公开(公告)号：US20120068350A1

公开(公告)日：2012-03-22

申请号：US13237189

申请日：2011-09-20

申请人： Tong-Suk Kim ,  Woo-Jae Kim ,  Yun-Seok Choi ,  Seon-Hyang You

发明人： Tong-Suk Kim ,  Woo-Jae Kim ,  Yun-Seok Choi ,  Seon-Hyang You

IPC分类号： H01L23/52

CPC分类号： H01L23/49811 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/06132 ,  H01L2224/06142 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/14132 ,  H01L2224/16106 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17106 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package, an electronic device, and an electronic system employing the same are provided. The semiconductor package includes a printed circuit board (PCB) and a semiconductor chip structure. A first PCB land region is provided on a first surface of the PCB. A plurality of first chip land regions are provided on a first surface of the semiconductor chip structure which faces the first surface of the PCB. A first connection structure for electrically connecting the first PCB land region to the plurality of first chip land regions is provided.

摘要翻译： 提供半导体封装，电子设备和采用该半导体封装的电子设备。 半导体封装包括印刷电路板（PCB）和半导体芯片结构。 第一PCB焊盘区域设置在PCB的第一表面上。 在半导体芯片结构的面向PCB的第一表面的第一表面上设置有多个第一芯片焊盘区域。 提供了用于将第一PCB焊盘区域电连接到多个第一芯片焊盘区域的第一连接结构。

公开(公告)号：US20090215401A1

公开(公告)日：2009-08-27

申请号：US12322586

申请日：2009-02-04

申请人： Eun-Chul Yoon ,  Yun-Seok Choi

发明人： Eun-Chul Yoon ,  Yun-Seok Choi

IPC分类号： H04B17/00

CPC分类号： H04B7/0617 ,  H04B7/0632 ,  H04B17/24 ,  H04B17/309 ,  H04B17/336

摘要： An apparatus and a method for determining a Channel Quality Indicator (CQI) using a beamforming in a multi-antenna system are provided. A transmitter for determining a CQI based at least partly upon the beamforming in the multi-antenna system includes a beam former for distinguishing frequency tone intervals having a constant channel across an entire frequency tone, forming a beam by multiplying frequency tones of the frequency tone interval having the constant channel by different beamforming weights, and transmitting a preamble signal. Hence, the users can be scheduled based at least partly upon the beamforming gain, and throughput can be enhanced through the practical MCS selection.

摘要翻译： 提供了一种使用多天线系统中的波束成形来确定信道质量指示符（CQI）的装置和方法。 用于至少部分地基于多天线系统中的波束成形来确定CQI的发射机包括：波束形成器，用于区分整个频率音调具有恒定信道的频率间隔，通过将频率间隔的频率相乘来形成波束 通过不同的波束形成权重具有恒定信道，并发送前导码信号。 因此，可以至少部分地基于波束成形增益来调度用户，并且可以通过实际的MCS选择来增加吞吐量。

公开(公告)号：US20080165208A1

公开(公告)日：2008-07-10

申请号：US12003998

申请日：2008-01-04

申请人： Jae-Wan Bae ,  Yun-Seok Choi

发明人： Jae-Wan Bae ,  Yun-Seok Choi

IPC分类号： G09G5/00

CPC分类号： G06T15/30

摘要： A graphic processing method may include clipping a first polygon with a near plane of a view volume to create a second polygon, clipping the second polygon with a far plane of the view volume to create a third polygon, and/or discriminating if a homogeneous coordinate of the third polygon is 0. The third polygon may be clipped to one of left, right, top, and bottom planes of the view volume if the homogeneous coordinate of the third polygon is 0.

摘要翻译： 图形处理方法可以包括用视图体积的近平面剪切第一多边形以创建第二多边形，用视图体的远平面剪切第二多边形以创建第三多边形，和/或区分均匀坐标 第三个多边形的均匀坐标为0.如果第三个多边形的均匀坐标为0，则可以将第三个多边形剪切到视图卷的左，右，上，下平面之一。

公开(公告)号：US20070042877A1

公开(公告)日：2007-02-22

申请号：US10552838

申请日：2004-05-13

申请人： Yun-Seok Choi

发明人： Yun-Seok Choi

IPC分类号： A63B21/06 ,  A63B21/08

CPC分类号： A63B23/1281 ,  A63B21/0087 ,  A63B2208/0233

摘要： Disclosed is an apparatus for three-dimensional anaerobic exercise including: A seat mounted on the base frame; handle linkages each inclinedly mounted at right and left sides of the base frame to form an angle ¥á in front of the seat; a bearing box mounted on the front end of the handle linkage; first and second handle frames rotatably mounted on a handle shaft; a handle side lever fixed between the first handle frame and the bearing box in such a manner as to form a predetermined angle with respect to the first handle frame; and an auxiliary linkage connected at an upper end to the handle side lever via a ball joint and mounted at lower end on a fixed lever fixed to the lower end of the front side of the base frame via a ball joint to form a distance (d).

