公开(公告)号：US08400176B2

公开(公告)日：2013-03-19

申请号：US12543386

申请日：2009-08-18

Applicant: Brian J. Arkin ,  Alistair Nicholas Sporck

Inventor： Brian J. Arkin ,  Alistair Nicholas Sporck

IPC: G01R31/00

CPC classification number: G01R31/2889 ,  G01R31/024

Abstract: A probe card assembly can include a plurality of probes disposed on a substrate and arranged to contact terminals of a semiconductor wafer. Switches can be disposed on the probe card assembly and provide for selective connection and disconnection of the probes from electrical interconnections on the probe card assembly.

Abstract translation: 探针卡组件可以包括设置在基板上并布置成接触半导体晶片的端子的多个探针。 开关可以放置在探针卡组件上，并提供探头与探针卡组件上的电气互连的选择性连接和断开。

公开(公告)号：US08400173B2

公开(公告)日：2013-03-19

申请号：US12492177

申请日：2009-06-26

Applicant: Eric D. Hobbs

Inventor： Eric D. Hobbs

IPC: G01R31/00 ,  G01R31/10

CPC classification number: G01R31/2874

Abstract: Embodiments of probe cards and methods for fabricating and using same are provided herein. In some embodiments, an apparatus for testing a device (DUT) may include a probe card configured for testing a DUT; a thermal management apparatus disposed on the probe card to heat and/or cool the probe card; a sensor disposed on the probe card and coupled to the thermal management apparatus to provide data to the thermal management apparatus corresponding to a temperature of a location of the probe card; a first connector disposed on the probe card and coupled to the thermal management apparatus for connecting to a first power source internal to a tester; and a second connector, different than the first connector, disposed on the probe card and coupled to the thermal management apparatus for connecting to a second power source external to the tester.

Abstract translation: 本文提供了探针卡及其制造和使用方法的实施例。 在一些实施例中，用于测试设备（DUT）的设备可以包括配置用于测试DUT的探针卡; 设置在探针卡上以加热和/或冷却探针卡的热管理装置; 传感器，设置在所述探针卡上并耦合到所述热管理装置，以向与所述探针卡的位置的温度相对应的所述热管理装置提供数据; 第一连接器，其设置在所述探针卡上并且耦合到所述热管理装置，用于连接到测试仪内部的第一电源; 以及与第一连接器不同的第二连接器，其设置在探针卡上并且耦合到热管理装置，用于连接到测试仪外部的第二电源。

公开(公告)号：US20120239339A1

公开(公告)日：2012-09-20

申请号：US13418532

申请日：2012-03-13

Applicant: Susumu Kaneko

Inventor： Susumu Kaneko

IPC: G06F19/00

CPC classification number: G01R31/3025 ,  G01R1/07378 ,  G01R31/2889

Abstract: A probe card assembly can include a wireless link to an external verifier (e.g., debugger). The wireless link can interface to a boundary scan interface of a controller on the probe card assembly. The wireless link can allow for verification of the probe card assembly while it is installed within a prober.

Abstract translation: 探针卡组件可以包括到外部验证器（例如，调试器）的无线链路。 无线链路可以连接到探针卡组件上的控制器的边界扫描接口。 无线链路可以允许探测卡组件在安装在探测器中时进行验证。

公开(公告)号：US08138859B2

公开(公告)日：2012-03-20

申请号：US12106364

申请日：2008-04-21

Applicant: John K. Gritters ,  Eric D. Hobbs ,  Sangtae Park ,  Jun Jason Yao

Inventor： John K. Gritters ,  Eric D. Hobbs ,  Sangtae Park ,  Jun Jason Yao

IPC: H01H51/22 ,  H01H57/00

CPC classification number: H01H1/60 ,  H01H1/0036 ,  H01H59/0009 ,  H01H2001/0047 ,  H01H2001/0052 ,  H01H2001/0078

Abstract: Embodiments of the present invention provide microelectromechanical systems (MEMS) switching methods and apparatus having improved performance and lifetime as compared to conventional MEMS switches. In some embodiments, a MEMS switch may include a resilient contact element comprising a beam and a tip configured to wipe a contact surface; and a MEMS actuator having an open position that maintains the tip and the contact surface in a spaced apart relation and a closed position that brings the tip into contact with the contact surface, wherein the resilient contact element and the MEMS actuator are disposed on a substrate and are movable in a plane substantially parallel to the substrate. In some embodiments, various contact elements are provided for the MEMS switch. In some embodiments, various actuators are provided for control of the operation of the MEMS switch.

