公开(公告)号：US20090302468A1

公开(公告)日：2009-12-10

申请号：US12232252

申请日：2008-09-12

Applicant: Jong Hwan Baek ,  Sung Yi ,  Young Do Kweon ,  Jong Yun Lee ,  Hyung Jin Jeon ,  Joon Seok Kang

Inventor： Jong Hwan Baek ,  Sung Yi ,  Young Do Kweon ,  Jong Yun Lee ,  Hyung Jin Jeon ,  Joon Seok Kang

IPC: H01L23/488 ,  H01L21/56

CPC classification number: H05K3/3436 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05647 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3463 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Disclosed is a printed circuit board including a semiconductor chip, which includes a semiconductor chip having a connection pad, which is exposed, on the upper surface thereof, a first solder ball formed on the connection pad and having a first melting point, a printed circuit board having an external connection terminal formed at the outermost circuit layer thereof, and a second solder ball formed on the external connection terminal, connected to the first solder ball, and having a second melting point higher than the first melting point. In the printed circuit board including a semiconductor chip, the distance between the printed circuit board and the semiconductor chip is increased, thus realizing high resistance to flexure due to the difference in thermal expansion coefficient between the printed circuit board and the semiconductor chip.

Abstract translation: 公开了一种印刷电路板，其包括半导体芯片，该半导体芯片包括具有连接焊盘的半导体芯片，该连接焊盘在其上表面上露出形成在连接焊盘上并具有第一熔点的第一焊球，印刷电路 板上具有形成在其最外侧电路层的外部连接端子，和形成在外部连接端子上的第二焊球，与第一焊球相连，并具有高于第一熔点的第二熔点。 在包括半导体芯片的印刷电路板中，印刷电路板和半导体芯片之间的距离增加，由于印刷电路板和半导体芯片之间的热膨胀系数的差异，实现了高抗弯曲性。

公开(公告)号：US20090087951A1

公开(公告)日：2009-04-02

申请号：US12149106

申请日：2008-04-25

Applicant: Hyung-Jin Jeon ,  Sung Yi ,  Young-Do Kweon ,  Jong-Yun Lee ,  Joon-Seok Kang ,  Seung-Wook Park

Inventor： Hyung-Jin Jeon ,  Sung Yi ,  Young-Do Kweon ,  Jong-Yun Lee ,  Joon-Seok Kang ,  Seung-Wook Park

IPC: H01L21/02

CPC classification number: H01L23/3114 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/24 ,  H01L24/27 ,  H01L24/82 ,  H01L2221/68372 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517

Abstract: A method of manufacturing a wafer level package is disclosed. The method may include stacking an insulation layer over a wafer substrate; processing a via hole in the insulation layer; forming a seed layer over the insulation layer; forming a plating resist, which is in a corresponding relationship with a redistribution pattern, over the seed layer; forming the redistribution pattern, which includes a terminal for external contact, by electroplating; and coupling a conductive ball to the terminal. As multiple redistribution layers can be formed using inexpensive PCB processes, the manufacturing costs can be reduced, and the stability and efficiency of the process can be increased.

Abstract translation: 公开了一种制造晶片级封装的方法。 该方法可以包括在晶片衬底上堆叠绝缘层; 处理绝缘层中的通孔; 在所述绝缘层上形成种子层; 在种子层上形成与再分布图案对应关系的电镀抗蚀剂; 通过电镀形成包括用于外部接触的端子的再分布图案; 并将导电球耦合到端子。 由于可以使用廉价的PCB工艺形成多个再分布层，所以可以降低制造成本，并且可以提高工艺的稳定性和效率。

公开(公告)号：US08172319B2

公开(公告)日：2012-05-08

申请号：US12510700

申请日：2009-07-28

Applicant: Sang Do Park ,  Hak Gyun Kim ,  Dong Woo Jeong ,  Gil Ju Kim ,  Bong Ku Kim ,  Jun Yeol Heo ,  Jong Kweon Pyun ,  Sang Nam Park ,  Jong Yun Lee ,  In Ho Lee

Inventor： Sang Do Park ,  Hak Gyun Kim ,  Dong Woo Jeong ,  Gil Ju Kim ,  Bong Ku Kim ,  Jun Yeol Heo ,  Jong Kweon Pyun ,  Sang Nam Park ,  Jong Yun Lee ,  In Ho Lee

IPC: B60N2/42

CPC classification number: B60N2/888

Abstract: An actuator of an active headrest apparatus for a vehicle, which is operably connected to a headrest assembly and selectively allows a headrest of the headrest assembly to pop out forwards when a vehicle collision occurs, may include a housing installed on a seatback frame and formed with a guide groove, an operating plate elastically supported over the housing, an operating bracket arranged between the housing and the operating plate and having a guide projection slidably inserted into the guide groove of the housing, and an operating wire unit connecting the operating bracket with the headrest assembly, wherein the operating wire unit includes an operating wire and an operating wire retainer to slidably receive the operating wire therein.

