公开(公告)号：US09627535B2

公开(公告)日：2017-04-18

申请号：US15055805

申请日：2016-02-29

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Ruilong Xie ,  Hoon Kim ,  Chanro Park ,  Min Gyu Sung

IPC: H01L29/66 ,  H01L29/08 ,  H01L29/78 ,  H01L29/06 ,  H01L29/16 ,  H01L29/161 ,  H01L29/165

CPC classification number: H01L29/7848 ,  H01L29/0847 ,  H01L29/1608 ,  H01L29/161 ,  H01L29/165 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/66636 ,  H01L29/66795 ,  H01L29/78 ,  H01L29/785 ,  H01L29/7851

Abstract: A device includes a gate structure having an axial length that is positioned above an active region of a semiconductor substrate and includes a first gate structure portion positioned above the active region and second gate structure portions positioned above an isolation region formed in the semiconductor substrate. An etch stop layer is positioned on the gate structure and covers sidewall surfaces of the second gate structure portions but does not cover any sidewall surfaces of the first gate structure portion. First and second contact trenches extend continuously along the first gate structure portion for less than the axial length of the gate structure and are positioned above at least a portion of the active region on respective opposing first and second sides of the gate structure. An epi semiconductor material is positioned on the active region within each of the first and second contact trenches.

公开(公告)号：US20170092721A1

公开(公告)日：2017-03-30

申请号：US15363607

申请日：2016-11-29

Applicant: International Business Machines Corporation ,  GlobalFoundries, Inc.

Inventor： Cheng Chi ,  Fee Li Lie ,  Chi-Chun Liu ,  Ruilong Xie

IPC: H01L29/06 ,  H01L27/088

Abstract: A method of making a semiconductor device includes disposing a first hard mask (HM), amorphous silicon, and second HM on a substrate; disposing oxide and neutral layers on the second HM; removing a portion of the oxide and neutral layers to expose a portion of the second HM; forming a guiding pattern by selectively backfilling with a polymer; forming a self-assembled block copolymer (BCP) on the guiding pattern; removing a portion of the BCP to form an etch template; transferring the pattern from said template into the substrate and forming uniform silicon fin arrays with two types of HM stacks with different materials and heights; gap-filling with oxide followed by planarization; selectively removing and replacing the taller HM stack with a third HM material; planarizing the surface and exposing both HM stacks; and selectively removing the shorter HM stack and the silicon fins underneath.

公开(公告)号：US20170084500A1

公开(公告)日：2017-03-23

申请号：US15366223

申请日：2016-12-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  GLOBALFOUNDRIES Inc

Inventor： Balasubramanian Pranatharthiharan ,  Ruilong Xie ,  Chun-Chen Yeh

IPC: H01L21/8238 ,  H01L27/092 ,  H01L23/522 ,  H01L29/66

CPC classification number: H01L21/823871 ,  H01L21/28518 ,  H01L21/76897 ,  H01L21/823814 ,  H01L21/823864 ,  H01L23/5226 ,  H01L27/092 ,  H01L29/0847 ,  H01L29/41725 ,  H01L29/456 ,  H01L29/665 ,  H01L29/6653 ,  H01L29/66545 ,  H01L29/66628

Abstract: A method for fabricating a dual silicide device includes growing source and drain (S/D) regions for an N-type device, forming a protection layer over a gate structure and the S/D regions of the N-type device and growing S/D regions for a P-type device. A first dielectric layer is conformally deposited and portions removed to expose the S/D regions. Exposed S/D regions for the P-type device are silicided to form a liner. A second dielectric layer is conformally deposited. A dielectric fill is formed over the second dielectric layer. Contact holes are opened through the second dielectric layer to expose the liner for the P-type device and expose the protection layer for the N-type device. The S/D regions for the N-type device are exposed by opening the protection layer. Exposed S/D regions adjacent to the gate structure are silicided to form a liner for the N-type device. Contacts are formed.

公开(公告)号：US09601366B2

公开(公告)日：2017-03-21

申请号：US14810143

申请日：2015-07-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  GLOBALFOUNDRIES, INC.

