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    Process of forming a micromechanical system containing an anti-stiction gas-phase lubricant
    222.
    发明申请
    Process of forming a micromechanical system containing an anti-stiction gas-phase lubricant 有权
    形成含有抗静电气相润滑剂的微机械系统的方法

    公开(公告)号：US20070115530A1

    公开(公告)日：2007-05-24

    申请号：US11315920

    申请日：2005-12-22

    Applicant: Dongmin Chen ,  Fulin Xiong

    Inventor： Dongmin Chen ,  Fulin Xiong

    IPC: G02B26/00

    CPC classification number: G02B1/14 ,  B81B3/0005 ,  B81B2201/042 ,  B81C1/0096 ,  B81C2201/112 ,  B82Y30/00 ,  G02B21/32 ,  G02B27/0006

    Abstract: Embodiments of the present invention generally relate to a process of forming a device that has an improved usable lifetime due to the addition of a gas-phase lubricant that reduces the likelihood of stiction occurring between the various moving parts in an electromechanical device. One advantage of the disclosed device is that a gas-phase lubricant has a high diffusion rate and, therefore, is self-replenishing, meaning that it can quickly move back into a contact region after being physically displaced from the region by the contacting surfaces of the device during operation. Consequently, the gas-phase lubricant is more reliable than conventional solid or liquid lubricants in preventing stiction-related device failures.

    Abstract translation: 本发明的实施方案一般涉及一种形成装置的方法，该装置由于添加气相润滑剂而具有改善的使用寿命，所述气相润滑剂降低了在机电装置中各种运动部件之间出现静电的可能性。 所公开的装置的一个优点是气相润滑剂具有高扩散速率，因此是自补充的，这意味着它可以在通过接触区域的接触表面物理移位之后迅速地移回接触区域 该设备在运行期间。 因此，气相润滑剂比传统的固体或液体润滑剂在防止与静脉相关的装置故障方面更可靠。

    PREFERENTIALLY DEPOSITED LUBRICANT TO PREVENT ANTI-STICTION IN MICROMECHANICAL SYSTEMS
    223.
    发明申请
    PREFERENTIALLY DEPOSITED LUBRICANT TO PREVENT ANTI-STICTION IN MICROMECHANICAL SYSTEMS 有权

    公开(公告)号：US20070114883A1

    公开(公告)日：2007-05-24

    申请号：US11556155

    申请日：2006-11-02

    Applicant: Dongmin Chen ,  Fulin Xiong ,  William Worley

    Inventor： Dongmin Chen ,  Fulin Xiong ,  William Worley

    IPC: H01L41/00

    CPC classification number: B81C1/0096 ,  B81B3/0005 ,  B81B2201/042 ,  B81C2201/112 ,  B82Y30/00

    Abstract: Embodiments of the present invention generally relate to a device that has an improved usable lifetime due to the presence of a lubricant that reduces the likelihood of stiction occurring between the various moving parts in an electromechanical device. Embodiments of the present invention also generally include a device, and a method of forming a device, that has one or more surfaces or regions that have a volume of lubricant disposed thereon that acts as a ready supply of “fresh” lubricant to prevent stiction occurring between interacting components found within the device. In one aspect, components within the volume of lubricant form a gas or vapor phase that reduces the chances of stiction-related failure in the formed device. In one example, aspects of this invention may be especially useful for fabricating and using micromechanical devices, such as MEMS devices, NEMS devices, or other similar thermal or fluidic devices.

    Antistiction MEMS substrate and method of manufacture
    225.
    发明申请
    Antistiction MEMS substrate and method of manufacture 审中-公开
    抗静电MEMS基板及其制造方法

    公开(公告)号：US20060278942A1

    公开(公告)日：2006-12-14

    申请号：US11151415

    申请日：2005-06-14

    Applicant: Paul Rubel

    Inventor： Paul Rubel

    IPC: H01L29/84 ,  H01L21/00 ,  C23C16/00

    CPC classification number: C23C16/56 ,  B81B3/0005 ,  B81B3/001 ,  B81C2201/112 ,  C23C16/345

    Abstract: A composite wafer for fabricating MEMS devices is provided with a plurality of antistiction bumps, buried under a device layer of the composite wafer. The antistiction bumps are prepared lithographically, by patterning an antistiction material prior to the assembly of the composite wafer.

