公开(公告)号：US07749336B2

公开(公告)日：2010-07-06

申请号：US11360812

申请日：2006-02-24

申请人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

发明人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

IPC分类号： C22C13/00

CPC分类号： C22C11/06 ,  B23K35/262 ,  C22C13/00

摘要： A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.

摘要翻译： 公开了一种提高锡铟焊料顺从性的技术。 在一个具体的示例性实施方案中，该技术可以实现为无铅焊料合金，其包含约58.0重量％至约99.998重量％的锡，约0.001重量％至约40.0重量％的铟和约0.001重量％至约2.0重量％ 重量％至少一种稀土元素。

公开(公告)号：US20090084469A1

公开(公告)日：2009-04-02

申请号：US12240396

申请日：2008-09-29

申请人： Ning-Cheng Lee ,  Runsheng Mao

发明人： Ning-Cheng Lee ,  Runsheng Mao

IPC分类号： B23K35/22

CPC分类号： B23K35/22 ,  B23K35/24

摘要： Materials having increased mobility after heating are disclosed. In one particular exemplary embodiment, the materials may be realized as a material which has reduced apparent molecular weight and/or viscosity and thus increased mobility after a heating process, and which consequently allows material residue to be more easily removed during subsequent cleaning processes. Such a material may be useful in any industrial process which requires heating the material followed by removing material residue.

摘要翻译： 公开了加热后迁移率增加的材料。 在一个具体的示例性实施方案中，材料可以实现为具有降低的表观分子量和/或粘度并因此在加热过程之后增加迁移率的材料，并且因此允许在随后的清洁过程中更容易地去除材料残余物。 这种材料可用于需要加热材料，然后除去材料残渣的任何工业方法中。

公开(公告)号：US20050092819A1

公开(公告)日：2005-05-05

申请号：US10954570

申请日：2004-10-01

申请人： Yan Liu ,  Derrick Herron ,  Ning-Cheng Lee

发明人： Yan Liu ,  Derrick Herron ,  Ning-Cheng Lee

IPC分类号： B23K31/02 ,  B23K35/02 ,  B23K35/12 ,  B23K35/26 ,  B23K35/30 ,  B23K35/36 ,  H05K3/34

CPC分类号： B23K35/025 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/302 ,  B23K35/3612 ,  B23K2101/36 ,  H05K3/3484 ,  H05K2201/0215

摘要： Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity when the two parts are soldered together. In one particular exemplary embodiment, a solder paste may be realized as a composition comprising a solder powder and high melting temperature particles with a flux, wherein the ratio between solder powder and high melting temperature particles may be between 2:1 and 1:10.

摘要翻译： 公开了用于提供高弹性，低刚性焊点的焊膏。 焊膏可以用于其热膨胀系数不匹配的两个部件和/或当两个部件被焊接在一起时机械变形的可能性很高的两个部件之间。 在一个具体的示例性实施例中，焊膏可以实现为包含焊料粉末和具有焊剂的高熔点温度颗粒的组合物，其中焊料粉末和高熔点温度颗粒之间的比例可以在2:1和1:10之间。

公开(公告)号：US06677179B2

公开(公告)日：2004-01-13

申请号：US10008853

申请日：2001-11-16

申请人： Wusheng Yin ,  Ning-Cheng Lee

发明人： Wusheng Yin ,  Ning-Cheng Lee

IPC分类号： H01L2144

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11822 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/00012 ,  H01L2924/00

摘要： A new method has been developed to provide underfill to chips mounted on substrates. First, an underfill is dispensed on the substrate. Second, the bumps of the chip are dipped in a flux that does not contain filler. Third, the chip that has been dipped in a tacky thermosettable flux is placed on the substrate, and fourth, the chip is soldered to the substrate, and simultaneously the underfill is cured. This process eliminates the interference on solder joints caused by the presence of filler in filled no-flow underfill. In addition, the fluxing property of the flux allows the use of underfills with emphasis on curing and mechanical properties instead of fluxing performance. Accordingly, a mounted device with reliable solder joints and underfill encapsulation is obtained.