摘要翻译： 公开了一种用于三维无氧运动的装置，包括：安装在基架上的座椅; 每个倾斜地安装在基座的右侧和左侧的手柄连杆在座椅前方形成角度θ？ 安装在手柄连杆的前端的轴承箱; 可旋转地安装在手柄轴上的第一和第二手柄框架; 手柄侧杆，以相对于第一手柄框架形成预定角度的方式固定在第一手柄框架和轴承箱之间; 以及辅助联动件，其通过球窝接头在上端连接到手柄侧杆，并且在下端安装在经由球窝接头固定到基座的前侧的下端的固定杆上以形成距离（d ）。

公开(公告)号：US09557616B2

公开(公告)日：2017-01-31

申请号：US13242394

申请日：2011-09-23

申请人： Ye-Chung Chung ,  Hee-seok Lee ,  Yun-Seok Choi ,  Keung-Beum Kim

发明人： Ye-Chung Chung ,  Hee-seok Lee ,  Yun-Seok Choi ,  Keung-Beum Kim

IPC分类号： G06F3/038 ,  H03K3/00 ,  G02F1/1345

CPC分类号： H01L27/1244 ,  G02F1/13452 ,  G09G3/20 ,  G09G2300/0426 ,  G09G2310/08 ,  G09G2330/021 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13124 ,  H01L2224/13639 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/1426 ,  H05K1/148

摘要： An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.

摘要翻译： 图像显示面板组件包括柔性印刷电路（FPC），图像显示面板，栅极驱动器集成电路（IC）封装以及源极驱动器IC封装。 FPC被配置为接收门和源驱动信号。 图像显示面板电连接到FPC，并且包括沿着图像显示面板的第一边缘的栅极驱动信号传递图案，沿着与第一端相邻的第二边缘的源极驱动信号传递图案，以及多个像素 。 栅极驱动器集成电路（IC）封装被配置为通过栅极驱动信号传输图案接收栅极驱动信号，并将栅极驱动信号提供给多个像素。 源极驱动器IC封装被配置为通过源极驱动信号传输图案接收源极驱动信号，并将源极驱动信号提供给多个像素。

公开(公告)号：US08575735B2

公开(公告)日：2013-11-05

申请号：US13034973

申请日：2011-02-25

申请人： Young-Sang Cho ,  Chang-Sig Kang ,  Dae-Woo Son ,  Yun-Seok Choi ,  Kyong-Soon Cho ,  Sang-Heul Lee

发明人： Young-Sang Cho ,  Chang-Sig Kang ,  Dae-Woo Son ,  Yun-Seok Choi ,  Kyong-Soon Cho ,  Sang-Heul Lee

IPC分类号： H01L23/495

CPC分类号： H01L24/50 ,  H01L23/4985 ,  H01L24/06 ,  H01L2224/0401 ,  H01L2224/0405 ,  H01L2224/05553 ,  H01L2224/06155 ,  H01L2224/14155 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14

摘要： A semiconductor chip for a tape automated bonding (TAB) package is disclosed. The semiconductor chip comprises a connection surface including a set of input pads connected to internal circuitry of the chip and for conveying external signals to the internal circuitry, the set of input pads comprising all of the input pads on the chip. The connection surface includes a set of output pads connected to internal circuitry of the chip and for conveying internal chip signals to outside the chip, the set of output pads comprising all of the output pads on the chip.

摘要翻译： 公开了一种用于带式自动接合（TAB）封装的半导体芯片。 半导体芯片包括连接表面，其包括连接到芯片的内部电路的一组输入焊盘，并且用于将外部信号传送到内部电路，该组输入焊盘包括芯片上的所有输入焊盘。 连接表面包括连接到芯片的内部电路的一组输出焊盘，并将内部芯片信号传送到芯片外部，该组输出焊盘包括芯片上的所有输出焊盘。

公开(公告)号：US20120075268A1

公开(公告)日：2012-03-29

申请号：US13242394

申请日：2011-09-23

申请人： Ye-Chung Chung ,  Hee-seok Lee ,  Yun-Seok Choi ,  Keung-Beum Kim

发明人： Ye-Chung Chung ,  Hee-seok Lee ,  Yun-Seok Choi ,  Keung-Beum Kim

IPC分类号： G09G5/00 ,  H03L5/00

CPC分类号： H01L27/1244 ,  G02F1/13452 ,  G09G3/20 ,  G09G2300/0426 ,  G09G2310/08 ,  G09G2330/021 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13124 ,  H01L2224/13639 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/1426 ,  H05K1/148

摘要： An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.

