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    Flip chip packages
    1.
    发明授权
    Flip chip packages 有权
    倒装芯片封装

    公开(公告)号：US07956452B2

    公开(公告)日：2011-06-07

    申请号：US12461639

    申请日：2009-08-19

    申请人： Yun-Seok Choi ,  Hee-Seok Lee ,  Kyoung-Sei Choi

    发明人： Yun-Seok Choi ,  Hee-Seok Lee ,  Kyoung-Sei Choi

    IPC分类号： H01L23/48

    CPC分类号： H01L21/563 ,  H01L23/295 ,  H01L23/60 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    摘要： Flip chip packages and methods of manufacturing the same are provided, the flip chip packages may include a package substrate, a semiconductor chip, conductive bumps, a ground pattern and an underfilling layer. The semiconductor chip may be over the package substrate. The conductive bumps may be between the semiconductor chip and the package substrate to electrically connect the semiconductor chip and the package substrate with each other. The ground pattern may ground one of the package substrate and the semiconductor chip. The underfilling layer may be between the package substrate and the semiconductor chip to surround the conductive bumps. The underfilling layer may have a diode selectively located between the ground pattern and the conductive bumps by electrostatic electricity applied to the underfilling layer to protect the semiconductor chip from the electrostatic electricity.

    摘要翻译： 提供了倒装芯片封装及其制造方法，倒装芯片封装可以包括封装衬底，半导体芯片，导电凸块，接地图案和底部填充层。 半导体芯片可以在封装衬底之上。 导电凸块可以在半导体芯片和封装基板之间，以将半导体芯片和封装基板彼此电连接。 接地图可以将封装衬底和半导体芯片之一接地。 底部填充层可以在封装衬底和半导体芯片之间以包围导电凸块。 底部填充层可以通过施加到底部填充层的静电来选择性地位于接地图案和导电凸块之间的二极管，以保护半导体芯片免受静电。

    Flip chip packages
    2.
    发明申请
    Flip chip packages 有权
    倒装芯片封装

    公开(公告)号：US20100044851A1

    公开(公告)日：2010-02-25

    申请号：US12461639

    申请日：2009-08-19

    申请人： Yun-Seok Choi ,  Hee-Seok Lee ,  Kyoung-Sei Choi

    发明人： Yun-Seok Choi ,  Hee-Seok Lee ,  Kyoung-Sei Choi

    IPC分类号： H01L23/31 ,  H01L21/60 ,  H01L23/488

    CPC分类号： H01L21/563 ,  H01L23/295 ,  H01L23/60 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    摘要： Flip chip packages and methods of manufacturing the same are provided, the flip chip packages may include a package substrate, a semiconductor chip, conductive bumps, a ground pattern and an underfilling layer. The semiconductor chip may be over the package substrate. The conductive bumps may be between the semiconductor chip and the package substrate to electrically connect the semiconductor chip and the package substrate with each other. The ground pattern may ground one of the package substrate and the semiconductor chip. The underfilling layer may be between the package substrate and the semiconductor chip to surround the conductive bumps. The underfilling layer may have a diode selectively located between the ground pattern and the conductive bumps by electrostatic electricity applied to the underfilling layer to protect the semiconductor chip from the electrostatic electricity.

    摘要翻译： 提供了倒装芯片封装及其制造方法，倒装芯片封装可以包括封装衬底，半导体芯片，导电凸块，接地图案和底部填充层。 半导体芯片可以在封装衬底之上。 导电凸块可以在半导体芯片和封装基板之间，以将半导体芯片和封装基板彼此电连接。 接地图可以将封装衬底和半导体芯片之一接地。 底部填充层可以在封装衬底和半导体芯片之间以包围导电凸块。 底部填充层可以通过施加到底部填充层的静电来选择性地位于接地图案和导电凸块之间的二极管，以保护半导体芯片免受静电。

    ELECTRONIC DEVICE HAVING ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND METHODS OF FABRICATING THE SAME
    3.
    发明申请
    ELECTRONIC DEVICE HAVING ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND METHODS OF FABRICATING THE SAME 审中-公开
    具有静电放电保护装置的电子装置及其制造方法

