公开(公告)号：US09318459B2

公开(公告)日：2016-04-19

申请号：US14548090

申请日：2014-11-19

Applicant: STMicroelectronics Pte Ltd

Inventor： How Yuan Hwang ,  Kah Wee Gan

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L23/48 ,  H01L23/31

CPC classification number: H01L24/14 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/023 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.

Abstract translation: 集成电路封装包括在复原衬底中的集成电路管芯。 然后将活性侧加工成模塑料，同时处理非活性侧。 然后部分地去除活性侧上的模塑料，并且在活性侧上放置焊球。

公开(公告)号：US20160103109A1

公开(公告)日：2016-04-14

申请号：US14511280

申请日：2014-10-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang JIN ,  Ravi SHANKAR

IPC: G01N33/00

CPC classification number: G01N33/0009 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A gas sensor device may include a gas sensor integrated circuit (IC) having a gas sensing surface, and bond pads adjacent to the gas sensing surface, and a frame having gas passageways extending therethrough adjacent the gas sensing surface. The gas sensor device may include leads, each having a proximal end spaced from the frame and bonded to a respective bond pad, and a distal end extending downwardly from the proximal end, and encapsulation material filling the space between the proximal ends of the leads and the frame.

Abstract translation: 气体传感器装置可以包括具有气体检测表面的气体传感器集成电路（IC）和与气体感测表面相邻的接合焊盘，以及具有在气体感测表面附近延伸穿过的气体通道的框架。 气体传感器装置可以包括引线，每个引线具有与框架间隔开并且接合到相应的接合焊盘的近端，以及从近端向下延伸的远端，以及填充引线的近端之间的空间的封装材料以及 框架。

公开(公告)号：US20160041114A1

公开(公告)日：2016-02-11

申请号：US14887145

申请日：2015-10-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: G01N27/22 ,  G01L9/12 ,  G01K7/16

CPC classification number: G01N27/223 ,  G01D21/02 ,  G01K7/01 ,  G01K7/16 ,  G01K7/186 ,  G01K7/20 ,  G01L9/12 ,  G01L19/0092 ,  H01L25/0652 ,  H01L25/50 ,  H01L27/0248 ,  H01L29/7804 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

Abstract translation: 基于半导体的多传感器模块将微型温度，压力和湿度传感器集成到单个基板上。 压力和湿度传感器可以实现为电容薄膜传感器，而温度传感器实现为精密微型惠斯通电桥。 这种多传感器模块可以用作专用集成电路（ASIC）中的构建块。 此外，多传感器模块可以构建在可用于处理来自传感器的信号的现有电路之上。 使用差分传感器的集成多传感器模块可以大量同时测量各种局部环境条件，并以高精度测量。 多传感器模块还具有集成加热器，可用于自动或根据需要校准或调整传感器。 这种具有低功耗的微型集成多传感器模块可用于医疗监控和移动计算，包括智能手机应用。

公开(公告)号：US09244334B2

公开(公告)日：2016-01-26

申请号：US13853598

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Hk Looi ,  Wee Chin Judy Lim ,  Cheng-Hai Cheh ,  Bs Aw ,  David Gani ,  Tin-Tun Maung ,  Choon Lee Lai

IPC: H04N5/225 ,  G03B3/10 ,  G02B7/09

CPC classification number: G03B3/10 ,  G02B7/08 ,  G02B7/09 ,  H02K41/031 ,  Y10T29/4913

Abstract: Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.

Abstract translation: 这里描述的触点的各种实施例包括相对于彼此成角度的不同部分和制造包括这种触点的装置的方法。 在一些实施例中，模块可以包括设置在壳体内的接触件的第一部分和设置在壳体外部的第二部分，其中第二部分相对于第一部分成角度。 制造这样的器件可以包括沉积导电材料以将触点电连接到衬底的接触焊盘。 在一些实施例中，用于沉积导电材料的沉积工艺可以具有最小尺寸，其限定一旦沉积的导电材料的最小尺寸。 在一些这样的实施例中，接触针的末端与接触垫之间的距离可以大于沉积过程的最小尺寸。

公开(公告)号：US20160004029A1

公开(公告)日：2016-01-07

申请号：US14322054

申请日：2014-07-02

Applicant: STMicroelectronics Pte Ltd.

