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公开(公告)号:US5490193A
公开(公告)日:1996-02-06
申请号:US734168
申请日:1991-07-22
申请人: Katsuhiro Kuroda , Koichi Koike , Atsuko Takafuji , Fumio Noda
发明人: Katsuhiro Kuroda , Koichi Koike , Atsuko Takafuji , Fumio Noda
CPC分类号: A61B6/032 , A61B6/4028 , H01J35/30 , H05G1/70
摘要: This invention provides a compact X-ray CT system capable of obtaining an X-ray CT image having high resolution at a high speed by deflecting a predetermined electron beam and causing the finely focused electron beam to scan on an arcuate anode target inside the same plane as the arcuate anode target for an X-ray source. The anode target for an X-ray source and a detector are disposed in the form of arcs inside substantially the same plane so as to face each other. The electron beam emitted from an electron gun is guided to a deflector through a lens system, is then deflected to a arc form trajectory by a uniform magnetic field generated by the deflector and is guided to the anode target after a reverse magnetic field is applied to the electron beam at a desired position. This electron beam is caused to scan on the anode target at a high speed so as to move the generation position of the X-ray and thus to obtain a sectional image.
摘要翻译: 本发明提供一种紧凑的X射线CT系统,其能够通过偏转预定的电子束来获得高分辨率的X射线CT图像,并使精细聚焦的电子束在同一平面内的弓形阳极靶上扫描 作为X射线源的弓形阳极靶。 用于X射线源和检测器的阳极靶以大致相同的平面内的弧形的形式设置成彼此面对。 从电子枪发射的电子束通过透镜系统被引导到偏转器,然后通过由偏转器产生的均匀磁场偏转到弧形轨迹,并且在反向磁场被施加到 电子束在期望的位置。 使该电子束以高速扫描阳极靶,以移动X射线的产生位置,从而获得截面图像。
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22.
公开(公告)号:US08604430B2
公开(公告)日:2013-12-10
申请号:US13366874
申请日:2012-02-06
申请人: Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人: Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号: H01J37/28
CPC分类号: H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要: The inspection apparatus disclosed generates an electron beam, an acceleration electrode accelerates the electron beam, a convergence lens converges the electron beam, an electron beam deflector scans the beam over a sample, an objective lens converges the electron beam on the sample, a detector located between the sample and the objective lens detects charged particles emitted from the sample, a power supply applies a retarding voltage to the sample for decelerating the electron beam to the sample, an electrode is disposed between the objective lens and the sample, and a voltage is generated between the sample and the electrode by said electrode, the voltage being determined depending on the sample. The apparatus solves problems encountered in conventional inspection systems.
摘要翻译: 所公开的检查装置产生电子束,加速电极加速电子束,会聚透镜会聚电子束,电子束偏转器扫描样品上的光束,物镜会将电子束会聚在样品上,检测器位于 在样品和物镜之间检测从样品发射的带电粒子,电源向样品施加延迟电压以将电子束减速到样品,电极设置在物镜和样品之间,电压为 通过所述电极在样品和电极之间产生,电压根据样品确定。 该装置解决了常规检测系统遇到的问题。
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公开(公告)号:US07417444B2
公开(公告)日:2008-08-26
申请号:US11269617
申请日:2005-11-09
申请人: Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
发明人: Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
IPC分类号: G01R31/305 , H01J37/28
CPC分类号: G01R31/305 , G01R31/307 , H01J37/28 , H01J2237/2817
摘要: A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.
摘要翻译: 一种电路图案检查方法及其装置,其中待检查样品的待检查部分的整个部分被制成处于预定的充电状态,被检查的部分用图像形成高分辨率照射, 在扫描电子束时,在从电子束照射的时刻起经过规定的时间后,在照射电子束的部分检测到二次带电粒子,根据这样检测的次级 通过使用如此形成的图像来检查带电粒子信号,并检查待检查的部分。
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公开(公告)号:US07242015B2
公开(公告)日:2007-07-10
申请号:US11234197
申请日:2005-09-26
申请人: Hiroyuki Shinada , Yusuke Yajima , Hisaya Murakoshi , Masaki Hasegawa , Mari Nozoe , Atsuko Takafuji , Katsuya Sugiyama , Katsuhiro Kuroda , Kaoru Umemura , Yasutsugu Usami
发明人: Hiroyuki Shinada , Yusuke Yajima , Hisaya Murakoshi , Masaki Hasegawa , Mari Nozoe , Atsuko Takafuji , Katsuya Sugiyama , Katsuhiro Kuroda , Kaoru Umemura , Yasutsugu Usami
IPC分类号: H01J37/153 , H01J37/30
CPC分类号: H01J37/26 , G01N23/225 , H01J37/244 , H01J37/29 , H01J2237/20228 , H01J2237/221 , H01J2237/2447 , H01J2237/24475 , H01J2237/24485 , H01J2237/24592 , H01J2237/2482
摘要: An electron beam (area beam) having a fixed area is irradiated onto the surface of a semiconductor sample, and reflected electrons from the sample surface are imaged by the imaging lens, and images of a plurality of regions of the surface of the semiconductor sample are obtained and stored in the image storage unit, and the stored images of the plurality of regions are compared with each other, and the existence of a defect in the regions and the defect position are measured. By doing this, in an apparatus for testing a pattern defect of the same design, foreign substances, and residuals on a wafer in the manufacturing process of a semiconductor apparatus by an electron beam, speeding-up of the test can be realized.