摘要翻译： 图像显示面板组件包括柔性印刷电路（FPC），图像显示面板，栅极驱动器集成电路（IC）封装以及源极驱动器IC封装。 FPC被配置为接收门和源驱动信号。 图像显示面板电连接到FPC，并且包括沿着图像显示面板的第一边缘的栅极驱动信号传递图案，沿着与第一端相邻的第二边缘的源极驱动信号传递图案，以及多个像素 。 栅极驱动器集成电路（IC）封装被配置为通过栅极驱动信号传输图案接收栅极驱动信号，并将栅极驱动信号提供给多个像素。 源极驱动器IC封装被配置为通过源极驱动信号传输图案接收源极驱动信号，并将源极驱动信号提供给多个像素。

公开(公告)号：US08005043B2

公开(公告)日：2011-08-23

申请号：US11969057

申请日：2008-01-03

申请人： Yun-Seok Choi ,  Sung-Kwon Jo ,  Ki-Seob Hong

发明人： Yun-Seok Choi ,  Sung-Kwon Jo ,  Ki-Seob Hong

IPC分类号： H04W4/00

CPC分类号： H04W28/08 ,  H04W72/1247

摘要： A method and apparatus for scheduling downlink packets in a mobile communication system are provided, in which a BS prioritizes MSs, while accounting for types of services provided to the MSs, generates one single-user candidate transmission format and M multi-user candidate transmission formats corresponding to a DRC value received from an MS with a highest priority level, estimates per-slot effective data rates for the single-user candidate transmission format and all of the multi-user candidate transmission formats, and transmits a downlink packet in a candidate transmission format having a maximum per-slot effective data rate.

摘要翻译： 提供了一种用于在移动通信系统中调度下行链路分组的方法和装置，其中BS优先考虑MS，同时考虑提供给MS的服务的类型，生成一个单用户候选传输格式和M个多用户候选传输格式 对应于从具有最高优先级的MS接收的DRC值，估计单用户候选传输格式的所有时隙有效数据速率和所有多用户候选传输格式，并在候选传输中发送下行链路分组 格式具有最大每时隙有效数据速率。

公开(公告)号：US20100044851A1

公开(公告)日：2010-02-25

申请号：US12461639

申请日：2009-08-19

申请人： Yun-Seok Choi ,  Hee-Seok Lee ,  Kyoung-Sei Choi

发明人： Yun-Seok Choi ,  Hee-Seok Lee ,  Kyoung-Sei Choi

IPC分类号： H01L23/31 ,  H01L21/60 ,  H01L23/488

CPC分类号： H01L21/563 ,  H01L23/295 ,  H01L23/60 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Flip chip packages and methods of manufacturing the same are provided, the flip chip packages may include a package substrate, a semiconductor chip, conductive bumps, a ground pattern and an underfilling layer. The semiconductor chip may be over the package substrate. The conductive bumps may be between the semiconductor chip and the package substrate to electrically connect the semiconductor chip and the package substrate with each other. The ground pattern may ground one of the package substrate and the semiconductor chip. The underfilling layer may be between the package substrate and the semiconductor chip to surround the conductive bumps. The underfilling layer may have a diode selectively located between the ground pattern and the conductive bumps by electrostatic electricity applied to the underfilling layer to protect the semiconductor chip from the electrostatic electricity.

摘要翻译： 提供了倒装芯片封装及其制造方法，倒装芯片封装可以包括封装衬底，半导体芯片，导电凸块，接地图案和底部填充层。 半导体芯片可以在封装衬底之上。 导电凸块可以在半导体芯片和封装基板之间，以将半导体芯片和封装基板彼此电连接。 接地图可以将封装衬底和半导体芯片之一接地。 底部填充层可以在封装衬底和半导体芯片之间以包围导电凸块。 底部填充层可以通过施加到底部填充层的静电来选择性地位于接地图案和导电凸块之间的二极管，以保护半导体芯片免受静电。

公开(公告)号：US07599331B2

公开(公告)日：2009-10-06

申请号：US11982810

申请日：2007-11-05

申请人： Ki-Seob Hong ,  Sung-Kwon Jo ,  Yun-Seok Choi

发明人： Ki-Seob Hong ,  Sung-Kwon Jo ,  Yun-Seok Choi

IPC分类号： H04W4/00

CPC分类号： H04W28/22 ,  H04B17/345 ,  H04B17/373 ,  H04W72/08

摘要： A mobile communication system is provided. A base station includes: a measuring unit for measuring loads of all mobile stations existing within a sector; a first computation unit for computing a sector load by using a Rise Over Thermal (ROT) of the sector; a second computation unit for computing an interference factor, which is a ratio of an interference load caused by an adjacent sector to a corresponding sector load, by using the load of each mobile station and the sector load; and a determining unit for predicting a sector load depending on variation of a reverse data transfer rate of a target mobile station by using the interference factor and for determining the reverse data transfer rate of the target mobile station in a range where the predicted sector load does not exceed a sector threshold load.

摘要翻译： 提供移动通信系统。 基站包括：用于测量存在于扇区内的所有移动站的负载的测量单元; 第一计算单元，用于通过使用扇区的上升温度（ROT）来计算扇区负载; 第二计算单元，用于通过使用每个移动站的负载和扇区负载来计算作为相邻扇区引起的干扰负载与相应扇区负载的比率的干扰因子; 以及确定单元，用于根据目标移动台的反向数据传输速率的变化，通过使用干扰因子来预测扇区负载，并且用于在预测扇区负载进行的范围内确定目标移动站的反向数据传输速率 不超过扇区阈值负载。