Inventor： Tin Tun

IPC: G02B7/02 ,  B32B37/12 ,  B32B37/06 ,  B32B37/18

CPC classification number: G02B7/025 ,  G02B7/02

Abstract: A method of selectively bonding a component to a substrate prevents glue displacement onto neighboring components. The method entails shortening a section of the perimeter of a mount wall so that the foot of the mount wall contacts the glue without causing substantial displacement. A cure step hardens and holds the shortened foot of the mount wall in a stationary position, while providing a partial bond. Meanwhile the rest of the mount wall that is not located near contact pads on the substrate has a tall foot that extends to the surface of the substrate and is bonded in the usual way. By modifying the component, it is not necessary to modify either the chemistry of the epoxy or the epoxy dispense operation.

Abstract translation: 将组分选择性地粘合到基底上的方法防止了在相邻部件上的粘合剂移位。 该方法需要缩短安装壁的周长的一部分，使得安装壁的脚部接触胶水而不引起实质的位移。 固化步骤硬化并将固定壁的缩短的脚保持在静止位置，同时提供部分粘合。 同时，不位于衬底上的接触垫附近的安装壁的其余部分具有延伸到衬底的表面并以通常方式结合的高脚。 通过改变组分，不需要改变环氧化合物或环氧树脂分配操作。

公开(公告)号：US20150303168A1

公开(公告)日：2015-10-22

申请号：US14754230

申请日：2015-06-29

Applicant: STMICROELECTRONICS PTE LTD

Inventor： YONGGANG JIN ,  KIYOSHI KUWABARA ,  XAVIER BARATON

IPC: H01L23/00 ,  H01L21/311 ,  H01L21/56 ,  H01L21/683 ,  H01L21/48 ,  H01L21/768

CPC classification number: H01L24/83 ,  H01L21/311 ,  H01L21/4821 ,  H01L21/486 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/768 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/18 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/2518 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

Abstract: Aspects of the invention are directed towards an integrated circuit package and method of forming the same, and more particularly to a redistributed chip packaging for an integrated circuit. The integrated circuit package includes an integrated circuit having a protective material on at least a portion of the integrated circuit. A lead frame is coupled to the integrated circuit and a conductive layer is also coupled to the interconnect. A solder ball is coupled to the conductive layer and a passivation layer is on the conductive layer. Active and passive components are electrically coupled to the integrated circuit.

Abstract translation: 本发明的方面涉及一种集成电路封装及其形成方法，更具体地涉及用于集成电路的重新分配的芯片封装。 集成电路封装包括在集成电路的至少一部分上具有保护材料的集成电路。 引线框架耦合到集成电路，并且导电层也耦合到互连。 焊球与导电层耦合，钝化层位于导电层上。 有源和无源部件电耦合到集成电路。

公开(公告)号：US20150210539A1

公开(公告)日：2015-07-30

申请号：US14679906

申请日：2015-04-06

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Olivier LE NEEL ,  Tien Choy LOH

IPC: B81C1/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  B81B2203/0127

Abstract: The present disclosure is directed to a device that includes a substrate and a sensor formed on the substrate. The sensor includes a chamber formed from a plurality of integrated cavities, a membrane above the substrate, the membrane having a plurality of openings, each opening positioned above one of the cavities, and a plurality of diamond shaped anchors positioned between the membrane and the substrate, the anchors positioned between each of the cavities. A center of each opening is also a center of one of the cavities.

