摘要:
A magnetic head includes a main pole, a write shield, a return path section, a heater that generates heat for making part of a medium facing surface protrude, and a sensor that detects contact of the part of the medium facing surface with a recording medium. The return path section includes: a yoke layer located backward of the main pole along the direction of travel of the recording medium; a first coupling part coupling the yoke layer and the write shield to each other; and a second coupling part located away from the medium facing surface and coupling the yoke layer and the main pole to each other. The first coupling part has an end face facing toward the yoke layer. This end face includes a middle portion spaced from the yoke layer and facing the yoke layer, and two side portions located on opposite sides of the middle portion in a track width direction and in contact with the yoke layer. The sensor is located between the middle portion and the yoke layer.
摘要:
A magnetic head includes: a main pole; a coil; a first shield with an end face located in a medium facing surface at a position forward of an end face of the main pole along a direction of travel of a recording medium; a gap part including a portion located between the main pole and the first shield; and a first return path section disposed forward of the main pole along the direction of travel of the recording medium. The first return path section connects the first shield and the main pole to each other so that a first space is defined by the main pole, the gap part, the first shield, and the first return path section. The coil includes a plurality of first coil elements extending to pass through the first space and aligned in a row in the direction of travel of the recording medium.
摘要:
A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film magnetic head includes a return magnetic pole layer and a connecting magnetic layer. The return magnetic pole layer is formed at a position distanced from the medium-opposing surface on the side opposite to the write shield layer with the main magnetic pole layer intervening therebetween. The connecting magnetic layer is formed using a magnetic material so as to connect the return magnetic pole layer to the write shield layer on the side closer to the medium-opposing surface than is the thin-film coil. The thin-film coil is wound as a flat spiral around the write shield layer. A part of the thin-film coil wound as the flat spiral is disposed only at a position distanced from the substrate than is the main magnetic pole layer.
摘要:
A magnetic head for perpendicular magnetic recording includes a read head unit, a write head unit disposed forward of the read head unit along the direction of travel of a recording medium, a heater that generates heat for causing the medium facing surface to protrude in part, an expansion layer that makes part of the medium facing surface protrude, and a sensor that detects contact of the part of the medium facing surface with the recording medium. The write head unit includes a main pole, a write shield, and a return path section. The return path section includes a yoke layer located backward of the main pole along the direction of travel of the recording medium, a first coupling part that couples the yoke layer and the write shield to each other, and a second coupling part that is located away from the medium facing surface and couples the yoke layer and the main pole to each other.
摘要:
A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The thin-film coil has a coil-layer. The coil-layer has a turn part arranged closer to an ABS than is a rear end part of the main magnetic pole layer farthest from the ABS. Regarding a substrate side coil-layer, arranged between the main magnetic pole layer and the substrate, of the coil-layer, a thickness of a non-corresponding magnetic pole part other than a magnetic pole corresponding part corresponding to an arrangement space of the main magnetic pole layer is larger than a thickness of the magnetic pole corresponding part.
摘要:
A bottom end of a main pole includes first, second, and third portions that are contiguously arranged in order of increasing distance from the medium facing surface. A top surface of the main pole includes fourth, fifth, and sixth portions that are contiguously arranged in order of increasing distance from the medium facing surface. A distance from the top surface of the substrate to any given point on each of the first and second portions decreases with increasing distance from the given point to the medium facing surface. The second portion has an angle of inclination greater than that of the first portion with respect to a direction perpendicular to the medium facing surface. A distance from the top surface of the substrate to any given point on each of the fourth and fifth portions increases with increasing distance from the given point to the medium facing surface. The fifth portion has an angle of inclination greater than that of the fourth portion with respect to the direction perpendicular to the medium facing surface.
摘要:
A layered chip package includes a main body. The main body includes a main part, and further includes first terminals and second terminals disposed on the top and bottom surfaces of the main part, respectively. The main part includes first and second layer portions, and through electrodes penetrating them. The through electrodes are electrically connected to the first and second terminals. Each of the layer portions includes a semiconductor chip having a first surface and a second surface opposite thereto, and further includes surface electrodes. The surface electrodes are disposed on a side of the semiconductor chip opposite to the second surface. The first and second layer portions are bonded to each other such that the respective second surfaces face each other. The first terminals are formed by using the surface electrodes of the first layer portion. The second terminals are formed by using the surface electrodes of the second layer portion.
摘要:
A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes a plurality of stacked layer portions. A method of manufacturing the layered chip package includes the step of fabricating a layered substructure and the step of cutting the layered substructure. The layered substructure includes: a plurality of arrayed pre-separation main bodies; a plurality of accommodation parts disposed between two adjacent pre-separation main bodies; and a plurality of preliminary wires accommodated in the accommodation parts. The accommodation parts are formed in a photosensitive resin layer by photolithography. In the step of cutting the layered substructure, the plurality of pre-separation main bodies are separated from each other, and the wires are formed by the preliminary wires.
摘要:
In a method of manufacturing a layered chip package, a layered substructure is fabricated and used to produce a plurality of layered chip packages. The layered substructure includes first to fourth substructures stacked, each of the substructures including an array of a plurality of preliminary layer portions. In the step of fabricating the layered substructure, initially fabricated are first to fourth pre-polishing substructures each having first and second surfaces. Next, the first and second pre-polishing substructures are bonded to each other with the first surfaces facing each other, and then the second surface of the second pre-polishing substructure is polished to form a first stack. Similarly, the third and fourth pre-polishing substructures are bonded to each other and the second surface of the third pre-polishing substructure is polished to form a second stack. Then, the first and second stacks are bonded to each other.
摘要:
A composite layered chip package includes a plurality of subpackages stacked on each other. Each subpackage includes a main body and wiring. The main body includes a main part including a plurality of layer portions, and further includes first terminals and second terminals that are disposed on top and bottom surfaces of the main part, respectively. The wiring is electrically connected to the first and second terminals. The number of the plurality of layer portions included in the main part is the same for all the plurality of subpackages, and the plurality of layer portions in every subpackage include at least one first-type layer portion. In each of at least two of the subpackages, the plurality of layer portions further include at least one second-type layer portion. The first-type layer portion includes a semiconductor chip connected to the wiring, whereas the second-type layer portion includes a semiconductor chip not connected to the wiring.