公开(公告)号：US20100020563A1

公开(公告)日：2010-01-28

申请号：US12508512

申请日：2009-07-23

申请人： Masayasu Ito ,  Tsukasa Tokida

发明人： Masayasu Ito ,  Tsukasa Tokida

IPC分类号： B60Q1/00

CPC分类号： F21V29/67 ,  F21S41/143 ,  F21S41/147 ,  F21S45/43 ,  F21S45/60 ,  F21S48/335 ,  F21V29/02 ,  F21W2102/00 ,  F21Y2101/02 ,  F21Y2115/10

摘要： An automotive lamp is provided with: a lamp chamber formed so as to include a lamp body having a front end opening portion and a translucent cover provided on the lamp body so as to cover the front end opening portion; a lamp unit that is housed inside the lamp chamber and includes a semiconductor light emitting device as a light source; a bracket that includes a light source mounting portion having a mounting surface for the semiconductor light emitting device and a plurality of radiating fins, thermally in contact with the light source mounting portion and arranged such that ventilation passages extend from the lamp body side toward the translucent cover, are formed, and that supports the lamp unit; and a fan that blows air such that air flows through the ventilation passages from the lamp body side toward the translucent cover.

摘要翻译： 汽车灯设置有：灯室，其形成为包括：灯体，其具有设置在灯体上的前端开口部和透光罩，以覆盖前端开口部; 灯单元，其容纳在灯室内并且包括作为光源的半导体发光器件; 支架，其包括具有用于半导体发光器件的安装表面的光源安装部分和与光源安装部分热接触的多个散热片，并且布置成使得通风通道从灯体侧朝向半透明 盖，形成，并支撑灯单元; 以及吹出空气的风扇，使得空气从灯体侧向透光罩流过通风通道。

公开(公告)号：US20070206369A1

公开(公告)日：2007-09-06

申请号：US11712788

申请日：2007-03-01

申请人： Hitoshi Takeda ,  Tsukasa Tokida

发明人： Hitoshi Takeda ,  Tsukasa Tokida

IPC分类号： H05K7/00

CPC分类号： F21S41/147 ,  F21S41/192 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light source module includes a ceramic circuit board having a predetermined conductive pattern, a semiconductor light emitting element arranged on said ceramic circuit board and connected to the conductive pattern, and an attachment for power feeding bonded to the ceramic circuit board. The attachment for power feeding is provided with a power feeding part connected to an external power source, a plate-shaped part adjacent to a position opposed to an outer circumferential surface of the ceramic circuit board, and a power feeding terminal formed in plate shape and protruded from the plate-shaped part to a side of the ceramic circuit board. The top of the power feeding terminal is connected to a part of the conductive pattern with the top overlapped from a thickness direction. The power feeding terminal of the attachment for power feeding is fixed and connected to the conductive pattern of the ceramic circuit board.

摘要翻译： 光源模块包括具有预定导电图案的陶瓷电路板，布置在所述陶瓷电路板上并连接到导电图案的半导体发光元件，以及用于馈电的附件，结合到陶瓷电路板。 供电装置设有与外部电源连接的供电部，与陶瓷电路基板的外周面相对的位置附近的板状部以及形成为板状的供电端子， 从板状部突出到陶瓷电路基板的一侧。 馈电端子的顶部连接到导电图案的一部分，顶部与厚度方向重叠。 用于供电的附件的馈电端子固定并连接到陶瓷电路板的导电图案。

公开(公告)号：US07165871B2

公开(公告)日：2007-01-23

申请号：US10985714

申请日：2004-11-10

申请人： Hitoshi Takeda ,  Tsukasa Tokida

发明人： Hitoshi Takeda ,  Tsukasa Tokida

IPC分类号： B60Q1/04

CPC分类号： F21S41/155 ,  F21S41/14 ,  F21S41/143 ,  F21S41/147 ,  F21S41/16 ,  F21V9/30 ,  F21Y2115/10 ,  F21Y2115/30

摘要： The lamp for generating light, comprises a semiconductor light emitting element for emitting light, a fluorescent material, provided away from the semiconductor light emitting element, a first optical member operable to focus the light generated by the semiconductor light emitting element on the fluorescent material; and a second optical member having an optical center at a position where the fluorescent material is provided, operable to emit light from the fluorescent material based on the light focused by the first optical member to an outside of the lamp. The lamp is used as a headlamp in a vehicle, and the second optical member emits the light from the fluorescent material to the outside of the lamp, so that the second optical member form sat least one of a part of a cut line that defines a boundary between a bright region and a dark region of the headlamp.

