公开(公告)号：US06401701B1

公开(公告)日：2002-06-11

申请号：US09655877

申请日：2000-09-06

Applicant: Yumin Liu

Inventor： Yumin Liu

IPC: F02M2506

CPC classification number: F01M3/02 ,  F01M9/10 ,  F01M11/02 ,  F02B63/02 ,  F02B2075/027 ,  F02B2275/20

Abstract: The present invention relates to a four-stroke cycle internal combustion engine which is adapted to lubricate the inside of the engine using a mixed fuel composed of fuel and lubricant. The four-stroke cycle internal combustion engine includes a combustion chamber; an intake port which opens toward the combustion chamber; an air intake passage communicating with the intake port, the air intake passage having a downstream side air intake passage which is located on a downstream side of a fuel supply device for supplying the mixed fuel to the air intake passage; a crank shaft; a crank chamber accommodating the crank shaft; a branch passage branching off from the air intake passage for communicating the downstream side air intake passage of the air intake passage with the crank chamber; a valve system; a valve chamber accommodating the valve system; a communication passage for communicating the crank chamber with the valve chamber; a circulation passage for communicating the valve chamber with the air intake passage; and a valve disposed in the branch passage for opening and closing the branch passage.

Abstract translation: 本发明涉及一种四冲程循环内燃机，其适用于使用由燃料和润滑剂组成的混合燃料来润滑发动机内部。 四冲程循环内燃机包括燃烧室; 向燃烧室开口的进气口; 所述进气通道与所述进气口连通，所述进气通道具有下游侧进气通道，所述下游侧进气通道位于用于将所述混合燃料供给到所述进气通道的燃料供应装置的下游侧; 曲轴; 容纳曲轴的曲柄室; 从进气通道分支的分支通道，用于将进气通道的下游侧进气通道与曲柄室连通; 阀门系统; 容纳阀系统的阀室; 连通通道，用于将曲柄室与阀室连通; 用于使阀室与进气通道连通的循环通道; 以及设置在分支通道中的阀，用于打开和关闭分支通道。

公开(公告)号：US06355854B1

公开(公告)日：2002-03-12

申请号：US09255371

申请日：1999-02-22

Applicant: Yumin Liu

Inventor： Yumin Liu

IPC: C07C5327

CPC classification number: C07C45/34 ,  B01J23/002 ,  B01J23/76 ,  B01J23/80 ,  B01J23/83 ,  B01J23/847 ,  B01J23/8474 ,  B01J23/8476 ,  B01J2523/00 ,  C07C5/48 ,  C07C45/33 ,  C07C45/35 ,  C07C2523/755 ,  C07C11/02 ,  C07C47/22 ,  C07C49/08 ,  C07C49/10 ,  C07C49/205 ,  C07C47/21 ,  B01J2523/56 ,  B01J2523/57 ,  B01J2523/847 ,  B01J2523/31 ,  B01J2523/13 ,  B01J2523/842 ,  B01J2523/845 ,  B01J2523/55 ,  B01J2523/68

Abstract: Processes for oxidative dehydrogenation of alkane to one or more olefins, exemplified by ethane to ethylene, are disclosed using novel catalysts. The catalysts comprise a mixture of metal oxides having as an important component nickel oxide (NiO), which give high conversion and selectivity in the process. The catalyst can be used to make ethylene by contacting it with a gas mixture containing ethane and oxygen. The gas mixture may optionally contain ethylene, an inert diluent such as nitrogen, or both ethylene and an inert diluent.

Abstract translation: 使用新型催化剂公开了将烷烃氧化脱氢成一种或多种烯烃的方法，例如乙烷至乙烯。 催化剂包含具有作为重要组分的氧化镍（NiO）的金属氧化物的混合物，其在该过程中具有高的转化率和选择性。 该催化剂可用于通过使其与含有乙烷和氧气的气体混合物接触来制备乙烯。 气体混合物可任选地含有乙烯，惰性稀释剂如氮气，或乙烯和惰性稀释剂。

公开(公告)号：US08030743B2

公开(公告)日：2011-10-04

申请号：US11970087

申请日：2008-01-07

Applicant: Yong Liu ,  Margie T. Rios ,  Hua Yang ,  Yumin Liu ,  Tiburcio A. Maldo

Inventor： Yong Liu ,  Margie T. Rios ,  Hua Yang ,  Yumin Liu ,  Tiburcio A. Maldo

IPC: H01L23/495

CPC classification number: H01L23/49537 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/27 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/27436 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A two tier power module has, in one form thereof, a PC board having upper and lower traces with an opening in the insulating material that contains a power device which has upward extending solder bump connections. An upper leadframe is mounted on the solder bumps and the upper tracks of the PC board. Vias in the PC board connect selected upper and lower traces. A control device is mounted atop the leadframe and wire bonded to the leadframe, and the assembly is encapsulated leaving exposed the bottom surfaces of the lower traces of the PC board as external connections. In another form the PC board is replaced by a planar leadframe and the upper leadframe has stepped sections which make connections with the planar leadframe, the bottom surfaces of the planar leadframe forming external connections of the module.