摘要翻译: 具有固定面积的电子束(区域光束)被照射到半导体样品的表面上,并且通过成像透镜对来自样品表面的反射电子进行成像,并且半导体样品的表面的多个区域的图像是 获取并存储在图像存储单元中,并且将多个区域的存储图像相互比较,并且测量区域和缺陷位置中的缺陷的存在。 通过这样做,在通过电子束在半导体装置的制造过程中测试相同设计的模式缺陷,异物和晶片上的残留物的装置可以实现测试的加速。
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公开(公告)号:US07026830B2
公开(公告)日:2006-04-11
申请号:US10379555
申请日:2003-03-06
申请人: Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
发明人: Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
IPC分类号: G01R31/305 , G01R31/28
CPC分类号: G01R31/305 , G01R31/307 , H01J37/28 , H01J2237/2817
摘要: To make possible the in-line inspection of a pattern of an insulating material.A patterned wafer 40 formed with a pattern by a resist film is placed on a specimen table 21 of a patterned wafer inspection apparatus 1 in opposed relation to a SEM 3. An electron beam 10 of a large current is emitted from an electron gun 11 and the pattern of the patterned wafer is scanned only once at a high scanning rate. The secondary electrons generated by this scanning from the patterned wafer are detected by a secondary electron detector 16 thereby to acquire an electron beam image. Using this electron beam image, the comparative inspection is conducted on the patterned wafer through an arithmetic operation unit 32 and a defect determining unit 33. Since an electron beam image of high contrast can be obtained by scanning an electron beam only once, a patterned wafer inspection method using a SEM can be implemented in the IC fabrication method.
摘要翻译: 使绝缘材料的图案能够在线检查。 通过抗蚀剂膜形成图案的图案化晶片40与SEM 3相对地放置在图案化晶片检查装置1的样本台21上。 从电子枪11发射大电流的电子束10,以高扫描速度扫描图案化晶片的图案一次。 通过二次电子检测器16检测来自图案化晶片的该扫描产生的二次电子,从而获得电子束图像。 使用该电子束图像,通过算术运算单元32和缺陷判定单元33对图案化晶片进行比较检查。由于可以通过仅扫描电子束一次来获得高对比度的电子束图像,因此图案化晶片 使用SEM的检查方法可以在IC制造方法中实现。
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公开(公告)号:US07012252B2
公开(公告)日:2006-03-14
申请号:US11108877
申请日:2005-04-19
申请人: Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
发明人: Yuko Iwabuchi , Hideo Todokoro , Hiroyoshi Mori , Mitsugu Sato , Yasutsugu Usami , Mikio Ichihashi , Satoru Fukuhara , Hiroyuki Shinada , Yutaka Kaneko , Katsuya Sugiyama , Atsuko Takafuji , Hiroshi Toyama
IPC分类号: H01J37/28
CPC分类号: H01J37/28 , G01N23/20 , G01N23/2251 , G03F7/7065 , G06T7/001 , G06T2207/10056 , G06T2207/30148 , H01J37/04 , H01J37/20 , H01J37/265 , H01J2237/04756 , H01J2237/20221 , H01J2237/2444 , H01J2237/24592 , H01J2237/2817 , H01J2237/31766
摘要: Problems encountered in the conventional inspection method and the conventional apparatus adopting the method are solved by the present invention using an electron beam by providing a novel inspection method and an inspection apparatus adopting the novel method which are capable of increasing the speed to scan a specimen such as a semiconductor wafer.The inspection novel method provided by the present invention comprises the steps of: generating an electron beam; converging the generated electron beam on a specimen by using an objective lens; scanning the specimen by using the converged electron beam; continuously moving the specimen during scanning; detecting charged particles emanating from the specimen at a location between the specimen and the objective lens and converting the detected charged particles into an electrical signal; storing picture information conveyed by the electrical signal; comparing a picture with another by using the stored picture information; and detecting a defect of the specimen.
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公开(公告)号:US20060043982A1
公开(公告)日:2006-03-02
申请号:US11269617
申请日:2005-11-09
申请人: Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
发明人: Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
IPC分类号: G01R31/305
CPC分类号: G01R31/305 , G01R31/307 , H01J37/28 , H01J2237/2817
摘要: A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.
