Abstract:
The present invention relates to a flash memory device with EEPROM functionality. The flash memory device is byte-erasable and bit-programmable.
Abstract:
A non-volatile memory cell includes a semiconductor substrate of first conductivity type, first and second spaced-apart regions in the substrate of second conductivity type, with a channel region in the substrate therebetween. A floating gate has a first portion disposed vertically over a first portion of the channel region, and a second portion disposed vertically over the first region. The floating gate includes a sloping upper surface that terminates with one or more sharp edges. An erase gate is disposed vertically over the floating gate with the one or more sharp edges facing the erase gate. A control gate has a first portion disposed laterally adjacent to the floating gate, and vertically over the first region. A select gate has a first portion disposed vertically over a second portion of the channel region, and laterally adjacent to the floating gate.
Abstract:
The present invention relates to a flash memory device with EEPROM functionality. The flash memory device is byte-erasable and bit-programmable.
Abstract:
A semiconductor device having a silicon substrate with a first area including a buried insulation layer with silicon over and under the insulation layer and a second area in which the substrate lacks buried insulation disposed under any silicon. Logic devices are formed in the first area having spaced apart source and drain regions formed in the silicon that is over the insulation layer, and a conductive gate formed over and insulated from a portion of the silicon that is over the insulation layer and between the source and drain regions. Memory cells are formed in the second area that include spaced apart second source and second drain regions formed in the substrate and defining a channel region therebetween, a floating gate disposed over and insulated from a first portion of the channel region, and a select gate disposed over and insulated from a second portion of the channel region.
Abstract:
A memory device, and method of making the same, in which a trench is formed into a substrate of semiconductor material. The source region is formed under the trench, and the channel region between the source and drain regions includes a first portion that extends substantially along a sidewall of the trench and a second portion that extends substantially along the surface of the substrate. The floating gate is disposed in the trench, and is insulated from the channel region first portion for controlling its conductivity. The control gate is disposed over and insulated from the channel region second portion, for controlling its conductivity. The erase gate is disposed at least partially over and insulated from the floating gate. Any portion of the trench between the pair of floating gates is free of electrically conductive elements except for a lower portion of the erase gate.
Abstract:
A memory device, and method of making the same, in which a trench is formed into a substrate of semiconductor material. The source region is formed under the trench, and the channel region between the source and drain regions includes a first portion that extends substantially along a sidewall of the trench and a second portion that extends substantially along the surface of the substrate. The floating gate is disposed in the trench, and is insulated from the channel region first portion for controlling its conductivity. A control gate is disposed over and insulated from the channel region second portion, for controlling its conductivity. An erase gate is disposed at least partially over and insulated from the floating gate. An electrically conductive coupling gate is disposed in the trench, adjacent to and insulated from the floating gate, and over and insulated from the source region.
Abstract:
A memory cell formed by forming a trench in the surface of a substrate. First and second spaced apart regions are formed in the substrate with a channel region therebetween. The first region is formed under the trench. The channel region includes a first portion that extends along a sidewall of the trench and a second portion that extends along the surface of the substrate. A charge trapping layer in the trench is adjacent to and insulated from the first portion of the channel region for controlling the conduction of the channel region first portion. An electrically conductive gate in the trench is adjacent to and insulated from the charge trapping layer and from the first region and is capacitively coupled to the charge trapping layer. An electrically conductive control gate is disposed over and insulated from the second portion of the channel region for controlling its conduction.
Abstract:
A method of operating a memory cell that comprises first and second regions spaced apart in a substrate with a channel region therebetween, a floating gate disposed over the channel region and the first region, a control gate disposed over the channel region and laterally adjacent to the floating gate with a portion disposed over the floating gate, and a coupling gate disposed over the first region and laterally adjacent to the floating gate. A method of erasing the memory cell includes applying a positive voltage to the control gate and a negative voltage to the coupling gate. A method of reading the memory cell includes applying positive voltages to the control gate, to the coupling gate, and to one of the first and second regions.
Abstract:
In one example, a method of testing a plurality of non-volatile memory cells in an array of non-volatile memory cells, wherein the array is arranged in rows and columns, wherein each row is coupled to a word line and each column is coupled to a bit line, and wherein each word line is selectively coupled to a row decoder and each bit line is selectively coupled to a column decoder, comprises asserting, by the row decoder, all word lines in the array; asserting, by the column decoder, all bit lines in the array; performing a deep programming operation on the array of non-volatile memory cells; and measuring a total current received from the bit lines.
Abstract:
A method of forming a device on a semiconductor substrate having first, second, third and dummy areas, includes recessing the substrate upper surface in the first, second and dummy areas, forming a first conductive layer over the substrate, removing the first conductive layer from the third area and a second portion of the dummy area, forming a first insulation layer over the substrate, forming first trenches through the first insulation layer and into the substrate in the third area and the second portion of the dummy area, forming second trenches through the first insulation layer, the first conductive layer and into the substrate in the first and second areas and a first portion of the dummy area, and filling the first and second trenches with insulation material. Then, memory cells are formed in the first area, HV devices in the second area and logic devices in the third area.