Abstract:
The invention relates to a method of forming an isolation layer in a flash memory device and comprises providing a semiconductor substrate in which a tunnel insulating layer and a conductive layer are formed on an active region and a trench is formed on an isolation region; forming a first insulating layer in a lower portion of the trench; forming a second insulating layer on the semiconductor substrate and the first insulating layer including the trench to protect a side wall of the conductive layer; forming a third insulating layer in the trench to form an isolation layer; and adjusting an effective field height (EFH) of the isolation layer through a first etching process.
Abstract:
A multilayered chip capacitor (MLCC) includes internal electrodes and external electrodes formed to be perpendicular to the internal electrodes, whereby parasitic capacitance is reduced, resulting in no parallel resonance frequency effects. In addition, the MLCC has a capacitor structure, which provides a first surface and a second surface formed in a stacking direction of the dielectric layers in the capacitor body as a top surface and a bottom surface. Hence, in the thin capacitors having the same size, the number of internal electrode layers is increased, thereby reducing the equivalent series resistant (ESR) and equivalent series inductance (ESL). Further, the printed circuit board (PCB) having an embedded MLCC is easily manufactured.
Abstract:
In a display apparatus, a printed circuit board has a base substrate, a flip chip, and an adhesive member. The flip chip is mounted onto a first face of the base substrate by the adhesive member between the flip chip and the first face of the base substrate. The first display panel is disposed on a second face opposite to the first face of the base substrate, and a second display panel is mounted on the first face of the base substrate with the flip chip. Thus, a chip mounted on the printed circuit board is made smaller and the freed up space can be used to mount the second display panel.
Abstract:
A method is provided for operating a data storage device capable of compensating for an initial threshold voltage shift of multiple memory cells. The method includes generating a first compression value for a first write address corresponding to a first write request input during a first time interval among different time intervals, and storing the first compression value in a first table among multiple tables.
Abstract:
An organic light emitting display device includes an organic light emitting display panel, and a driver that drives the organic light emitting display panel. The driver applies a first power voltage and a second power voltage to the organic light emitting display panel, the first power voltage is lower than the second power voltage during a first period, and the first power voltage is higher than the second power voltage during a second period.
Abstract:
An organic light emitting display device includes a scan driving unit supplying a first scan signal and a second scan signal to each of a plurality of scan lines; a data driving unit supplying data signals to each of a plurality of data lines to be synchronized with the second scan signal; pixels positioned at intersections of the scan lines with the data lines, receiving bias power when the first scan signal is supplied, and receiving the data signals when the second scan signal is supplied.
Abstract:
A method of estimating inductance of a permanent magnet synchronous motor (PMSM) includes injecting a signal having a frequency differing from an operating frequency of the PMSM into the PMSM during sensorless operation, sensing magnitudes of current responses to the injected signal, and estimating an inductance value at which the magnitude of the sensed current response is minimal to be an actual inductance value of the PMSM, thereby estimating inductance used in the PMSM regardless of position estimation error of the PMSM and thus more accurately and reliably estimating inductance of the PMSM.
Abstract:
Disclosed herein is a touch panel. The touch panel 100 according to the present invention includes electrode patterns 110 disposed in parallel with each other in a first direction (A), wherein the electrode patterns are provided with opening portions 120 dividing the electrode patterns 110 into two portions, the opening portions 120 having a configuration 125 in which the opening portion moves N times in the first direction (A) while going to a second direction (B) that is vertical to the first direction (A), the configuration 125 being repeated M times. The touch panel allows the electrode patterns to have a single-layer structure by adopting the opening portions 120 in the electrode patterns 110, thereby making it possible to reduce the manufacturing costs of the touch panel and simplify the manufacturing process thereof.
Abstract:
Disclosed herein is an interface of a multi chip module transmitting and receiving data among a plurality of chips. An interface of a multi chip module includes a communication unit that is provided in the chips and transmits and receives the data; and a radio communication unit that is provided outside the chips, converts the data transmitted from the communication unit into radio signals and wirelessly transmits the radio signals, and demodulates radio signals received from other chips into data and transmits the data to the communication unit, whereby wired communication chips can implement radio communication.
Abstract:
Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.