Inventor： Andrew M. Greene ,  Ryan O. Jung ,  Ruilong Xie ,  Peng Xu

IPC: H01L27/088 ,  H01L21/8234 ,  H01L29/66 ,  H01L21/762 ,  H01L21/02 ,  H01L29/78 ,  H01L29/06 ,  H01L29/423 ,  H01L21/3213

CPC classification number: H01L21/76224 ,  H01L21/0217 ,  H01L21/28114 ,  H01L21/28123 ,  H01L21/32139 ,  H01L21/823437 ,  H01L21/823481 ,  H01L21/823814 ,  H01L21/823821 ,  H01L23/60 ,  H01L27/088 ,  H01L27/0924 ,  H01L27/1211 ,  H01L29/0649 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/42368 ,  H01L29/42376 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/66628 ,  H01L29/78

Abstract: A method for forming a gate cut region includes forming a tapered profile gate line trench through a hard mask, a dummy layer and a dummy dielectric formed on a substrate, forming a dummy gate dielectric and a dummy gate conductor in the trench and planarizing a top surface to reach the hard mask. The dummy gate conductor is patterned to form a cut trench in a cut region. The dummy gate conductor is recessed, and the cut trench is filled with a first dielectric material. The dummy layer is removed and spacers are formed. A gate line is opened up and the dummy gate conductor is removed from the gate line trench. A gate dielectric and conductor are deposited, and a gate cap layer provides a second dielectric that is coupled to the first dielectric material in the cut trench to form a cut last structure.

公开(公告)号：US20170077247A1

公开(公告)日：2017-03-16

申请号：US14526980

申请日：2014-10-29

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Ruilong Xie ,  Xiuyu Cai

IPC: H01L29/417 ,  H01L29/78 ,  H01L29/66

CPC classification number: H01L29/41783 ,  H01L21/76834 ,  H01L21/76897 ,  H01L29/41791 ,  H01L29/66515 ,  H01L29/6653 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/66795 ,  H01L29/78 ,  H01L29/7851

Abstract: One method disclosed includes forming a final gate structure in a gate cavity that is laterally defined by sidewall spacers, removing a portion of the sidewall spacers to define recessed sidewall spacers, removing a portion of the final gate structure to define a recessed final gate structure and forming an etch stop on the recessed sidewall spacers and the recessed final gate structure. A transistor device disclosed herein includes a final gate structure that has an upper surface positioned at a first height level above a surface of a substrate, sidewall spacers positioned adjacent the final gate structure, the sidewall spacers having an upper surface that is positioned at a second, greater height level above the substrate, an etch stop layer formed on the upper surfaces of the sidewall spacers and the final gate structure, and a conductive contact that is conductively coupled to a contact region of the transistor.

Abstract translation: 所公开的一种方法包括在门腔中形成最终栅极结构，其由侧壁间隔件横向限定，去除侧壁间隔物的一部分以限定凹陷的侧壁间隔物，去除最终栅极结构的一部分以限定凹陷的最终栅极结构， 在凹陷的侧壁间隔件和凹入的最终栅极结构上形成蚀刻停止。 本文公开的晶体管器件包括最终栅极结构，其具有位于衬底表面上方的第一高度水平处的上表面，邻近最终栅极结构定位的侧壁间隔物，侧壁间隔物具有位于第二位置的上表面 在衬底上方的更高的高度级，形成在侧壁间隔物和最终栅极结构的上表面上的蚀刻停止层，以及导电耦合到晶体管的接触区域的导电接触。

公开(公告)号：US09576956B2

公开(公告)日：2017-02-21

申请号：US15157861

申请日：2016-05-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  GLOBALFOUNDRIES INC.

Inventor： Xiuyu Cai ,  Kangguo Cheng ,  Ali Khakifirooz ,  Ruilong Xie ,  Tenko Yamashita

IPC: H01L27/088 ,  H01L27/02 ,  H01L29/78 ,  H01L29/66 ,  H01L29/417 ,  H01L29/06 ,  H01L21/336

CPC classification number: H01L27/0886 ,  H01L27/0207 ,  H01L29/0649 ,  H01L29/41791 ,  H01L29/6656 ,  H01L29/66795 ,  H01L29/6681 ,  H01L29/7848 ,  H01L29/785

Abstract: A method of forming a semiconductor device that includes forming a plurality of semiconductor pillars. A dielectric spacer is formed between at least one set of adjacent semiconductor pillars. Semiconductor material is epitaxially formed on sidewalls of the adjacent semiconductor pillars, wherein the dielectric spacer obstructs a first portion of epitaxial semiconductor material formed on a first semiconductor pillar from merging with a second portion of epitaxial semiconductor material formed on a second semiconductor pillar.