Abstract translation: 本公开涉及一种包括基板和形成在基板上的传感器的装置。 所述传感器包括由多个集成腔体形成的室，在所述衬底上方的膜，所述膜具有多个开口，每个开口位于所述空腔中的一个上方，以及多个位于所述膜和所述衬底之间的菱形锚定件 ，定位在每个空腔之间的锚固件。 每个开口的中心也是其中一个空腔的中心。

公开(公告)号：US09082681B2

公开(公告)日：2015-07-14

申请号：US13853886

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Shian-Yeu Kam ,  Tien-Choy Loh ,  Ditto Adnan ,  Tze Wei Dennis Chew

IPC: H01L21/44 ,  H01L25/16 ,  H01L21/56 ,  H01L25/00 ,  G01N27/22

CPC classification number: H01L25/16 ,  B81C1/0023 ,  G01N27/223 ,  H01L21/56 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/00 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A micro-sensor device that includes a passivation-protected ASIC module and a micro-sensor module bonded to a patterned cap provides protection for signal conditioning circuitry while allowing one or more sensing elements in the micro-sensor module to be exposed to an ambient environment. According to a method of fabricating the micro-sensor device, the patterned cap can be bonded to the micro-sensor module using a planarizing adhesive that is chemically compatible with the sensing elements. In one embodiment, the adhesive material is the same material used for the dielectric active elements, for example, a photo-sensitive polyimide film.

Abstract translation: 包括钝化保护ASIC模块和结合到图案化盖的微传感器模块的微传感器装置为信号调节电路提供保护，同时允许微传感器模块中的一个或多个感测元件暴露于周围环境 。 根据制造微传感器装置的方法，图案化盖可以使用与感测元件化学相容的平面化粘合剂结合到微传感器模块。 在一个实施例中，粘合剂材料是用于介电活性元件的材料，例如光敏聚酰亚胺膜。

公开(公告)号：US20150194303A1

公开(公告)日：2015-07-09

申请号：US14151188

申请日：2014-01-09

Applicant: STMICROELECTRONICS PTE LTD

Inventor： ChongJieh CHEW

IPC: H01L21/02 ,  H01L21/033

CPC classification number: H01L21/02252 ,  H01L21/02129 ,  H01L21/02274 ,  H01L21/02321 ,  H01L21/02334 ,  H01L21/0234 ,  H01L21/033 ,  H01L21/31144

Abstract: A method for making semiconductor devices may include forming a phosphosilicate glass (PSG) layer on a semiconductor wafer, with the PSG layer having a phosphine residual surface portion. The method may further include exposing the phosphine residual surface portion to a reactant plasma to integrate at least some of the phosphine residual surface portion into the PSG layer. The method may additionally include forming a mask layer on the PSG layer after the exposing.

Abstract translation: 制造半导体器件的方法可以包括在半导体晶片上形成磷硅玻璃（PSG）层，其中PSG层具有磷化氢残留表面部分。 该方法可以进一步包括将磷化氢残余表面部分暴露于反应物等离子体以将至少一些磷化氢残余表面部分整合到PSG层中。 该方法还可以包括在曝光之后在PSG层上形成掩模层。

公开(公告)号：US20150001075A1

公开(公告)日：2015-01-01

申请号：US13929525

申请日：2013-06-27

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Suman Cherian ,  Calvin Leung ,  Ravi Shankar ,  Tien Choy Loh ,  Shian Yeu Kam

IPC: G01N27/416 ,  H01L35/34

CPC classification number: H01L35/34 ,  G01N27/3274 ,  Y10T29/49117

Abstract: A bio-fluid sensor is formed by depositing polyimide on a glass substrate. Gold and platinum are deposited on the polyimide and patterned to form fluid sensing electrodes, signal traces, and a temperature sensor. The fluid sensor is then fixed to a flexible tape and peeled off of the glass substrate.

Abstract translation: 通过在玻璃基板上沉积聚酰亚胺形成生物流体传感器。 金和铂沉积在聚酰亚胺上并图案化以形成流体感测电极，信号迹线和温度传感器。 然后将流体传感器固定到柔性带并从玻璃基板上剥离。