Abstract translation: 一种用于车辆的主动头枕装置的致动器，其可操作地连接到头枕组件，并且当发生车辆碰撞时可选择性地允许头枕组件的头枕向前弹出，可包括安装在座椅靠背框架上并形成有 引导槽，弹性地支撑在壳体上的操作板，布置在壳体和操作板之间并具有可滑动地插入壳体的引导槽中的引导突起的操作支架，以及将操作支架与 头枕组件，其中操作线单元包括操作线和操作线保持器，以可滑动地容纳操作线。

公开(公告)号：US20110129960A1

公开(公告)日：2011-06-02

申请号：US12929703

申请日：2011-02-09

Applicant: Seung Wook Park ,  Young Do Kweon ,  Jin Gu Kim ,  Ju Pyo Hong ,  Hee Kon Lee ,  Hyung Jin Jeon ,  Yuan Jing Li ,  Jong Yun Lee

Inventor： Seung Wook Park ,  Young Do Kweon ,  Jin Gu Kim ,  Ju Pyo Hong ,  Hee Kon Lee ,  Hyung Jin Jeon ,  Yuan Jing Li ,  Jong Yun Lee

IPC: H01L21/50

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/2402 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2224/29075 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of manufacturing a stacked wafer level package includes: preparing a substrate; forming a conductive layer on the substrate; forming chip connection pads and internal connection pads on the conductive layer; forming solder balls connected to the internal connection pads; mounting a semiconductor chip on the conductive layer to be connected to the chip connection pads; forming a sealing member to seal the solder balls and the semiconductor chip; separating the substrate from the conductive layer; forming a rearrangement wiring layer by etching the conductive layer; forming an external connection on the rearrangement wiring layer; forming contact holes in the sealing member to expose the solder balls; and stacking an electronic component to be electrically connected to the solder balls exposed through the contact holes.

Abstract translation: 层叠晶片级封装的制造方法包括：准备基板; 在所述基板上形成导电层; 在导电层上形成芯片连接焊盘和内部连接焊盘; 形成连接到内部连接焊盘的焊球; 将半导体芯片安装在所述导电层上以连接到所述芯片连接焊盘; 形成密封构件以密封焊球和半导体芯片; 将衬底与导电层分离; 通过蚀刻导电层形成重排布线层; 在所述重排布线层上形成外部连接; 在所述密封构件中形成接触孔以暴露所述焊球; 并且堆叠要电连接到通过接触孔暴露的焊料球的电子部件。

公开(公告)号：US20100149770A1

公开(公告)日：2010-06-17

申请号：US12453272

申请日：2009-05-05

Applicant: Seung Wook Park ,  Jin Gu Kim ,  Jong Hwan Baek ,  Jong Yun Lee ,  Hyung Jin Jeon ,  Young Do Kweon

Inventor： Seung Wook Park ,  Jin Gu Kim ,  Jong Hwan Baek ,  Jong Yun Lee ,  Hyung Jin Jeon ,  Young Do Kweon

IPC: H01L23/538

CPC classification number: H01L25/0652 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention relates to a semiconductor stack package including: a printed circuit board; a first semiconductor chip mounted on the printed circuit board; a second semiconductor chip mounted on the printed circuit board in parallel with the first semiconductor chip; a first rearrangement wiring layer positioned on the first semiconductor chip; a second rearrangement wiring layer which constitutes one circuit together with the first rearrangement wiring layer and is positioned on the second semiconductor chip; and a third semiconductor chip which is electrically connected to the first and second rearrangement wiring layers and of which both ends are separately positioned on the first and second semiconductor chips.

Abstract translation: 本发明涉及一种半导体堆叠封装，包括：印刷电路板; 安装在印刷电路板上的第一半导体芯片; 与所述第一半导体芯片并联安装在所述印刷电路板上的第二半导体芯片; 位于第一半导体芯片上的第一重排布线层; 第二重排布线层，与第一重排布线层一起构成一个电路，并且位于第二半导体芯片上; 以及第三半导体芯片，其电连接到第一和第二重排布线层，并且其两端分别位于第一和第二半导体芯片上。

公开(公告)号：US20100127540A1

公开(公告)日：2010-05-27

申请号：US12510700

申请日：2009-07-28

Applicant: Sang Do Park ,  Hak Gyun Kim ,  Dong Woo Jeong ,  Gil Ju Kim ,  Bong Ku Kim ,  Jun Yeol Heo ,  Jong Kweon Pyun ,  Sang Nam Park ,  Jong Yun Lee ,  In Ho Lee

Inventor： Sang Do Park ,  Hak Gyun Kim ,  Dong Woo Jeong ,  Gil Ju Kim ,  Bong Ku Kim ,  Jun Yeol Heo ,  Jong Kweon Pyun ,  Sang Nam Park ,  Jong Yun Lee ,  In Ho Lee

IPC: B60N2/42

CPC classification number: B60N2/888

Abstract: An actuator of an active headrest apparatus for a vehicle, which is operably connected to a headrest assembly and selectively allows a headrest of the headrest assembly to pop out forwards when a vehicle collision occurs, may include a housing installed on a seatback frame and formed with a guide groove, an operating plate elastically supported over the housing, an operating bracket arranged between the housing and the operating plate and having a guide projection slidably inserted into the guide groove of the housing, and an operating wire unit connecting the operating bracket with the headrest assembly, wherein the operating wire unit includes an operating wire and an operating wire retainer to slidably receive the operating wire therein.

Abstract translation: 一种用于车辆的主动头枕装置的致动器，其可操作地连接到头枕组件，并且当发生车辆碰撞时可选择性地允许头枕组件的头枕向前弹出，可包括安装在座椅靠背框架上并形成有 引导槽，弹性地支撑在壳体上的操作板，布置在壳体和操作板之间并具有可滑动地插入壳体的引导槽中的引导突起的操作支架，以及将操作支架与 头枕组件，其中操作线单元包括操作线和操作线保持器，以可滑动地容纳操作线。