Abstract translation: 与常规MEMS开关相比，本发明的实施例提供了具有改进的性能和寿命的微机电系统（MEMS）开关方法和装置。 在一些实施例中，MEMS开关可以包括弹性接触元件，其包括梁和构造成擦拭接触表面的尖端; 以及MEMS致动器，其具有将尖端和接触表面保持间隔开的关闭位置和使尖端与接触表面接触的闭合位置，其中弹性接触元件和MEMS致动器设置在基板上 并且可以在基本上平行于基板的平面中移动。 在一些实施例中，为MEMS开关提供各种接触元件。 在一些实施例中，提供各种致动器用于控制MEMS开关的操作。

公开(公告)号：US08122309B2

公开(公告)日：2012-02-21

申请号：US12046009

申请日：2008-03-11

Applicant: Todd Ryland Kemmerling

Inventor： Todd Ryland Kemmerling

IPC: G01R31/28 ,  G06F11/00

CPC classification number: G06F11/273 ,  G11C29/56 ,  G11C2029/5606

Abstract: Methods and apparatus for processing failures during semiconductor device testing are described. Examples of the invention can relate to testing a device under test (DUT). Fail capture logic can be provided, coupled to test probes and memory, to indicate only first failures of failures detected on output pins of the DUT during a test for storage in the memory.

Abstract translation: 描述了在半导体器件测试期间处理故障的方法和装置。 本发明的实例可以涉及测试被测设备（DUT）。 可以提供故障捕获逻辑，耦合到测试探针和存储器，以在仅在存储器中存储的测试期间仅指示在DUT的输出引脚上检测到的故障的第一次故障。

公开(公告)号：US20110267085A1

公开(公告)日：2011-11-03

申请号：US13179185

申请日：2011-07-08

Applicant: Tommie Edward Berry ,  A. Nicholas Sporck

Inventor： Tommie Edward Berry ,  A. Nicholas Sporck

IPC: G01R1/073

CPC classification number: G01R1/07342 ,  G01R31/2889

Abstract: Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chain coupled to at least one serial control line, the plurality of ICs including switches coupled to test probes, each of the switches being programmable responsive to a control signal on the at least one serial control line.

Abstract translation: 已经描述了使用串行控制的智能开关来测试装置的方法和装置。 在一些实施例中，可以提供探针卡组件，其包括串联耦合以形成链的多个集成电路（IC），所述链耦合到至少一个串行控制线，所述多个IC包括耦合到测试探针的开关， 每个开关可响应于至少一个串行控制线上的控制信号来编程。

公开(公告)号：US20110214910A1

公开(公告)日：2011-09-08

申请号：US12719136

申请日：2010-03-08

Applicant: Benjamin N. Eldridge ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gaetan L. Mathieu

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/12 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4664 ,  H05K3/1241 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/4647 ,  H05K2203/049 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: One or more customization layers can be added to a wiring substrate. The customization layers can provide customized electrical connections from electrical contacts of the base wiring substrate to electrical contacts at an outer surface of the customization layers, which can allow the contacts at the outer surface of the customization layers can be in a different pattern than the contacts at the surface of the base wiring substrate. The customization layers can comprise electrically insulating material, electrically conductive via structures through the insulating material, electrically conductive traces, electrically conductive jumpers electrically connecting two traces without contacting a trace disposed between the two traces, and/or other such elements. A jumper can be formed by making a relatively small deposit of electrically insulating material between the two traces to be connected and then making a relatively small deposit of electrically conductive material on parts of the two traces and the insulating material. Via structures can be coupled to traces and an insulating material can be cast around the via structures. Alternatively, via structures can be formed in openings with sloped side walls in an insulating layer.

