公开(公告)号：US09066431B2

公开(公告)日：2015-06-23

申请号：US13953881

申请日：2013-07-30

Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Rui-Wu Liu ,  Ming-Jaan Ho ,  Xian-Qin Hu

IPC: H05K3/02 ,  H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K3/26 ,  H05K1/09

CPC classification number: H05K1/09 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K3/067 ,  H05K3/068 ,  H05K3/10 ,  H05K3/243 ,  H05K3/244 ,  H05K3/26 ,  H05K3/282 ,  H05K3/288 ,  H05K2201/0108 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/075 ,  H05K2203/1545 ,  H05K2203/1572 ,  Y10T29/49155

Abstract: This disclosure relates to a printed circuit board comprising a light-pervious insulation layer, a patterned electrically conductive layer and a light-pervious overlay. The patterned electrically conductive layer includes a first black oxide layer, a copper layer and a second black oxide layer. The copper layer includes two opposite surfaces and a plurality of inner surfaces interconnecting the two opposite surfaces of the copper layer. The first black oxide layer is formed on one of the surfaces, and the second black oxide layer is formed on the other surface and the inner surfaces. The patterned electrically conductive layer is arranged on the light-pervious insulation layer. The light-pervious overlay is arranged on the second black oxide layer. A method for manufacturing the printed circuit board is also provided in this disclosure.

Abstract translation: 本公开涉及一种印刷电路板，其包括透光绝缘层，图案化导电层和透光覆盖层。 图案化导电层包括第一黑色氧化物层，铜层和第二黑色氧化物层。 铜层包括互连铜层的两个相对表面的两个相对表面和多个内表面。 第一黑色氧化物层形成在一个表面上，并且第二黑色氧化物层形成在另一个表面和内表面上。 图案化导电层设置在透光绝缘层上。 透光性覆盖层布置在第二黑色氧化物层上。 在本公开中还提供了制造印刷电路板的方法。

公开(公告)号：US11261328B2

公开(公告)日：2022-03-01

申请号：US17121616

申请日：2020-12-14

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Szu-Hsiang Su ,  Shou-Jui Hsiang ,  Mao-Feng Hsu ,  Ming-Jaan Ho

IPC: C08L79/08 ,  C08L51/00 ,  C08J3/24 ,  C08L51/08 ,  H05K1/03 ,  C08J5/18 ,  H05K3/38

Abstract: A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.

公开(公告)号：US10822522B2

公开(公告)日：2020-11-03

申请号：US16533932

申请日：2019-08-07

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Ming-Jaan Ho ,  Mao-Feng Hsu ,  Shou-Jui Hsiang ,  Nan-Kun Huang ,  Yu-Wen Kao ,  Chia-Yin Teng ,  Ching-Hsuan Lin

IPC: C09D179/08 ,  C08L63/00 ,  C08G73/10

Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar′ represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula of hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the modified polyimide compound has a degree of polymerization n of about 1 to about 50, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A modified polyimide compound and a polyimide film are also provided.

公开(公告)号：US08647518B2

公开(公告)日：2014-02-11

申请号：US13757857

申请日：2013-02-04

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Ming-Jaan Ho

IPC: H01B13/00

CPC classification number: H05K1/0296 ,  H05K3/022 ,  H05K3/386 ,  H05K3/4626 ,  H05K3/4655 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/2804

Abstract: A method for manufacturing a resin coating on copper foil includes following steps. Firstly, two diamines of 2,2-bis[4-(4-aminophenoxy)phenyl] propane and 4,4′-oxydianiline, and two acid anhydrides of pyromellitic diandydride and oxydiphthalic anhydride are added into a polar aprotic solvent and the solvent is stirred to form a mixed solution. Secondly, the mixed solution is heated to a temperature of about 170° C.-190° C. to allow a cross-linking reaction to be completed between the two diamines and the two acid anhydrides, thereby forming a thermoplastic polyimide adhesive fluid. The thermoplastic polyimide adhesive fluid is coated on a copper foil and cured to form a thermoplastic polyimide adhesive layer on the copper foil, thereby obtaining a resin coated copper foil. This disclosure also relates to resin coated copper foil and a method for manufacturing a multi-layer circuit board.

Abstract translation: 在铜箔上制造树脂涂层的方法包括以下步骤。 首先，将2-二[4-（4-氨基苯氧基）苯基]丙烷和4,4'-氧联二苯胺的二胺和均苯四甲酸二二异氰酸酯和氧联二邻苯二甲酸酐的两种酸酐加入极性非质子溶剂中，溶剂为 搅拌形成混合溶液。 其次，将混合溶液加热至约170℃-190℃的温度，以便在两种二胺和两种酸酐之间完成交联反应，由此形成热塑性聚酰亚胺粘合剂流体。 将热塑性聚酰亚胺粘合剂流体涂覆在铜箔上并固化以在铜箔上形成热塑性聚酰亚胺粘合剂层，从而获得涂覆有树脂的铜箔。 本公开还涉及树脂涂布铜箔和制造多层电路板的方法。

公开(公告)号：US10894882B2

公开(公告)日：2021-01-19

申请号：US15871141

申请日：2018-01-15

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Szu-Hsiang Su ,  Shou-Jui Hsiang ,  Mao-Feng Hsu ,  Ming-Jaan Ho

IPC: C08L79/08 ,  C08L51/08 ,  C08L51/00 ,  C08J3/24 ,  H05K1/03 ,  C08J5/18 ,  H05K3/38

Abstract: A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.

公开(公告)号：US10428238B2

公开(公告)日：2019-10-01

申请号：US15689166

申请日：2017-08-29

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Ming-Jaan Ho ,  Mao-Feng Hsu ,  Shou-Jui Hsiang ,  Nan-Kun Huang ,  Yu-Wen Kao ,  Chia-Yin Teng ,  Ching-Hsuan Lin

IPC: C09D179/08 ,  C08L63/00 ,  C08G73/10

Abstract: A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar′ represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A polyimide film and a method for manufacturing the polyimide film using the resin composition are also provided.