公开(公告)号：US20090246615A1

公开(公告)日：2009-10-01

申请号：US12358032

申请日：2009-01-22

Applicant: Junyoung Park

Inventor： Junyoung Park

IPC: H01M6/42 ,  H01M4/02

CPC classification number: H01M4/02 ,  H01M2/0404 ,  H01M2/1055 ,  H01M2/30 ,  H01M10/425 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10037 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10818 ,  H05K2201/10871

Abstract: A battery pack that prevents a solder material from flowing down due to a tab electrically connecting a battery to a protective circuit board, thereby improving reliability, coupling efficiency, safety, and productivity is disclosed. The battery pack includes: a multi-cell battery having a positive electrode and a negative electrode, in which a plurality of battery cells are electrically connected to each other; a protective circuit board electrically connected to the multi-cell battery and having via holes; a pair of conductive tabs each including an insert portion inserted into a corresponding via hole and a bending portion integrally extending from the insert portion and bent from the insert portion; and a pair of soldering portions each being formed at at least some portions of a corresponding insert portion and a corresponding bending portion.

Abstract translation: 公开了一种电池组，其防止由于电池将电池连接到保护电路板而将焊料材料向下流动，从而提高了可靠性，耦合效率，安全性和生产率。 电池组包括：具有正电极和负电极的多单元电池，多个电池单元彼此电连接; 电连接到多节电池并具有通孔的保护电路板; 一对导电片，每个导电片包括插入对应的通孔中的插入部分和从插入部分整体延伸并从插入部分弯曲的弯曲部分; 以及一对焊接部分，每个焊接部分在相应的插入部分和对应的弯曲部分的至少一些部分处形成。

公开(公告)号：US07534110B2

公开(公告)日：2009-05-19

申请号：US11774967

申请日：2007-07-09

Applicant: William L. Brodsky

Inventor： William L. Brodsky

IPC: H01R12/00

CPC classification number: H05K3/366 ,  H05K2201/10189 ,  H05K2201/10818

Abstract: Electrically conductive L-shaped blades are disposed in an insulative body as a mechanism for mechanically and electrically connecting circuit cards to circuit boards. In particular, the interconnection device herein provides a mechanism for providing greater thermal and electrical properties for connections from voltage regulator modules to high current conducting planes within a printed wire board while at the same time increasing the available bulk material cross-sectional area available for current flow.

Abstract translation: 导电L形叶片设置在绝缘体中，作为将电路卡机械地和电连接到电路板的机构。 特别地，本文中的互连装置提供了一种机制，用于为印刷线路板内的电压调节器模块到高电流传导平面的连接提供更大的热和电特性，同时增加可用于电流的可用体积材料横截面积 流。

公开(公告)号：US20080013294A1

公开(公告)日：2008-01-17

申请号：US11774967

申请日：2007-07-09

Applicant: William Brodsky

Inventor： William Brodsky

IPC: H05K1/11

CPC classification number: H05K3/366 ,  H05K2201/10189 ,  H05K2201/10818

Abstract: Electrically conductive L-shaped blades are disposed in an insulative body as a mechanism for mechanically and electrically connecting circuit cards to circuit boards. In particular, the interconnection device herein provides a mechanism for providing greater thermal and electrical properties for connections from voltage regulator modules to high current conducting planes within a printed wire board while at the same time increasing the available bulk material cross-sectional area available for current flow.

Abstract translation: 导电L形叶片设置在绝缘体中，作为将电路卡机械地和电连接到电路板的机构。 特别地，本文中的互连装置提供了一种机制，用于为印刷线路板内的电压调节器模块到高电流传导平面的连接提供更大的热和电特性，同时增加可用于电流的可用体积材料横截面积 流。

公开(公告)号：US20070298287A1

公开(公告)日：2007-12-27

申请号：US11679975

申请日：2007-02-28

Applicant: Osamu Tajima ,  Yoshiaki Miyamoto

Inventor： Osamu Tajima ,  Yoshiaki Miyamoto

IPC: H01M14/00

CPC classification number: H01M2/34 ,  H01M10/425 ,  H05K3/328 ,  H05K3/3405 ,  H05K3/4015 ,  H05K2201/09172 ,  H05K2201/1034 ,  H05K2201/10818 ,  H05K2201/10962

Abstract: A circuit board device is disclosed that is able to be made thin. The a circuit board device includes a substrate having a notch at one end thereof, plural electrical parts mounted on an upper surface of the substrate, a resin portion burying the electrical parts, a metal plate arranged at an end portion of the upper surface of the substrate to cover the notch, and a lead connected to the metal plate and extending from the end of the substrate to the outside. One end of the lead is fit into the notch and is welded to a back side of the metal plate for connection to the metal plate.