Abstract translation: 一种形成包括形成多个半导体柱的半导体器件的方法。 在至少一组相邻的半导体柱之间形成介电间隔物。 半导体材料外延地形成在相邻半导体柱的侧壁上，其中电介质间隔物阻挡形成在第一半导体柱上的外延半导体材料的第一部分与形成在第二半导体柱上的第二部分外延半导体材料合并。

公开(公告)号：US20170047418A1

公开(公告)日：2017-02-16

申请号：US14822490

申请日：2015-08-10

Applicant: GLOBALFOUNDRIES, INC.

Inventor： Su Chen Fan ,  Lars W. Liebmann ,  Ruilong Xie

IPC: H01L29/45 ,  H01L29/66 ,  H01L21/3105 ,  H01L21/768

CPC classification number: H01L23/535 ,  H01L21/31053 ,  H01L21/31058 ,  H01L21/76895 ,  H01L21/76897 ,  H01L29/0649 ,  H01L29/4236 ,  H01L29/45 ,  H01L29/7827 ,  H01L2221/1063

Abstract: A method for forming a gate tie-down includes exposing an active area to form trench contact openings and forming trench contacts therein. An etch stop layer is formed on the trench contacts and on spacers of adjacent gate structures. An interlevel dielectric (ILD) is deposited to fill over the etch stop layer. The ILD and the etch stop layer on one side of the gate structure are opened up to provide an exposed etch stop layer portion. The gate structure is recessed to expose a gate conductor. The exposed etch stop layer portion is removed. A conductive material is deposited to provide a self-aligned contact down to the trench contact on the one side of the gate structure, to form a gate contact down to the gate conductor and to form a horizontal connection within the ILD over the active area between the gate conductor and the self-aligned contact.

Abstract translation: 形成栅极结合的方法包括暴露有源区以形成沟槽接触开口并在其中形成沟槽接触。 在沟槽触点和相邻栅极结构的间隔物上形成蚀刻停止层。 沉积层间电介质（ILD）以填满蚀刻停止层。 栅极结构的一侧上的ILD和蚀刻停止层被打开以提供暴露的蚀刻停止层部分。 栅极结构凹陷以露出栅极导体。 去除暴露的蚀刻停止层部分。 沉积导电材料以提供与栅极结构一侧上的沟槽接触的自对准接触，以形成到栅极导体下方的栅极接触，并且在ILD之间的有效区域之间形成水平连接 栅极导体和自对准触点。

公开(公告)号：US20170047253A1

公开(公告)日：2017-02-16

申请号：US14822340

申请日：2015-08-10

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Chanro Park ,  Ruilong Xie ,  Min Gyu Sung ,  Hoon Kim

IPC: H01L21/768 ,  H01L21/311 ,  H01L29/66 ,  H01L27/088 ,  H01L29/40 ,  H01L29/417 ,  H01L21/8234 ,  H01L21/02 ,  H01L21/3105

CPC classification number: H01L21/76897 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02362 ,  H01L21/31051 ,  H01L21/31055 ,  H01L21/31105 ,  H01L21/76802 ,  H01L21/76807 ,  H01L21/76816 ,  H01L21/76837 ,  H01L21/823437 ,  H01L21/823475 ,  H01L27/088 ,  H01L29/401 ,  H01L29/41758 ,  H01L29/41783 ,  H01L29/41791 ,  H01L29/66545 ,  H01L29/66553 ,  H01L29/6656 ,  H01L29/66795 ,  H01L29/785 ,  H01L2029/7858 ,  H01L2221/1026 ,  H01L2221/1036

Abstract: One illustrative method disclosed includes, among other things, forming a silicon dioxide etch stop layer on and in contact with a source/drain region and adjacent silicon nitride sidewall spacers positioned on two laterally spaced-apart transistors having silicon dioxide gate cap layers, performing a first etching process through an opening in a layer of insulating material to remove the silicon nitride material positioned above the source/drain region, performing a second etching process to remove a portion of the silicon dioxide etch stop layer and thereby expose a portion of the source/drain region, and forming a conductive self-aligned contact that is conductively coupled to the source/drain region.