Abstract translation: 两层电源模块的一种形式是具有上和下迹线的PC板，绝缘材料中具有开口，该开口包含具有向上延伸的焊料凸点连接的功率器件。 上引线框架安装在焊盘和PC板的上轨道上。 PC板上的通孔连接选定的上下轨迹。 控制装置安装在引线框架顶部，引线框架连接在一起，组件被封装，从而将PC板的下部走线的底面暴露为外部连接。 在另一种形式中，PC板由平面引线框架代替，并且上引线框架具有与平面引线框架连接的阶梯部分，平面引线框架的底表面形成模块的外部连接。

公开(公告)号：US07952204B2

公开(公告)日：2011-05-31

申请号：US12102793

申请日：2008-04-14

Applicant: Yumin Liu ,  Hua Yang ,  Yong Liu ,  Tiburcio A. Maldo

Inventor： Yumin Liu ,  Hua Yang ,  Yong Liu ,  Tiburcio A. Maldo

IPC: H01L23/538 ,  H01L21/60 ,  H01L23/488 ,  H01L23/48 ,  H01L23/34

CPC classification number: H01L23/5385 ,  H01L25/162 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10318 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An exemplary semiconductor die package is disclosed having one or more semiconductor dice disposed on a first substrate, one or more packaged electrical components disposed on a second substrate that is electrical coupled to the first substrate, and an electrically insulating material disposed over portions of the substrates. The first substrate may hold power-handling devices and may be specially constructed to dissipation heat and to facilitate fast and inexpensive manufacturing. The second substrate may hold packaged components of control circuitry for the power-handling devices, and may be specially constructed to enable fast and inexpensive wiring design and fast and inexpensive component assembly. The first substrate may be used with different designs of the second substrate.

Abstract translation: 公开了一种示例性的半导体管芯封装，其具有设置在第一衬底上的一个或多个半导体管芯，设置在电耦合到第一衬底的第二衬底上的一个或多个封装的电气部件，以及设置在衬底部分上的电绝缘材料 。 第一基板可以保持动力处理装置，并且可以被特别构造以散热并促进快速和便宜的制造。 第二基板可以保持用于功率处理装置的控制电路的封装部件，并且可以被特别构造以实现快速和便宜的布线设计以及快速和便宜的部件组装。 第一衬底可以与第二衬底的不同设计一起使用。

公开(公告)号：US20100193803A1

公开(公告)日：2010-08-05

申请号：US12365793

申请日：2009-02-04

Applicant: Yong Liu ,  Yumin Liu

Inventor： Yong Liu ,  Yumin Liu

IPC: H01L25/16 ,  H01L21/98

CPC classification number: H01L31/167 ,  H01L31/0203 ,  H01L31/18 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2924/10253 ,  H01L2924/00

Abstract: Disclosed are packages for optocouplers and methods of making the same. An exemplary optocoupler comprises a substrate having a first surface and a second surface, a plurality of optoelectronic dice for one or more optocouplers disposed on the substrate's first surface, and a plurality of optoelectronic dice for one or more optocouplers disposed on the substrate's second surface. The substrate may comprise a pre-molded leadframe, and electrical connections between optoelectronic dice on opposite surfaces of the substrate may be made via one or more leads of the leadframe.

Abstract translation: 公开了用于光耦合器的封装及其制造方法。 示例性光耦合器包括具有第一表面和第二表面的衬底，用于设置在衬底第一表面上的一个或多个光耦合器的多个光电子管芯，以及用于设置在衬底第二表面上的一个或多个光耦合器的多个光电子管芯。 衬底可以包括预成型的引线框架，并且可以通过引线框架的一个或多个引线来在衬底的相对表面上的光电子管芯之间的电连接。

公开(公告)号：US07674944B2

公开(公告)日：2010-03-09

申请号：US11786573

申请日：2007-04-11

Applicant: Yumin Liu

Inventor： Yumin Liu

IPC: C07C5/333 ,  C07C21/00

CPC classification number: C07C45/34 ,  B01J23/76 ,  B01J23/80 ,  B01J23/83 ,  B01J23/8474 ,  B01J23/8476 ,  C07C5/48 ,  C07C45/33 ,  C07C45/35 ,  C07C51/25 ,  C07C2521/04 ,  C07C2521/06 ,  C07C2523/06 ,  C07C2523/10 ,  C07C2523/20 ,  C07C2523/30 ,  C07C2523/75 ,  C07C2523/755 ,  C07C11/02 ,  C07C47/22 ,  C07C49/08 ,  C07C49/10 ,  C07C47/21 ,  C07C49/205 ,  C07C53/08