摘要翻译： 已经开发了一种新的方法来为安装在基板上的芯片提供底部填充。 首先，在基板上分配底部填充物。 第二，将芯片的凸起浸入不含填料的焊剂中。 第三，将已经浸入粘性热固性助熔剂中的芯片放置在基材上，第四，将芯片焊接到基材上，同时将底部填料固化。 该过程消除了在填充的无流动底部填充物中由填料的存在引起的焊点上的干扰。 此外，助焊剂的助熔性能允许使用底层填料，强调固化和机械性能而不是助熔性能。 因此，获得了具有可靠的焊点和底部填充封装的安装装置。

公开(公告)号：US20230241725A1

公开(公告)日：2023-08-03

申请号：US17578615

申请日：2022-01-19

申请人： Ning-Cheng Lee

发明人： Ning-Cheng Lee

IPC分类号： B23K35/02 ,  B23K1/00 ,  B23K35/26 ,  C22C13/00 ,  C22C12/00 ,  C22C28/00 ,  H05K3/34

CPC分类号： B23K35/025 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/264 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H05K3/3485 ,  B23K2101/42

摘要： Solder pastes comprise a high temperature solder powder, a low temperature solder powder and flux. The melting temperature of the low temperature solder powder is lower than that of the high temperature solder powder. The high temperature solder powder and the low temperature solder powder are both capable of wetting upon heating.

公开(公告)号：US20120248176A1

公开(公告)日：2012-10-04

申请号：US13078824

申请日：2011-04-01

申请人： DERRICK Matthew HERRON ,  NING-CHENG LEE ,  FENGYING ZHOU

发明人： DERRICK Matthew HERRON ,  NING-CHENG LEE ,  FENGYING ZHOU

IPC分类号： B23K1/20 ,  B23K35/24 ,  B23K35/363

CPC分类号： B23K35/025 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/30 ,  B23K35/32

摘要： A solder is provided that produces a more impact resistant solder joint that is usable in high-end applications. The solder joint has a strong interconnection that can perform all of the normal functions of a solder joint while being more impact resistant. Furthermore, the solder joint retains its capabilities over the service life of a high-end product such as a computer or a cell phone. The solder meets the requirements of the soldering industry both today and into the future, including but not limited to an ability to be printed or dispensed with standard methods and conformity to health and safety standards.

摘要翻译： 提供了可以在高端应用中使用的焊料，其产生更耐冲击的焊点。 焊点具有很强的互连，可以在更耐冲击的同时执行焊接接头的所有正常功能。 此外，焊接点在诸如计算机或蜂窝电话的高端产品的使用寿命中保持其能力。 该焊料符合当今和未来焊接行业的要求，包括但不限于印刷或分配标准方法和符合健康和安全标准的能力。

公开(公告)号：US20100116376A1

公开(公告)日：2010-05-13

申请号：US12576123

申请日：2009-10-08

申请人： Benlih Huang ,  Ning-Cheng Lee

发明人： Benlih Huang ,  Ning-Cheng Lee

IPC分类号： B23K35/34 ,  B23K1/00

CPC分类号： C22C13/00 ,  B23K35/262 ,  H05K3/3463 ,  H05K2201/10636 ,  Y02P70/611

摘要： A lead-free solder alloy composition comprising tin, silver and copper, and a process for reflow soldering for minimizing tombstoning frequency are disclosed. In one particular exemplary embodiment, the lead-free Sn—Ag—Cu solder alloys for minimizing the tombstoning effect of the present disclosure display high mass fraction during melting and prolonged melting as shown by a widened DSC peaks, that allows for a balanced surface tension on both ends of the chip component to develop. In accordance with further aspects of this exemplary embodiment, the alloys display a mass fraction of solid during melting greater than 20% and a DSC peak width greater than 8° C. using a 5° C./min scan rate. In accordance with further aspects of this exemplary embodiment, the alloy comprises on a weight basis Ag 1-4.5%, Cu 0.3-1% balanced with Sn.

