Abstract:
A physical quantity detecting device includes a metal block (a holding section) having six surfaces, inclination detectors (physical quantity detectors) respectively arranged on selected three surfaces among the six surfaces, an electronic component electrically connected to the inclination detectors, and a heat insulating material (a heat-conduction reducing section) present between the metal block and the electronic component and having thermal conductivity smaller than the thermal conductivity of the metal block.
Abstract:
A micro-electromechanical systems (MEMS) inertial sensor includes first, second, and third fixed electrodes, a first translational element to translate along a first direction, first mobile electrodes extending from the first translation element and being interdigitated with the first fixed electrodes to form first sensor assemblies, a second translation element to translate along a second direction, second mobile electrodes extending from the second translation element and being interdigitated with the second fixed electrodes to form second sensor assemblies, and a rotation element to rotate about the second direction, the rotation element having a surface opposite the third fixed electrodes to form third sensor assemblies, wherein the third fixed electrode being displaced from the surface of the rotation element along a third direction.
Abstract:
An acceleration sensor with improved impact resistance includes a beam portion connected to a supporting portion at a base side and connected to a weight portion at a top side. The beam portion has a T-shaped cross-section, and piezoresistors are located on an upper surface of the beam portion. The weight portion connects to a top of the beam portion and is arranged inside the supporting portion. A C-shaped slit is provided between the weight portion and the supporting portion so as to surround the weight portion. The weight portion includes an extended portion in which an end of a top surface layer on a side facing the beam portion extends out toward the beam portion beyond an end of the supporting substrate layer on a side facing the beam portion.
Abstract:
Methods and apparatuses are disclosed that assist in sensing underwater signals in connection with geophysical surveys. One embodiment relates to a transducer including a cantilever coupled to a base. The cantilever may include a beam and a first coupling surface angularly oriented from the beam, and the base may include a second coupling surface angularly oriented from the beam and substantially parallel to the first coupling surface of the cantilever. The transducer may further include a sensing material coupled between the first coupling surface of the cantilever and the second coupling surface of the base.
Abstract:
A method for manufacturing a micro-electro-mechanical system (MEMS) device is provided. The method comprises: providing a semiconductor substrate, the semiconductor substrate having a metal interconnection structure (100) formed therein; forming a first sacrificial layer (201) on the surface of the semiconductor substrate, the material of the first sacrificial layer is amorphous carbon; etching the first sacrificial layer to form a first recess (301); covering and forming a first dielectric layer (401) on the surface of the first sacrificial layer; thinning the first dielectric layer by a chemical mechanical polishing (CMP) process, until exposing the first sacrificial layer; forming a micromechanical structure layer (500) on the surface of the first sacrificial layer and exposing the first sacrificial layer, wherein a part of the micromechanical structure layer is connected to the first dielectric layer. The method avoids polishing the amorphous carbon, shortens the period of production, and improves the production efficiency
Abstract:
An acceleration sensor is formed using an etched layer sandwiched between first and second substrates. In this case, a structure including a movable portion which is displaceable in the thickness direction of the substrates, and a support frame are formed in the etched layer. In addition, first and second fixed electrodes are formed on the first and second substrates, respectively, at a position facing the movable portion. Further, a remaining sacrificial layer is provided on the substrate by leaving a portion of a second sacrificial layer when a first sacrificial layer is entirely etched away. Therefore, when the first sacrificial layer is etched away, corrosion of the structure and the support beams is prevented because the second sacrificial layer is preferentially corroded as compared to the structure.
Abstract:
A physical quantity detection device includes: a base portion; a movable portion supported by the base portion via a joint and shifting in accordance with a change of a physical quantity; a physical quantity detection element extending over the base portion and the movable portion; a first support member extending from the base portion and having a first fixing portion; and a second support member extending from the base portion and having a second fixing portion. The distance between the first fixing portion and the second fixing portion is shorter than the distance between the root of the first support member at the junction with the base portion and the root of the second support member at the junction with the base portion.
Abstract:
An acceleration sensor includes first and second opposed electrode units. The first opposed electrode unit includes a first electrode and a second electrode spaced away from and facing the first electrode, and provides a first capacitance. The second opposed electrode unit includes a third electrode and a fourth electrode spaced away from and facing the third electrode, and provides a second capacitance. The first and third electrodes are arranged along a first direction. A component of acceleration along the first direction applied to the object is detected based on the first and second capacitances. A control voltage is applied to the first and second opposed electrode units. The control voltage is changed when both of the first capacitance and the second capacitance simultaneously increase or decrease. This acceleration sensor detects the acceleration accurately.
Abstract:
A triaxial acceleration sensor which has a structure including a cover joined to a substrate including a mechanically operable functional unit to be sealed, is adapted in such a way that the joined state can be reliably obtained so as to not interfere with a displacement of the functional unit. A sealing frame is made of a heated polyimide on a periphery of an upper main surface of a substrate provided with a functional unit, and a sealing layer made of a polyimide is formed over an entire lower main surface of a cover. For integrating the substrate and the cover so as to seal the functional unit, the sealing frame and the sealing layer are joined to each other by heating and pressurizing the sealing frame and the sealing layer at a temperature that is about 50° C. to about 150° C. higher than a glass transition temperature of the polyimide while bringing the sealing frame and the sealing layer into contact with each other. In this case, a recess is formed in the vicinity of a portion of the sealing layer to be brought into contact with the sealing frame so that a bump, generated from the sealing layer which is deformed in the joining step, is prevented from protruding toward the functional unit.
Abstract:
A ferroelectric device comprises: a silicon substrate (a first substrate); a lower electrode (a first electrode) formed on one surface side of first substrate; a ferroelectric film formed on a surface of lower electrode opposite to first substrate side; and an upper electrode (a second electrode) formed on a surface of ferroelectric film opposite to lower electrode side. The ferroelectric film is formed of a ferroelectric material with a lattice constant difference from silicon. The ferroelectric device further comprises a shock absorbing layer formed of a material with better lattice matching with ferroelectric film than silicon and provided directly below the lower electrode. The first substrate is provided with a cavity that exposes a surface of shock absorbing layer opposite to lower electrode side.