on the side of the second stacked semiconductor layer portion in the predetermined direction with respect to the first end edge of the first mask.

摘要翻译： 一种半导体光学集成器件的制造方法，其特征在于，包括：形成包括第一和第二堆叠半导体层部分的衬底产品的步骤; 在所述第一和第二层叠半导体层部分上形成第一掩模，所述第一掩模包括条形第一图案区域和第二图案区域，所述第二图案区域包括第一端边缘; 形成条状台面结构; 去除第一掩模的第二图案区域; 在所述第二堆叠半导体层部分上形成第二掩模; 以及用第一和第二掩模选择性地生长掩埋的半导体层。 第二掩模包括与第一掩模的第一端边缘分离的第二端边缘，第二端边缘相对于第一掩模的第一端边缘位于第二堆叠半导体层部分的沿预定方向的一侧上 。

公开(公告)号：US08618638B2

公开(公告)日：2013-12-31

申请号：US13311837

申请日：2011-12-06

申请人： Yoshihiro Yoneda ,  Kenji Koyama ,  Hirohiko Kobayashi

发明人： Yoshihiro Yoneda ,  Kenji Koyama ,  Hirohiko Kobayashi

IPC分类号： H01L29/06 ,  H01L21/00 ,  G02B6/10

CPC分类号： G02F1/025 ,  G02F1/01708 ,  G02F2201/066 ,  G02F2201/12 ,  G02F2202/102

摘要： A process to manufacture a semiconductor optical modulator is disclosed, in which the process easily forms a metal film including AuZn for the p-ohmic metal even a contact hole has an enhanced aspect ration. The process forms a mesa including semiconductor layers first, then, buries the mesa by a resin layer sandwiched by insulating films. The resin layer provides an opening reaching the top of the mesa, into which the p-ohmic metal is formed. Another metal film including Ti is formed on the upper insulating film along the opening.

摘要翻译： 公开了一种制造半导体光调制器的方法，其中该方法容易地形成包括用于p-欧姆金属的AuZn的金属膜，即使接触孔具有增强的纵横比。 该方法首先形成包括半导体层的台面，然后通过被绝缘膜夹在中间的树脂层掩埋台面。 树脂层提供达到台面顶部的开口，形成p欧姆金属。 包括Ti的另一金属膜沿着开口形成在上绝缘膜上。

公开(公告)号：US08563342B2

公开(公告)日：2013-10-22

申请号：US13479567

申请日：2012-05-24

申请人： Yoshihiro Yoneda ,  Hirohiko Kobayashi ,  Kenji Koyama ,  Masaki Yanagisawa ,  Kenji Hiratsuka

发明人： Yoshihiro Yoneda ,  Hirohiko Kobayashi ,  Kenji Koyama ,  Masaki Yanagisawa ,  Kenji Hiratsuka

IPC分类号： H01L21/00

CPC分类号： H01S5/02272 ,  B82Y20/00 ,  H01S5/0201 ,  H01S5/0202 ,  H01S5/02264 ,  H01S5/0265 ,  H01S5/028 ,  H01S5/0425 ,  H01S5/2224 ,  H01S5/2275 ,  H01S5/34306 ,  H01S2301/176

摘要： A method of making a semiconductor optical integrated device includes the steps of forming, on a substrate, a plurality of semiconductor integrated devices including a first optical semiconductor element having a first bonding pad and a second optical semiconductor element; forming a plurality of bar-shaped semiconductor optical integrated device arrays by cutting the substrate, each of the semiconductor optical integrated device arrays including two or more semiconductor optical integrated devices; alternately arranging the plurality of semiconductor optical integrated device arrays and a plurality of spacers in a thickness direction of the substrate so as to be fixed in place; and forming a coating film on a facet of the semiconductor optical integrated device array. Furthermore, the spacer has a movable portion facing the first bonding pad, the movable portion protruding toward the first bonding pad and being displaceable in a protruding direction.