摘要翻译: 一种电路图案检查方法及其装置,其中待检查样品的待检查部分的整个部分被制成处于预定的充电状态,被检查的部分用图像形成高分辨率照射, 在扫描电子束时,在从电子束照射的时刻起经过规定的时间后,在照射电子束的部分检测到二次带电粒子,根据这样检测的次级 通过使用如此形成的图像来检查带电粒子信号,并检查待检查的部分。
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28.
公开(公告)号:US20060022295A1
公开(公告)日:2006-02-02
申请号:US11186831
申请日:2005-07-22
申请人: Atsuko Takafuji , Mari Nozoe , Kiyonori Oyu
发明人: Atsuko Takafuji , Mari Nozoe , Kiyonori Oyu
IPC分类号: H01L23/58 , H01L29/00 , G01R31/305
CPC分类号: H01L22/14 , G01R31/2653 , H01L2924/0002 , H01L2924/00
摘要: The electron beam is irradiated several times at predetermined intervals to the wafer surface on which the plugs are exposed in the course of the manufacturing process so that the pn junction is in the reverse bias state. Then, the irradiation conditions of the electron beam are changed while monitoring the charging voltage on the plug surface, and the secondary electron signals of the circuit pattern are obtained under the irradiation conditions that the charging is within a desired range, thereby evaluating the leakage property. Since the charging voltage of the pn junction is relaxed depending on the magnitude of the leakage current during the interval, the leakage property is evaluated based on the luminance signals of the voltage contrast image. By measuring the charging voltage and setting it within a desired range, the evaluation result reflects the state in the actual operation. Therefore, the accuracy is enhanced.
摘要翻译: 电子束在制造过程中以预定间隔照射到插头暴露在其上的晶片表面,使得pn结处于反向偏置状态。 然后,在监视插头表面上的充电电压的同时改变电子束的照射条件,并且在充电在期望范围内的照射条件下获得电路图案的二次电子信号,从而评估泄漏特性 。 由于pn结的充电电压根据间隔期间的漏电流的大小而放宽,所以基于电压对比度图像的亮度信号来评价泄漏特性。 通过测量充电电压并将其设置在所需范围内,评估结果反映实际操作中的状态。 因此,精度提高。
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公开(公告)号:US06614022B2
公开(公告)日:2003-09-02
申请号:US09908713
申请日:2001-07-20
申请人: Takashi Hiroi , Asahiro Kuni , Masahiro Watanabe , Chie Shishido , Hiroyuki Shinada , Yasuhiro Gunji , Atsuko Takafuji
发明人: Takashi Hiroi , Asahiro Kuni , Masahiro Watanabe , Chie Shishido , Hiroyuki Shinada , Yasuhiro Gunji , Atsuko Takafuji
IPC分类号: H01J37244
CPC分类号: H01J37/244 , H01J37/28 , H01J2237/24465 , H01J2237/2817
摘要: In the detecting system for irradiating the electron beam and detecting the secondary electron thereof, an area of the detector is an important factor for high-speed detection. For the technique of the current electron optical system and detector, a detector of the area larger than a constant area is necessary and detection of 200 Msps or more by receiving limitation on the frequency inversely proportional to the area is substantially difficult. For example, for detection at 400 Msps under the condition that the required area is 4 mm square and the rate for 4 mm square is defined as 150 Msps, four discrete high-speed detectors of 2 mm square are arranged to amplify and then add the signals for A/D conversion. Otherwise, the secondary electron is sequentially inputted to the detector of 8 mm square with the secondary electron deflector, the secondary electron is detected at 100 Msps and arranged after the A/D conversion. In any case, the area of 4 mm square and rate of 400 Msps can be attained.
摘要翻译: 在用于照射电子束并检测其二次电子的检测系统中,检测器的面积是高速检测的重要因素。 对于当前电子光学系统和检测器的技术,需要一个大于恒定面积的区域的检测器,并且通过接收与该区域成反比的频率的限制来检测200 Msps以上是非常困难的。例如,对于 在所需面积为4平方毫米,4平方毫米的速率定义为150 Msps的条件下,以400 Msps进行检测,放置4个离散高速2 mm的高速检测器,放大,然后将A / D转换。 否则,二次电子依次输入到具有二次电子偏转器的8mm正方形的检测器,二次电子以100Msps检测并且在A / D转换之后排列。 在任何情况下,可以获得4平方毫米的面积和400 Msps的面积。
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公开(公告)号:US06559663B2
公开(公告)日:2003-05-06
申请号:US09983703
申请日:2001-10-25
申请人: Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
发明人: Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
IPC分类号: G01R31305
CPC分类号: G01R31/305 , G01R31/307 , H01J37/28 , H01J2237/2817
摘要: A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with: the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.
摘要翻译: 一种电路图案检查方法及其装置,其中待检查样品的待检查部分的整个部分被制成处于预定的充电状态,被检查的部分用图像形成高分辨率照射, 在扫描电子束的同时,在从照射电子束的时刻起经过规定时间后,照射电子束的部位检测到二次带电粒子,根据这样检测出形成图像 通过使用如此形成的图像来检查次级带电粒子信号和待检查的部分。
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