Abstract: Catalysts and methods for alkane oxydehydrogenation are disclosed. The catalysts of the invention generally comprise (i) nickel or a nickel-containing compound and (ii) at least one or more of titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), tungsten (W), yttrium (Y), zinc (Zn), zirconium (Zr), or aluminum (Al), or a compound containing one or more of such element(s). In preferred embodiments, the catalyst is a supported catalyst, the alkane is selected from the group consisting of ethane, propane, isobutane, n-butane and ethyl chloride, molecular oxygen is co-fed with the alkane to a reaction zone maintained at a temperature ranging from about 250° C. to about 350° C., and the ethane is oxidatively dehydrogenated to form the corresponding alkene with an alkane conversion of at least about 10% and an alkene selectivity of at least about 70%.

Abstract translation: 公开了烷烃氧化脱氢的催化剂和方法。 本发明的催化剂通常包括（i）镍或含镍化合物和（ii）钛（Ti），钽（Ta），铌（Nb），铪（Hf），钨（W）中的至少一种或多种 ），钇（Y），锌（Zn），锆（Zr）或铝（Al），或含有这些元素中的一种或多种的化合物。 在优选的实施方案中，催化剂是负载催化剂，烷烃选自乙烷，丙烷，异丁烷，正丁烷和乙基氯，分子氧与烷烃共同进料至维持在温度 范围为约250℃至约350℃，并且乙烷被氧化脱氢以形成相应的烯烃，烷烃转化率为至少约10％，烯烃选择性为至少约70％。

公开(公告)号：US20090315162A1

公开(公告)日：2009-12-24

申请号：US12143675

申请日：2008-06-20

Applicant: Yong Liu ,  Yumin Liu ,  Terry Johnson ,  Doug Hawks

Inventor： Yong Liu ,  Yumin Liu ,  Terry Johnson ,  Doug Hawks

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49589 ,  H01L23/498 ,  H01L23/49861 ,  H01L23/5222 ,  H01L2224/73203 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/19041

Abstract: Semiconductor die packages, methods of making said packages, and systems using said packages are disclosed. An exemplary package comprises at least one semiconductor die disposed on one surface of a leadframe and electrically coupled to at least one conductive region of the leadframe, and at least one passive electrical component disposed on the other surface of a leadframe and electrically coupled to at least one conductive region of the leadframe. Molding material is disposed over the at least one passive electrical component to provide a molded passive component.

Abstract translation: 公开了半导体管芯封装，制造所述封装的方法和使用所述封装的系统。 示例性封装包括设置在引线框架的一个表面上并电耦合到引线框架的至少一个导电区域的至少一个半导体管芯，以及设置在引线框架的另一个表面上的至少一个无源电气元件， 引线框架的一个导电区域。 成型材料设置在至少一个无源电气部件上，以提供模制的无源部件。

公开(公告)号：US20090278241A1

公开(公告)日：2009-11-12

申请号：US12117547

申请日：2008-05-08

Applicant: Yong Liu ,  Yumin Liu ,  Duane Sorlie

Inventor： Yong Liu ,  Yumin Liu ,  Duane Sorlie

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/49562 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor die package. The semiconductor includes a premolded substrate. The premolded substrate includes (i) a leadframe structure, (ii) a first semiconductor die comprising a first die surface and a second die surface, attached to the leadframe structure, and (iii) a molding material covering at least a portion of the leadframe structure and the first semiconductor die. The premolded substrate includes a first premolded substrate surface and a second premolded substrate surface. A second semiconductor die is stacked on the second premolded substrate surface of the premolded substrate. A housing material is on at least a portion of the second semiconductor die and the second premolded substrate surface of the premolded substrate. One of the first semiconductor die and the second semiconductor die includes a transistor while the other includes an integrated circuit.

