摘要:
A thin film semiconductor device is formed by preparing a substrate, forming a pattern of metal thin film on the substrate, forming an insulating layer on the metal thin film, and forming a pattern of a semiconductor thin film active layer, which is self-aligned to the pattern of the metal thin film, by laser CVD.
摘要:
An apparatus for determining crystal orientation comprises: a polarizer for polarizing an incident light beam; a polarization analyzer for selecting light having a selected polarization direction in Raman scattered light; and a synchronizer for enabling synchronous rotations of the polarizer and the polarization analyzer.
摘要:
A zone melting apparatus, in accordance with the present invention for monocrystallizing a semiconductor layer in a layered substance, includes: an upper elongated heater for zone melting of the semiconductor layer, the upper heater being disposed above and parallel to the semiconductor layer; a plurality of lower elongated heaters for heating the whole layered substance, the lower heaters being disposed in a plane below and parallel to the layered substance and the axis of each of the lower heaters being substantially perpendicular to the axis of the upper heater; a plurality of power suppliers for supplying electric power to the lower heaters; one or more temperature sensors for estimating the temperature of the layered substance; and a controller for controlling the power suppliers in response to the output of the temperature sensor(s), the controller making control so that the temperature of the central portion of the layered substance is slightly lower than that of the outer portions thereof.
摘要:
A method for fabricating a monocrystalline semiconductor layer on an insulating layer in the production of a semiconductor device wherein the location of grain boundaries is accurately controlled, thereby making the crystal orientation of the monocrystalline semiconductor layer uniform over a large area. An antireflection layer is formed above a polycrystalline of amorphous semiconductor layer formed on a main face of a monocrystalline semiconductor substrate which contacts the monocrystalline semiconductor substrate through windows formed in a thick insulating layer. The antireflection layer includes a first portion which covers all of the area of the polycrystalline or amorphous semiconductor layer above the windows, and a second portion, which has the form of a grid composed of parallel lines extending from the first portion in the direction of the crystallographic axis of the monocrystalline semiconductor substrate and partially covering a second area between the first areas. A laser beam is scanned from the first portions of the antireflection layer above the windows in directions parallel to the lines of the grid of the antireflection layer.
摘要:
A magnetic recording medium comprises a first magnetic layer containing magnetite or a cobalt doped magnetite which is coated on a non-magnetic substrate; and a second magnetic layer coating a cobalt doped .gamma.-Fe.sub.2 O.sub.3 which is coated on said first magnetic layer.The magnetic recording medium has a high recording sensitivity, a high dynamic range, a less output fluctuation and especially superior sensitivity in low frequency band and superior maximum output level without a deterioration of transfer characteristics.
摘要:
There is provided a polycarbonate resin with a reduced volatile chlorine content in which the amount of a chlorinous matter as volatilized from the resin when the resin is heated at 280.degree. C. for 30 minutes and then allowed to stand at room temperature for 3 days is 30 ppb or lower as calculated in terms of the amount of Cl atom. There is also provided a process for producing a polycarbonate resin using phosgene as a raw material, the improvement comprising using phosgene having a chlorine concentration of up to 1,000 ppb as the raw material thereby to provide the resin with a reduced volatile chlorine content.
摘要:
A semiconductor device in which parasitic resistance of source/drain regions can be reduced than the parasitic resistance of the drain region, and manufacturing method thereof, can be obtained. In the semiconductor device, inactivating ions are implanted only to the source region of the semiconductor layer, so as to damage the crystal near the surface of the semiconductor layer, whereby siliciding reaction is promoted. Therefore, in the source region, a titanium silicide film which is thicker can be formed.
摘要:
A buried oxide film 4 is formed on a main surface of a silicon substrate 1. An SOI layer 5 is formed on buried oxide film 4. Channel stop regions 22a and 22b respectively connected to channel regions of an nMOS 2 and a pMOS 3 are formed in an element isolation region of SOI layer 5. nMOS 2 and pMOS 3 are formed in an element formation region of SOI layer. A concentration of a p type impurity or an n type impurity included in channel stop regions 22a and 22b is higher than a concentration of the p type impurity or the n type impurity included in the channel region of nMOS 2 or the channel region of pMOS 3. An FS gate 16 is formed on channel stop regions 22a and 22b with an FS gate oxide film 15 interposed therebetween. Therefore, a semiconductor device having an SOI structure which is capable of suppressing a parasitic bipolar operation by drawing out efficiently excessive carriers stored in the channel region of transistor can be obtained.
摘要:
An MOS field effect transistor comprises a channel region (6) of a first conductivity type formed in a semiconductor layer (3) on an insulator substrate (2), a source region (8) and a drain region (9) of a second conductivity type formed in contact with one and the other sides of the channel region (6) in the semiconductor layer (3), respectively, a body region (7) formed in contact with at least a part of the channel region (6) and a part of a periphery of the source region (8) in the semiconductor layer (3) and having a higher impurity concentration than that of the channel region (6), a gate dielectric thin film (4) and a gate electrode (5) formed on the channel region (6), and a conductor (14a) connected in common to the source region (8) and the body region (7).
摘要:
A semiconductor device includes a conductor layer (3, 7) having a silicon crystal, an insulator layer (5, 15) formed on the surface of the conductor layer (3, 7) having a contact hole therethrough to said surface of the conductor layer (3, 7), an interconnecting portion formed at a predetermined location in the insulator layer (5, 15) and having a contact hole (6, 9) the bottom surface of which becomes the surface of the conductor layer (3, 7), a barrier layer (14) formed at the bottom of said contact hole at least on the surface of the conductor layer (3, 7) in the interconnecting portion, and a metal silicide layer (12) formed on the barrier layer (14). This semiconductor device is manufactured by depositing the insulator layer (5, 15) having the contact hole (6, 9) on the conductor layer (3, 7) having the silicon crystal, forming the barrier layer (14) and the polysilicon layer (7, 10) overlapping each other in the contact hole (6, 9) and on the insulator layer (5, 15) and then patterning these overlapping barrier layer (14) and polysilicon layer (7, 10), forming a metal layer (8, 11) thereon to be silicidized, and removing unreacted metal. The semiconductor device thus manufactured prevents a suction of silicon from the conductor layer (3, 7) to the metal silicide layer (12) and hence prevents an increase in resistance value due to a deficiency of silicon produced in the conductor layer (3, 7), thereby minimizing a series resistance of the metal silicide layer (12), a contact portion and the conductor layer (3, 7).