摘要翻译： 公开了一种包含锡，银和铜的无铅焊料合金组合物，以及用于最小化墓碑频率的回流焊接方法。 在一个具体的示例性实施例中，用于最小化本公开的墓碑效应的无铅Sn-Ag-Cu焊料合金在熔化和延长熔化期间显示高质量分数，如扩大的DSC峰所示，其允许平衡的表面张力 在芯片组件的两端进行开发。 根据该示例性实施方案的其它方面，合金在熔化时显示大于20％的固体的质量分数，并且使用5℃/ min扫描速率显示大于8℃的DSC峰宽。 根据本示例性实施方案的其它方面，合金的重量基础为Ag 1-4.5％，Cu为0.3-1％，与Sn平衡。

公开(公告)号：US20070256761A1

公开(公告)日：2007-11-08

申请号：US11745784

申请日：2007-05-08

申请人： Hong-Sik Hwang ,  Ning-Cheng Lee

发明人： Hong-Sik Hwang ,  Ning-Cheng Lee

IPC分类号： C22C28/00

CPC分类号： C22C28/00 ,  B23K35/24 ,  H01L23/3733 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/4275 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/16221 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29313 ,  H01L2224/32012 ,  H01L2224/32014 ,  H01L2224/81192 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/3651 ,  H01L2924/01048 ,  H01L2924/0108 ,  H01L2924/01083 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2224/29311 ,  H01L2924/00012 ,  H01L2224/05599

摘要： Alloy compositions and techniques for reducing IMC thickness and oxidation of metals and alloys are disclosed. In one particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy or mixture consisting essentially of from about 90% to about 99.999% by weight indium and from about 0.001% to about 10% by weight germanium and unavoidable impurities. In another particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy consisting essentially of from about 90% to about 99.999% by weight gallium and from about 0.001% to about 10% by weight germanium and unavoidable impurities.

摘要翻译： 公开了用于降低金属和合金的IMC厚度和氧化的合金组成和技术。 在一个具体的示例性实施方案中，合金组合物可以实现为基本上由约90重量％至约99.999重量％的铟和约0.001重量％至约10重量％的锗和不可避免的杂质组成的合金或混合物。 在另一个具体的示例性实施方案中，合金组合物可以实现为基本上由约90重量％至约99.999重量％的镓和约0.001重量％至约10重量％的锗和不可避免的杂质组成的合金。

公开(公告)号：US20070134125A1

公开(公告)日：2007-06-14

申请号：US11567525

申请日：2006-12-06

申请人： Weiping Liu ,  Ning-Cheng Lee

发明人： Weiping Liu ,  Ning-Cheng Lee

IPC分类号： C22C13/00

CPC分类号： C22C13/00 ,  C22C13/02

摘要： Lead-free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably comprise 0.0-4.0 wt. % of Ag, 0.01-1.5 wt. % of Cu, at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, Ce in an amount of 0.001-0.8 wt. %, Y in an amount of 0.001-1.0 wt. %, Ti in an amount of 0.001-0.8 wt. %, and Bi in an amount of 0.01-1.0 wt. %, and the remainder of Sn.

摘要翻译： 公开了具有改进的耐滴落冲击性的无铅焊料合金及其焊点。 在一个具体的示例性实施方案中，无铅焊料合金优选包含0.0-4.0wt。 ％的Ag，0.01-1.5wt。 ％的Cu，以下添加剂中的至少一种：Mn为0.001〜1.0重量％ ％，Ce为0.001-0.8wt。 ％，Y为0.001〜1.0重量％。 ％，Ti为0.001-0.8重量％ ％，Bi为0.01〜1.0重量％。 ％，剩余的Sn。

公开(公告)号：US20070071634A1

公开(公告)日：2007-03-29

申请号：US11422782

申请日：2006-06-07

申请人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

发明人： Benlih Huang ,  Hong-Sik Hwang ,  Ning-Cheng Lee

IPC分类号： C22C13/00

CPC分类号： C22C13/00 ,  B23K35/262

摘要： Low melting temperature compliant solders are disclosed. In one particular exemplary embodiment, a low melting temperature compliant solder alloy comprises from about 91.5% to about 97.998% by weight tin, from about 0.001% to about 3.5% by weight silver, from about 0.0% to about 1.0% by weight copper, and from about 2.001% to about 4.0% by weight indium.

摘要翻译： 披露了低熔点温度的焊料。 在一个具体的示例性实施方案中，低熔点兼容性焊料合金包含约91.5重量％至约97.998重量％的锡，约0.001重量％至约3.5重量％的银，约0.0重量％至约1.0重量％的铜， 和约2.001重量％至约4.0重量％的铟。