Abstract translation: 公开了能够变薄的电路板装置。 一种电路板装置，包括在其一端具有缺口的基板，安装在基板的上表面上的多个电气部件，埋入电气部件的树脂部分，布置在所述基板的上表面的端部的金属板 衬底以覆盖缺口，以及引线，其连接到金属板并从衬底的端部延伸到外部。 引线的一端装配到凹口中并且焊接到金属板的背面，用于连接到金属板。

公开(公告)号：US07288831B2

公开(公告)日：2007-10-30

申请号：US11463127

申请日：2006-08-08

Applicant: Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

Inventor： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC: H01L23/495 ,  H01L31/0203

CPC classification number: H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Abstract translation: 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。

公开(公告)号：US20060284287A1

公开(公告)日：2006-12-21

申请号：US11463127

申请日：2006-08-08

Applicant: Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

Inventor： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC: H01L23/495

CPC classification number: H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted prong laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Abstract translation: 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向进行，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。

公开(公告)号：US07070418B1

公开(公告)日：2006-07-04

申请号：US11138982

申请日：2005-05-26

Applicant: Tiger Wang

Inventor： Tiger Wang

IPC: H01R12/00

CPC classification number: H01R4/182 ,  F21K9/00 ,  F21V19/0025 ,  F21Y2115/10 ,  H01R12/58 ,  H05K3/202 ,  H05K3/326 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084

Abstract: A light emitting diode (LED) assembly has a printed circuit board, multiple conductors and multiple light emitting diodes (LEDs). The printed circuit board has multiple mounting holes. The conductors are mounted on the PCB and serve respectively as positive electrode conductors and negative electrode conductors. Each conductor has a contact pin and at least one through hole with an inner edge. Each LED is mounted on the positive electrode conductor and the negative electrode conductor and has a die and two contact tabs. Each contact tab has a through hole having an inner edge and multiple hooks extending from the inner edge of the through hole in the contact tab and hooking the inner edge of the at least one through hole in the conductor. Consequently, neither solder nor welding is required to assemble the LED assembly.

Abstract translation: 发光二极管（LED）组件具有印刷电路板，多个导体和多个发光二极管（LED）。 印刷电路板有多个安装孔。 导体安装在PCB上，分别用作正极导体和负极导体。 每个导体具有接触销和至少一个具有内边缘的通孔。 每个LED安装在正极导体和负极导体上，并具有一个模具和两个接触片。 每个接触片具有一个通孔，该通孔具有一个内边缘和多个钩子，它们从接触片中的通孔的内边缘延伸出来并钩住导体中至少一个通孔的内边缘。 因此，组装LED组件不需要焊料或焊接。

公开(公告)号：US06716673B2

公开(公告)日：2004-04-06

申请号：US10147672

申请日：2002-05-15

Applicant: Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

Inventor： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC: H01L2348

CPC classification number: H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Abstract translation: 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。

公开(公告)号：US20030177637A1

公开(公告)日：2003-09-25

申请号：US10106977

申请日：2002-03-25

Inventor： Michael C. Seckora

IPC: H05K003/30 ,  H05K003/34 ,  H05K001/16 ,  H05K013/00

CPC classification number: H05K1/0243 ,  H05K1/0231 ,  H05K3/305 ,  H05K3/3426 ,  H05K2201/09727 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49169

Abstract: Methods and apparatus provide for electrical coupling of electrical components to traces on a substrate such that impedance mismatches otherwise experienced in high frequency operation are avoided. Connecting elements having length, width, and thickness, are provided for terminals of a component to be connected to a trace. The connecting element is electrically coupled between the terminal and the trace, typically by soldering. The dimensions of the connecting element are chosen to reduce or eliminate the impedance mismatch which would result from a direct connection between the trace and component. Connecting elements are generally L-shaped, i.e., having first and second planar portions perpendicular with respect to each other, and having a curving portion that connects the first and second planar portions. In one embodiment, dimensions of at least a portion of the connecting element are such that its width increases as its distance from a ground plane within the substrate increases.

Abstract translation: 方法和装置提供电气部件与衬底上的迹线的电耦合，使得避免了在高频操作中经历的阻抗失配。 具有长度，宽度和厚度的连接元件被提供给要连接到轨迹的部件的端子。 连接元件通常通过焊接电耦合在端子和迹线之间。 选择连接元件的尺寸以减少或消除由迹线和部件之间的直接连接导致的阻抗失配。 连接元件通常为L形，即具有相对于彼此垂直的第一和第二平面部分，并且具有连接第一和第二平面部分的弯曲部分。 在一个实施例中，连接元件的至少一部分的尺寸使得其宽度随着与衬底内的接地平面的距离的增加而增加。

公开(公告)号：US5619018A

公开(公告)日：1997-04-08

申请号：US415413

申请日：1995-04-03

Applicant: Markku J. Rossi

Inventor： Markku J. Rossi

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/30 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/308 ,  H01R12/523 ,  H05K3/4046 ,  H05K3/4641 ,  H05K1/0272 ,  H05K1/09 ,  H05K2201/0352 ,  H05K2201/09063 ,  H05K2201/0919 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/1059 ,  H05K2201/10818 ,  H05K2201/10909 ,  H05K3/4676 ,  H05K3/4697

Abstract: A multilayer printed circuit board comprising conducting layers of a first material and conducting layers of a second material includes noncorrosive low resistance electrical contacts between conducting layers of the first and second material. The noncorrosive low resistance contacts allow the use of light weight conducting materials for particular layers of the circuit board to produce a light weight multilayer circuit board.

Abstract translation: 包括第一材料的导电层和第二材料的导电层的多层印刷电路板包括在第一和第二材料的导电层之间的非腐蚀性低电阻电接触。 非腐蚀性低电阻触点允许使用用于电路板的特定层的重量轻的导电材料来制造重量轻的多层电路板。