CHIP LEVEL BIOSTABLE INTERCONNECT FOR IMPLANTABLE MEDICAL DEVICES
    24.
    发明申请
    CHIP LEVEL BIOSTABLE INTERCONNECT FOR IMPLANTABLE MEDICAL DEVICES 有权
    用于可植入医疗器械的芯片级可生物互连

    公开(公告)号:US20070260287A1

    公开(公告)日:2007-11-08

    申请号:US11735832

    申请日:2007-04-16

    申请人: Rogier Receveur

    发明人: Rogier Receveur

    IPC分类号: A61N1/00

    摘要: A lead is connected to an integrated circuit in an implantable medical device in a lead bonding area that includes a lead-receiving recessed region. At least a portion of a lead conductor is bonded in the lead-receiving recessed region, making an electrical and mechanical connection to the integrated circuit that is strong and potentially biostable. In some embodiments, a filler material is provided around the recessed portion of the integrated circuit that receives the lead conductor, and a metal coating is provided around an outer surface of the filler material for additional mechanical stability.

    摘要翻译: 引线与包括引线接收凹入区域的引线接合区域中的可植入医疗器件中的集成电路连接。 引线导体的至少一部分结合在引线接收凹入区域中,使得与集成电路的电连接和机械连接是强的并且具有潜在的生物稳定性。 在一些实施例中,填充材料设置在集成电路的凹陷部分周围,该集成电路的凹部接收引线导体,并且在填充材料的外表面周围设置金属涂层以用于额外的机械稳定性。

    Chip level biostable interconnect for implantable medical devices
    25.
    发明申请
    Chip level biostable interconnect for implantable medical devices 有权
    用于可植入医疗器械的芯片级生物稳定互连

    公开(公告)号:US20060241731A1

    公开(公告)日:2006-10-26

    申请号:US11114451

    申请日:2005-04-26

    申请人: Rogier Receveur

    发明人: Rogier Receveur

    IPC分类号: A61N1/05

    摘要: A lead is connected to an integrated circuit in an implantable medical device in a lead bonding region that includes a lead-receiving recessed region. At least a portion of a lead conductor is bonded in the lead-receiving recessed region, making an electrical and mechanical connection to the integrated circuit that is strong and potentially biostable. In some embodiments, a filler material is provided around the recessed portion of the integrated circuit that receives the lead conductor, and a metal coating is provided around an outer surface of the filler material for additional mechanical stability.

    摘要翻译: 引线连接到包括引线接收凹入区域的引线接合区域中的可植入医疗器件中的集成电路。 引线导体的至少一部分结合在引线接收凹入区域中,使得与集成电路的电连接和机械连接是强的并且具有潜在的生物稳定性。 在一些实施例中,填充材料设置在集成电路的凹陷部分周围,该集成电路的凹部接收引线导体,并且在填充材料的外表面周围设置金属涂层以用于额外的机械稳定性。

    Wafer level hermetically sealed MEMS device
    26.
    发明申请
    Wafer level hermetically sealed MEMS device 有权
    晶圆级气密密封的MEMS器件

    公开(公告)号:US20060192272A1

    公开(公告)日:2006-08-31

    申请号:US11066820

    申请日:2005-02-25

    IPC分类号: H01L23/58

    摘要: A hermetically sealed microelectromechanical system (MEMS) package includes a MEMS switch having a movable portion and a stationary portion with an electrical contact thereon. A glass lid is anodically bonded to the MEMS switch to form a sealed cavity over the movable portion of the MEMS switch. The glass lid includes a contact aperture to allow access to the electrical contact on the stationary portion of the MEMS switch. A family of body-implantable hermetically-sealed MEMS packages are provided according to certain aspects and embodiments of the present invention.

    摘要翻译: 密封的微机电系统(MEMS)封装包括具有可移动部分的MEMS开关和在其上具有电接触的固定部分。 玻璃盖阳极结合到MEMS开关,以在MEMS开关的可移动部分上形成密封空腔。 玻璃盖包括接触孔,以允许接近MEMS开关的固定部分上的电接触。 根据本发明的某些方面和实施例提供了一系列可植入人体的气密密封的MEMS封装。

    MEMs switching circuit and method for an implantable medical device
    27.
    发明申请
    MEMs switching circuit and method for an implantable medical device 有权
    用于可植入医疗装置的MEMs切换电路和方法

    公开(公告)号:US20050115811A1

    公开(公告)日:2005-06-02

    申请号:US10973117

    申请日:2004-10-26

    摘要: A bistable MEMS switch for use in selectively opening or closing electrical circuits included in an implantable medical device system is provided. The switch includes a central movable beam having a movable contact; a suspension system for supporting the movable beam and generating a contact force; an actuator for displacing the beam upon application of an activation signal, and a fixed contact for interfacing the movable contact when the switch is in a closed state. The switch is fabricated from a Si/SiO2/Si wafer using photolithography, DRIE and sacrificial oxide etching followed by metalization of electrical contact points with a wear-resistant metal or alloy. An actuation layer may be fabricated from the silicon substrate layer of the wafer and the signal layer may be fabricated from the top silicon layer. The actuation layer and signal layer are thereby electrically decoupled and mechanically coupled by the intervening SiO2 layer.

    摘要翻译: 提供了一种用于选择性地打开或关闭包括在可植入医疗装置系统中的电路的双稳态MEMS开关。 开关包括具有可移动触点的中心可动梁; 用于支撑可移动梁并产生接触力的悬架系统; 用于在施加激活信号时移动所述光束的致动器,以及用于当所述开关处于闭合状态时将所述可动触头对接的固定触点。 使用光刻,DRIE和牺牲氧化物蚀刻由Si / SiO 2 / Si / Si晶片制造开关,随后用耐磨金属或合金金属化电接触点。 可以从晶片的硅衬底层制造致动层,并且可以从顶部硅层制造信号层。 因此,致动层和信号层通过介入的SiO 2层进行电去耦和机械耦合。

    System and apparatus for controlled activation of acute use medical devices
    29.
    发明授权
    System and apparatus for controlled activation of acute use medical devices 有权
    用于急性用途医疗装置的受控激活的系统和装置

    公开(公告)号:US08706253B2

    公开(公告)日:2014-04-22

    申请号:US13226399

    申请日:2011-09-06

    IPC分类号: A61N1/08

    CPC分类号: A61N1/3787 A61N1/08 A61N1/378

    摘要: An integrated activation system for an implantable medical device (IMD) sharing a power source, the activation system comprising a switching circuit having first and second inputs and having an output coupled to the acute use device, a gating element coupled to the first input and configured to gate power from the power source to the switching circuit, and a sensing element coupled to the second input of the switching circuit. The sensing element is configured to sense an activation condition, enable an operation interval of the switching circuit, and transmit a signal to the switching circuit during the activation condition. The switching circuit is configured to transmit power to the acute use device upon receipt of a pre-determined number of signals from the sensing element.

    摘要翻译: 一种用于共享电源的可植入医疗装置(IMD)的集成激活系统,所述激活系统包括具有第一和第二输入并且具有耦合到所述急性使用装置的输出的切换电路,耦合到所述第一输入并配置的门控元件 从电源到开关电路的栅极电力,以及耦合到开关电路的第二输入的感测元件。 感测元件被配置为感测激活条件,启用开关电路的操作间隔,并且在激活条件期间将信号发送到开关电路。 开关电路被配置为在接收到来自感测元件的预定数量的信号时将功率传送到急用设备。