    公开(公告)号：US20090284883A1

    公开(公告)日：2009-11-19

    申请号：US12468178

    申请日：2009-05-19

    申请人： Hee-Seok LEE ,  Yun-Seok Choi ,  Kyoung-Sei Choi

    发明人： Hee-Seok LEE ,  Yun-Seok Choi ,  Kyoung-Sei Choi

    IPC分类号： H02H9/00

    CPC分类号： H01L23/60 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

    摘要： An electronic device having an electrostatic discharge (ESD) protection device and methods of fabricating the same. The electronic device can include an electronic element to be protected from electrostatic discharge. The electronic element can be installed on a substrate. The substrate can include a ground electrode disposed on the substrate, and a first element electrode disposed at a different level from the ground electrode on the substrate to overlap a part of the ground electrode and to electrically connect to the electronic element installed to the substrate. A dielectric layer can be disposed between the ground electrode and the first element electrode, wherein the ground electrode, the first element electrode and the dielectric layer disposed therebetween constitute an electrostatic discharge (ESD) protection device.

    摘要翻译： 一种具有静电放电（ESD）保护装置的电子装置及其制造方法。 电子设备可以包括要被防止静电放电的电子元件。 电子元件可以安装在基板上。 基板可以包括设置在基板上的接地电极和与基板上的接地电极不同的高度设置的第一元件电极，以与接地电极的一部分重叠并且电连接到安装到基板上的电子元件。 介电层可以设置在接地电极和第一元件电极之间，其中接地电极，第一元件电极和介于其间的电介质层构成静电放电（ESD）保护装置。

    Source driver, an image display assembly and an image display apparatus
    6.
    发明授权
    Source driver, an image display assembly and an image display apparatus 有权
    源驱动器，图像显示组件和图像显示装置

    公开(公告)号：US09557616B2

    公开(公告)日：2017-01-31

    申请号：US13242394

    申请日：2011-09-23

    申请人： Ye-Chung Chung ,  Hee-seok Lee ,  Yun-Seok Choi ,  Keung-Beum Kim

    发明人： Ye-Chung Chung ,  Hee-seok Lee ,  Yun-Seok Choi ,  Keung-Beum Kim

    IPC分类号： G06F3/038 ,  H03K3/00 ,  G02F1/1345

    CPC分类号： H01L27/1244 ,  G02F1/13452 ,  G09G3/20 ,  G09G2300/0426 ,  G09G2310/08 ,  G09G2330/021 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13124 ,  H01L2224/13639 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/1426 ,  H05K1/148

    摘要： An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.

    摘要翻译： 图像显示面板组件包括柔性印刷电路（FPC），图像显示面板，栅极驱动器集成电路（IC）封装以及源极驱动器IC封装。 FPC被配置为接收门和源驱动信号。 图像显示面板电连接到FPC，并且包括沿着图像显示面板的第一边缘的栅极驱动信号传递图案，沿着与第一端相邻的第二边缘的源极驱动信号传递图案，以及多个像素 。 栅极驱动器集成电路（IC）封装被配置为通过栅极驱动信号传输图案接收栅极驱动信号，并将栅极驱动信号提供给多个像素。 源极驱动器IC封装被配置为通过源极驱动信号传输图案接收源极驱动信号，并将源极驱动信号提供给多个像素。

    Source Driver, An Image Display Assembly And An Image Display Apparatus
    7.
    发明申请
    Source Driver, An Image Display Assembly And An Image Display Apparatus 有权
    源驱动器，图像显示装置和图像显示装置

    公开(公告)号：US20120075268A1

    公开(公告)日：2012-03-29

    申请号：US13242394

    申请日：2011-09-23

    申请人： Ye-Chung Chung ,  Hee-seok Lee ,  Yun-Seok Choi ,  Keung-Beum Kim

    发明人： Ye-Chung Chung ,  Hee-seok Lee ,  Yun-Seok Choi ,  Keung-Beum Kim

    IPC分类号： G09G5/00 ,  H03L5/00

    CPC分类号： H01L27/1244 ,  G02F1/13452 ,  G09G3/20 ,  G09G2300/0426 ,  G09G2310/08 ,  G09G2330/021 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13124 ,  H01L2224/13639 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/1426 ,  H05K1/148

    摘要： An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.