Abstract translation: 半导体管芯封装。 半导体包括预成型基板。 预成型衬底包括（i）引线框架结构，（ii）第一半导体管芯，其包括附接到引线框架结构的第一管芯表面和第二管芯表面，以及（iii）覆盖引线框架的至少一部分的成型材料 结构和第一半导体管芯。 预成型衬底包括第一预成型衬底表面和第二预成型衬底表面。 第二半导体管芯被堆叠在预成型衬底的第二预成型衬底表面上。 壳体材料位于第二半导体管芯的至少一部分和预成型衬底的第二预成形衬底表面上。 第一半导体管芯和第二半导体管芯中的一个包括晶体管，而另一个包括集成电路。

公开(公告)号：US20070197378A1

公开(公告)日：2007-08-23

申请号：US11786799

申请日：2007-04-11

Applicant: Yumin Liu

Inventor： Yumin Liu

IPC: B01J23/00 ,  C07C5/333

CPC classification number: C07C45/34 ,  B01J23/76 ,  B01J23/80 ,  B01J23/83 ,  B01J23/8474 ,  B01J23/8476 ,  C07C5/48 ,  C07C45/33 ,  C07C45/35 ,  C07C51/25 ,  C07C2521/04 ,  C07C2521/06 ,  C07C2523/06 ,  C07C2523/10 ,  C07C2523/20 ,  C07C2523/30 ,  C07C2523/75 ,  C07C2523/755 ,  C07C11/02 ,  C07C47/22 ,  C07C49/08 ,  C07C49/10 ,  C07C47/21 ,  C07C49/205 ,  C07C53/08

Abstract: Catalysts and methods for alkane oxydehydrogenation are disclosed. The catalysts of the invention generally comprise (i) nickel or a nickel-containing compound and (ii) at least one or more of titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), tungsten (W), yttrium (Y), zinc (Zn), zirconium (Zr), or aluminum (Al), or a compound containing one or more of such element(s). In preferred embodiments, the catalyst is a supported catalyst, the alkane is selected from the group consisting of ethane, propane, isobutane, n-butane and ethyl chloride, molecular oxygen is co-fed with the alkane to a reaction zone maintained at a temperature ranging from about 250° C. to about 350° C., and the ethane is oxidatively dehydrogenated to form the corresponding alkene with an alkane conversion of at least about 10% and an alkene selectivity of at least about 70%.

公开(公告)号：US20050090702A1

公开(公告)日：2005-04-28

申请号：US10719441

申请日：2003-11-20

Applicant: Yumin Liu

Inventor： Yumin Liu

IPC: B01J23/76 ,  B01J23/80 ,  B01J23/83 ,  B01J23/847 ,  C07C5/48 ,  C07C45/33 ,  C07C45/34 ,  C07C45/35 ,  C07C5/333 ,  B01J23/00 ,  B01J23/58

CPC classification number: C07C45/34 ,  B01J23/76 ,  B01J23/80 ,  B01J23/83 ,  B01J23/8474 ,  B01J23/8476 ,  C07C5/48 ,  C07C45/33 ,  C07C45/35 ,  C07C51/25 ,  C07C2521/04 ,  C07C2521/06 ,  C07C2523/06 ,  C07C2523/10 ,  C07C2523/20 ,  C07C2523/30 ,  C07C2523/75 ,  C07C2523/755 ,  C07C11/02 ,  C07C47/22 ,  C07C49/08 ,  C07C49/10 ,  C07C47/21 ,  C07C49/205 ,  C07C53/08

Abstract: Catalysts and methods for alkane oxydehydrogenation are disclosed. The catalysts of the invention generally comprise (i) nickel or a nickel-containing compound and (ii) at least one or more of titanium (Ti), tantalum (Ta), niobium (Nb), hafnium (Hf), tungsten (W), yttrium (Y), zinc (Zn), zirconium (Zr), or aluminum (Al), or a compound containing one or more of such element(s). In preferred embodiments, the catalyst is a supported catalyst, the alkane is selected from the group consisting of ethane, propane, isobutane, n-butane and ethyl chloride, molecular oxygen is co-fed with the alkane to a reaction zone maintained at a temperature ranging from about 250° C. to about 350° C., and the ethane is oxidatively dehydrogenated to form the corresponding alkene with an alkane conversion of at least about 10% and an alkene selectivity of at least about 70%.

Abstract translation: 公开了烷烃氧化脱氢的催化剂和方法。 本发明的催化剂通常包括（i）镍或含镍化合物和（ii）钛（Ti），钽（Ta），铌（Nb），铪（Hf），钨（W）中的至少一种或多种 ），钇（Y），锌（Zn），锆（Zr）或铝（Al），或含有这些元素中的一种或多种的化合物。 在优选的实施方案中，催化剂是负载催化剂，烷烃选自乙烷，丙烷，异丁烷，正丁烷和乙基氯，分子氧与烷烃共同进料至维持在温度 范围为约250℃至约350℃，并且乙烷被氧化脱氢以形成相应的烯烃，烷烃转化率为至少约10％，烯烃选择性为至少约70％。