Abstract translation: 可以将一个或多个定制层添加到布线基板。 定制层可以提供从基底布线基板的电触点到定制层外表面处的电触点的定制电连接，这允许定制层外表面处的触点可以与触点不同的图案 在基极配线基板的表面。 定制层可以包括电绝缘材料，通过绝缘材料的导电通孔结构，导电迹线，电连接两个迹线的导电跳线，而不接触设置在两个迹线之间的迹线和/或其它这样的元件。 可以通过在要连接的两个迹线之间形成相对较小的电绝缘材料沉积，然后在两个迹线和绝缘材料的部分上形成相对较小的导电材料沉积物来形成跳线。 通孔结构可以耦合到迹线，并且绝缘材料可以围绕通孔结构铸造。 或者，通孔结构可以形成在具有绝缘层中的倾斜侧壁的开口中。

公开(公告)号：US20110156735A1

公开(公告)日：2011-06-30

申请号：US12979200

申请日：2010-12-27

Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

IPC: G01R31/00

CPC classification number: G01R1/0491 ,  G01R31/3025

Abstract: Wafer cassette systems and methods of using wafer cassette systems. A wafer cassette system can include a base and a probe card assembly. The base and the probe card assembly can each include complementary interlocking alignment elements. The alignment elements can constrain relative movement of the base and probe card assembly in directions parallel to a wafer receiving surface of the base, while permitting relative movement in a direction perpendicular to the receiving surface.

Abstract translation: 晶圆盒系统和使用晶片盒系统的方法。 晶片盒系统可以包括基座和探针卡组件。 基座和探针卡组件可以各自包括互补的互锁对准元件。 对准元件可以约束基部和探针卡组件在平行于基部的晶片接收表面的方向上的相对运动，同时允许在垂直于接收表面的方向上的相对运动。

公开(公告)号：US20110156734A1

公开(公告)日：2011-06-30

申请号：US12979159

申请日：2010-12-27

Applicant: Tommie E. Berry ,  Keith J. Breinlinger ,  Eric D. Hobbs ,  Marc Loranger ,  Alexander H. Slocum ,  Adrian S. Wilson

Inventor： Tommie E. Berry ,  Keith J. Breinlinger ,  Eric D. Hobbs ,  Marc Loranger ,  Alexander H. Slocum ,  Adrian S. Wilson

IPC: G01R31/00

CPC classification number: G01R31/2891

Abstract: Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.

Abstract translation: 被测设备（DUT）可以在包括对准器和测试单元的测试系统中进行测试。 DUT可以被移动并被夹持在对准器中的载体上的对准位置。 在对准位置，DUT的导电端子可以相对于载体的载体对准特征处于预定位置。 然后可以将DUT /载体组合从对准器移动到测试单元之一中，其中载体的对准特征与测试单元中的接触器的对准特征机械耦合。 机械联轴器将DUT的端子自动对准接触器的探头。 探头因此与DUT的端子接触并进行电气连接。 然后测试DUT。 对准器和每个测试单元可以是分离和独立的器件，使得DUT可以在对准器中对准，而在测试单元中测试已经与对准器中的载体对准的其它DUT。

公开(公告)号：US07960989B2

公开(公告)日：2011-06-14

申请号：US12478117

申请日：2009-06-04

Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

IPC: G01R31/20 ,  G01R31/02

CPC classification number: G01R31/2889

Abstract: A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.

Abstract translation: 加强结构，布线基板和具有设置在堆叠中的主表面的框架可以是探针卡组件的一部分。 布线基板可以设置在框架和加强件结构之间，并且探针基板可以通过一个或多个不可调节地固定的联接机构联接到框架。 每个探针基板可以具有通过探针卡组件电连接到布线基板上的电接口到测试控制器的探针。 不可调节固定的联接机构可以在垂直于主表面的第一方向上同时刚性，并且在大致平行于主表面的第二方向上是柔性的。