    Abstract translation: 用于制造MEMS器件的复合晶片设置有埋在复合晶片的器件层下方的多个抗静电凸块。 通过在复合晶片的组装之前图案化抗静电材料，制备抗静电凸块。

    Anti-stiction technique for electromechanical systems and electromechanical device employing same
    226.
    发明申请
    Anti-stiction technique for electromechanical systems and electromechanical device employing same 有权

    公开(公告)号：US20060246631A1

    公开(公告)日：2006-11-02

    申请号：US11115828

    申请日：2005-04-27

    Applicant: Markus Lutz ,  Aaron Partridge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

    Inventor： Markus Lutz ,  Aaron Partridge ,  Wilhelm Frey ,  Markus Ulm ,  Matthias Metz ,  Brian Stark ,  Gary Yama

    IPC: H01L21/44

    CPC classification number: B81C1/0096 ,  B81B3/0005 ,  B81C2201/112 ,  B82Y30/00 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

    Abstract: A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.

    Tungsten coated silicon fingers
    227.
    发明申请
    Tungsten coated silicon fingers 有权
    镀钨硅指

    公开(公告)号：US20060027020A1

    公开(公告)日：2006-02-09

    申请号：US10914006

    申请日：2004-08-06

    Applicant: Paul Ocansey ,  Juergen Foerstner

    Inventor： Paul Ocansey ,  Juergen Foerstner

    IPC: G01P15/00 ,  B05D1/36 ,  C23F1/00

    CPC classification number: B81B3/0005 ,  B81B2201/0235 ,  B81C1/0096 ,  B81C2201/112 ,  C23C16/14 ,  G01P15/0802 ,  G01P15/125

    Abstract: Methods and apparatus are provided for preparing sensing fingers for use in a highly integrated accelerometer. The method includes steps for forming a tungsten/tungsten silicide coating on a silicon finger. The tungsten/tungsten silicide coating adds mass to the silicon finger. The method includes steps of forming silicon fingers from layers of silicon, oxides, and capping material. The silicon fingers are then exposed to tungsten containing gases under conditions to promote the formation of a tungsten silicide seed layer on the exposed silicon surfaces. The tungsten layer is then grown to a desired thickness through a growth step. The coated silicon fingers display improved resistance to stiction as compared to uncoated silicon fingers.

    Abstract translation: 提供了用于准备用于高度集成的加速度计中的传感指的方法和装置。 该方法包括在硅指状物上形成钨/硅化钨涂层的步骤。 钨/硅化钨涂层增加了硅胶的质量。 该方法包括从硅，氧化物和封盖材料层形成硅指的步骤。 然后在允许在暴露的硅表面上形成硅化钨晶种层的条件下将硅指暴露于含钨气体的条件下。 然后通过生长步骤将钨层生长至所需厚度。 与未涂覆的硅指相比，涂覆的硅指显示改进的粘性阻力。

    Method of manufacturing acceleration sensor
    229.
    发明授权
    Method of manufacturing acceleration sensor 失效
    制造加速度传感器的方法

    公开(公告)号：US06858457B2

    公开(公告)日：2005-02-22

    申请号：US10308029

    申请日：2002-12-03

    Applicant: Yasuo Yamaguchi ,  Teruya Fukaura ,  Kunihiro Nakamura

    Inventor： Yasuo Yamaguchi ,  Teruya Fukaura ,  Kunihiro Nakamura

    IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  H01L29/84 ,  H01L21/00

    CPC classification number: G01P15/125 ,  B81B3/0008 ,  B81B2201/0235 ,  B81C1/0092 ,  B81C2201/112 ,  G01P15/0802

    Abstract: Provided is a method of manufacturing an acceleration sensor capable of preventing bonding of a movable electrode and a fixed electrode. A stain film 8 for reducing bonding adsorption force is formed on side surfaces of a movable electrode 1, fixed electrodes 2a and 2b and a frame portion 7. In the case in which the movable electrode 1 and the fixed electrodes 2a and 2b are to be formed of a silicon substrate, it is preferable that an insulating film having irregular bonding of silicon atoms and oxygen atoms and irregular bonding of silicon atoms and nitrogen atoms should be employed for the stain film 8, for example. The formation of the stain film 8 can suppress the bonding between the movable electrode 1 and the fixed electrodes 2a and 2b even if Coulomb force is generated between both electrodes when the silicon substrate and a back side substrate 4 are joined by using an anode junction method.

    Abstract translation: 提供一种制造能够防止可动电极和固定电极的接合的加速度传感器的方法。 在可动电极1，固定电极2a，2b和框架部分7的侧面上形成用于降低结合吸附力的污渍膜8.在可动电极1和固定电极2a和2b将成为 由硅基板形成，例如，优选使用具有硅原子和氧原子的不规则键合的绝缘膜以及硅原子和氮原子的不规则键合。 即使通过使用阳极接合方法将硅基板和背面基板4接合时，即使在两个电极之间产生库仑力也可以抑制可动电极1和固定电极2a和2b之间的接合 。

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