    摘要翻译： 图像显示面板组件包括柔性印刷电路（FPC），图像显示面板，栅极驱动器集成电路（IC）封装以及源极驱动器IC封装。 FPC被配置为接收门和源驱动信号。 图像显示面板电连接到FPC，并且包括沿着图像显示面板的第一边缘的栅极驱动信号传递图案，沿着与第一端相邻的第二边缘的源极驱动信号传递图案，以及多个像素 。 栅极驱动器集成电路（IC）封装被配置为通过栅极驱动信号传输图案接收栅极驱动信号，并将栅极驱动信号提供给多个像素。 源极驱动器IC封装被配置为通过源极驱动信号传输图案接收源极驱动信号，并将源极驱动信号提供给多个像素。

    Semiconductor chip, wiring substrate of a semiconductor package, semiconductor package having the semiconductor chip and display device having the semiconductor package
    8.
    发明授权
    Semiconductor chip, wiring substrate of a semiconductor package, semiconductor package having the semiconductor chip and display device having the semiconductor package 失效
    半导体芯片，半导体封装的布线基板，具有半导体芯片的半导体封装和具有该半导体封装的显示装置

    公开(公告)号：US08299597B2

    公开(公告)日：2012-10-30

    申请号：US12502324

    申请日：2009-07-14

    申请人： Yun-Seok Choi ,  Hee-Seok Lee

    发明人： Yun-Seok Choi ,  Hee-Seok Lee

    IPC分类号： H01L23/48

    CPC分类号： H01L23/4985 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/60 ,  H01L27/0248 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor chip can include a semiconductor substrate, an input portion and an output portion. A circuit element can be formed in the semiconductor substrate. The input portion can be formed on the semiconductor substrate. The input portion can include a first input pad to receive an input signal from the outside and a second input pad spaced apart from the first input pad, the second input pad being electrically connected to the first input pad through an external connection line such that the second input pad inputs the input signal to the circuit element. The output portion can be formed on the semiconductor substrate. The output pad can include an output pad to output an output signal from the circuit element.

    摘要翻译： 半导体芯片可以包括半导体衬底，输入部分和输出部分。 电路元件可以形成在半导体衬底中。 输入部分可以形成在半导体衬底上。 输入部分可以包括用于从外部接收输入信号的第一输入焊盘和与第一输入焊盘间隔开的第二输入焊盘，第二输入焊盘通过外部连接线电连接到第一输入焊盘，使得 第二输入焊盘将输入信号输入到电路元件。 输出部分可以形成在半导体衬底上。 输出焊盘可以包括输出焊盘以输出来自电路元件的输出信号。

    Apparatus and method for determining channel quality indicator (CQI) using beamforming in multi-antenna system
    10.
    发明授权
    Apparatus and method for determining channel quality indicator (CQI) using beamforming in multi-antenna system 有权
    在多天线系统中使用波束成形确定信道质量指示符（CQI）的装置和方法

    公开(公告)号：US08121553B2

    公开(公告)日：2012-02-21

    申请号：US12322586

    申请日：2009-02-04

    申请人： Eun-Chul Yoon ,  Yun-Seok Choi

    发明人： Eun-Chul Yoon ,  Yun-Seok Choi

    IPC分类号： H04B17/00

    CPC分类号： H04B7/0617 ,  H04B7/0632 ,  H04B17/24 ,  H04B17/309 ,  H04B17/336

    摘要： An apparatus and a method for determining a Channel Quality Indicator (CQI) using a beamforming in a multi-antenna system are provided. A transmitter for determining a CQI based at least partly upon the beamforming in the multi-antenna system includes a beam former for distinguishing frequency tone intervals having a constant channel across an entire frequency tone, forming a beam by multiplying frequency tones of the frequency tone interval having the constant channel by different beamforming weights, and transmitting a preamble signal. Hence, the users can be scheduled based at least partly upon the beamforming gain, and throughput can be enhanced through the practical MCS selection.

    摘要翻译： 提供了一种使用多天线系统中的波束成形来确定信道质量指示符（CQI）的装置和方法。 用于至少部分地基于多天线系统中的波束成形来确定CQI的发射机包括：波束形成器，用于区分整个频率音调具有恒定信道的频率间隔，通过将频率间隔的频率相乘来形成波束 通过不同的波束形成权重具有恒定信道，并发送前导码信号。 因此，可以至少部分地基于波束成形增益来调度用户，并且可以通过实际的MCS选择来增加吞吐量。