Abstract translation: 所公开的一种示例性方法包括在源极/漏极区域上形成二氧化硅蚀刻停止层并与源极/漏极区域接触的相邻的氮化硅侧壁间隔物，其位于具有二氧化硅栅极盖层的两个横向间隔开的晶体管上， 通过绝缘材料层中的开口进行第一蚀刻工艺，以去除位于源/漏区域上方的氮化硅材料，执行第二蚀刻工艺以去除二氧化硅蚀刻停止层的一部分，从而暴露出源的一部分 /漏极区域，并且形成导电地与源极/漏极区域耦合的导电自对准接触。

公开(公告)号：US09570397B1

公开(公告)日：2017-02-14

申请号：US14964786

申请日：2015-12-10

Applicant: International Business Machines Corporation ,  GlobalFoundries, Inc.

Inventor： Su Chen Fan ,  Vimal Kamineni ,  Andre P. Labonte ,  Ruilong Xie

IPC: H01L23/535 ,  H01L21/768 ,  H01L23/528 ,  H01L23/532

CPC classification number: H01L23/5283 ,  H01L21/76805 ,  H01L21/76808 ,  H01L21/76816 ,  H01L21/76879 ,  H01L21/76895 ,  H01L21/76897 ,  H01L23/528 ,  H01L23/53228 ,  H01L23/53257 ,  H01L23/53295 ,  H01L23/535

Abstract: A local interconnect structure includes a substrate having a dielectric layer and at least one semiconductor contact structure embedded in the dielectric layer. An electrically conductive material is deposited in a non-eroded contact trench that defines at least one electrically conducive contact via. The contact via extends from a first end that is flush with an upper surface of the dielectric layer to a second end that contacts the at one semiconductor contact structure. A local conductive material layer is formed in the dielectric layer and contacts the first end of the contact via. The non-eroded contact trench includes sharp upper corners formed at approximately ninety degrees with respect to the first end of the contact via.

Abstract translation: 局部互连结构包括具有电介质层和嵌入电介质层中的至少一个半导体接触结构的衬底。 导电材料沉积在限定至少一个导电接触通孔的非侵蚀接触沟槽中。 接触通孔从与电介质层的上表面齐平的第一端延伸到接触一个半导体接触结构的第二端。 在电介质层中形成局部导电材料层并接触接触通孔的第一端。 非侵蚀接触沟槽包括相对于接触通孔的第一端大致九十度形成的尖锐的上角。

公开(公告)号：US20170040224A1

公开(公告)日：2017-02-09

申请号：US15252586

申请日：2016-08-31

Applicant: International Business Machines Corporation ,  GlobalFoundries, Inc.

Inventor： Rama Kambhampati ,  Junli Wang ,  Ruilong Xie ,  Tenko Yamashita

IPC: H01L21/8238 ,  H01L29/66

CPC classification number: H01L27/0924 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823821 ,  H01L21/823864 ,  H01L29/1054 ,  H01L29/16 ,  H01L29/161 ,  H01L29/66545 ,  H01L29/7848

Abstract: A method for forming field effect transistors comprises forming a first dummy gate stack over a first fin, forming a second dummy gate stack over a second fin, depositing a first layer of spacer material on the first dummy gate stack, the first fin, the second dummy gate stack, and the second fin, patterning a first masking layer on the first dummy gate stack and the first fin, etching to remove portions of the first layer of spacer material and form a spacer adjacent to the second dummy gate stack, removing the first masking layer, epitaxially growing a silicon material on the second fin, depositing a layer of oxide material on the first layer of spacer material, the first epitaxial material and the second dummy gate stack, and depositing a second layer of spacer material on the layer of oxide material.

Abstract translation: 一种用于形成场效应晶体管的方法包括在第一鳍上形成第一虚拟栅极堆叠，在第二鳍片上形成第二虚拟栅极叠层，在第一伪栅极叠层上沉积第一层间隔物材料， 虚拟栅极堆叠和第二鳍片，在第一伪栅极堆叠和第一鳍片上构图第一掩模层，蚀刻以去除第一层间隔物材料的部分并形成邻近第二伪栅极叠层的间隔区， 第一掩模层，在所述第二鳍上外延生长硅材料，在所述第一隔离层材料层上沉积氧化物层，所述第一外延材料和所述第二伪栅极堆叠，以及在所述层上沉积第二隔离层材料层 的氧化物质。