摘要翻译： 制造半导体光学集成器件的方法包括以下步骤：在衬底上形成包括具有第一焊盘和第二光学半导体元件的第一光学半导体元件的多个半导体集成器件; 通过切割衬底形成多个条形半导体光学集成器件阵列，每个半导体光学集成器件阵列包括两个或更多个半导体光学集成器件; 在基板的厚度方向交替布置多个半导体光学集成器件阵列和多个间隔物，以便固定就位; 以及在所述半导体光学集成器件阵列的刻面上形成涂膜。 此外，间隔件具有面向第一接合焊盘的可动部，可动部朝向第一接合焊盘突出，并且能够沿突出方向移位。

公开(公告)号：US08483744B2

公开(公告)日：2013-07-09

申请号：US12502760

申请日：2009-07-14

申请人： Kazuo Takada ,  Isao Soma ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Yoshihiro Yoneda ,  Naoki Miyabayashi

发明人： Kazuo Takada ,  Isao Soma ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Yoshihiro Yoneda ,  Naoki Miyabayashi

IPC分类号： H04B7/00

CPC分类号： H04W36/0016 ,  H04L63/18 ,  H04M1/72597 ,  H04W4/80 ,  H04W12/06 ,  H04W36/0038 ,  H04W68/02

摘要： There is provided a communication apparatus including: a first communication unit having a first communication range; a second communication unit having a second communication range wider than the first communication range; a control unit which transmits a request signal for starting communication via the second communication unit from the first communication unit to another communication apparatus, and transmits authentication information from the second communication unit to the another communication apparatus in the case where it is determined that communication with the another communication apparatus via the second communication unit is possible based on a response signal after the first communication unit receives the response signal in response to the request signal; and a notification unit which notifies a user after the second communication unit receives a result of authentication based on the authentication information.

摘要翻译： 提供一种通信装置，包括：具有第一通信范围的第一通信单元; 第二通信单元，具有比第一通信范围宽的第二通信范围; 控制单元，其经由第二通信单元从第一通信单元向另一通信设备发送用于开始通信的请求信号，并且在确定与第二通信单元的通信的情况下，将认证信息从第二通信单元发送到另一通信设备 基于第一通信单元响应于该请求信号接收到响应信号的响应信号，经由第二通信单元的另一通信装置是可能的; 以及通知单元，其在所述第二通信单元基于所述认证信息接收到认证结果之后通知用户。

公开(公告)号：US20120148184A1

公开(公告)日：2012-06-14

申请号：US13311837

申请日：2011-12-06

申请人： Yoshihiro Yoneda ,  Kenji Koyama ,  Hirohiko Kobayashi

发明人： Yoshihiro Yoneda ,  Kenji Koyama ,  Hirohiko Kobayashi

IPC分类号： G02F1/025 ,  H01L21/302

CPC分类号： G02F1/025 ,  G02F1/01708 ,  G02F2201/066 ,  G02F2201/12 ,  G02F2202/102

摘要： A process to manufacture a semiconductor optical modulator is disclosed, in which the process easily forms a metal film including AuZn for the p-ohmic metal even a contact hole has an enhanced aspect ration. The process forms a mesa including semiconductor layers first, then, buries the mesa by a resin layer sandwiched by insulating films. The resin layer provides an opening reaching the top of the mesa, into which the p-ohmic metal is formed. Another metal film including Ti is formed on the upper insulating film along the opening.

摘要翻译： 公开了一种制造半导体光调制器的方法，其中该方法容易地形成包括用于p-欧姆金属的AuZn的金属膜，即使接触孔具有增强的纵横比。 该方法首先形成包括半导体层的台面，然后通过被绝缘膜夹在中间的树脂层掩埋台面。 树脂层提供达到台面顶部的开口，形成p欧姆金属。 包括Ti的另一金属膜沿着开口形成在上绝缘膜上。