摘要翻译： 用于产生光的灯包括用于发射光的半导体发光元件，远离半导体发光元件设置的荧光材料，可操作以将由半导体发光元件产生的光聚焦在荧光材料上的第一光学元件; 以及第二光学构件，其具有在设置有荧光体的位置处的光学中心，可操作以基于由第一光学构件聚焦的光将光从荧光材料发射到灯的外部。 该灯被用作车辆中的前照灯，第二光学构件将从荧光材料发出的光发射到灯的外部，使得第二光学构件形成至少一个切割线的一部分， 前照灯的明亮区域和暗区域之间的边界。

公开(公告)号：US09267655B2

公开(公告)日：2016-02-23

申请号：US13459485

申请日：2012-04-30

申请人： Hidetada Tanaka ,  Takashi Inoue ,  Takayuki Yagi ,  Ken Kato ,  Tsukasa Tokida ,  Hidemichi Sone

发明人： Hidetada Tanaka ,  Takashi Inoue ,  Takayuki Yagi ,  Ken Kato ,  Tsukasa Tokida ,  Hidemichi Sone

IPC分类号： F21S8/10

CPC分类号： F21S48/1305 ,  F21S41/143 ,  F21S41/147 ,  F21S41/192 ,  F21S41/39 ,  F21S41/47 ,  F21S45/43

摘要： A vehicle lamp includes: an LED mount on which an LED is placed; an attachment that fixes the LED to the LED mount; a power supply that supplies power to the LED; a first optical member that controls light emitted from the LED; and a second optical member that controls light emitted from the first optical member. The power supply and the first optical member are provided at the attachment.

摘要翻译： 车灯包括：放置LED的LED安装座; 将LED固定到LED支架的附件; 供电给LED的电源; 第一光学构件，其控制从所述LED发射的光; 以及第二光学构件，其控制从第一光学构件发射的光。 电源和第一光学构件设置在附件处。

公开(公告)号：US07829903B2

公开(公告)日：2010-11-09

申请号：US11362687

申请日：2006-02-27

申请人： Hitoshi Takeda ,  Masayasu Ito ,  Tsukasa Tokida

发明人： Hitoshi Takeda ,  Masayasu Ito ,  Tsukasa Tokida

IPC分类号： H01L29/201

CPC分类号： H01L25/167 ,  H01L2224/48091 ,  H05B33/0803 ,  H05B33/0815 ,  H05B33/0821 ,  H01L2924/00014

摘要： A light emitting apparatus includes a semiconductor light emitting element mounted on a circuit board; a lighting circuit part mounted on the circuit board; and a cover which covers the semiconductor light emitting element and the lighting circuit part. The lighting circuit part converts a voltage inputted from a power source into electromagnetic energy and propagates the converted electromagnetic energy to the semiconductor light emitting element as light emitting energy, and the cover transmits light from the semiconductor light emitting element.

摘要翻译： 发光装置包括安装在电路板上的半导体发光元件; 安装在电路板上的照明电路部分; 以及覆盖半导体发光元件和点亮电路部的盖。 照明电路部分将从电源输入的电压转换为电磁能，并将转换的电磁能传播到半导体发光元件作为发光能量，并且盖透射来自半导体发光元件的光。

公开(公告)号：US07626212B2

公开(公告)日：2009-12-01

申请号：US11448229

申请日：2006-06-07

申请人： Tsukasa Tokida

发明人： Tsukasa Tokida

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  F21S41/141 ,  F21S41/147 ,  F21Y2115/10 ,  H01L25/167 ,  H01L33/483 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K3/328 ,  H05K2201/10106 ,  H05K2201/10977 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a light-emitting device, a mount member mounting a semiconductor light-emitting element is mounted on a circuit board. A multilayer board is used for the mount member. A first conductive pattern formed on the surface layer of the multilayer board and a semiconductor light-emitting element are electrically connected. On the multilayer board, a second conductive pattern formed on an intermediate layer positioned closer to the circuit board than the first conductive pattern is electrically connected to the conductor part of the circuit board with a conductive wire such as a gold wire. Power is fed from the conductor part to the semiconductor light-emitting element via the conductive wire and the conductive patterns.

摘要翻译： 在发光装置中，安装半导体发光元件的安装构件安装在电路板上。 用于安装构件的多层板。 形成在多层板的表面层上的第一导电图案和半导体发光元件电连接。 在多层基板上，形成在比第一导电图案更靠近电路板的中间层上形成的第二导电图案用导线例如金线电连接到电路板的导体部分。 电力通过导线和导电图案从导体部分馈送到半导体发光元件。

公开(公告)号：US20070274086A1

公开(公告)日：2007-11-29

申请号：US11805193

申请日：2007-05-22

申请人： Hitoshi Takeda ,  Tsukasa Tokida ,  Hiroyuki Ishida

发明人： Hitoshi Takeda ,  Tsukasa Tokida ,  Hiroyuki Ishida

IPC分类号： B60Q1/00 ,  B60Q11/00

CPC分类号： F21V19/001 ,  F21S41/147 ,  F21S41/32 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting module includes a semiconductor light emitting element disposed on a rectangular board, and a pair of plane-shaped electrode portions formed on the board and coupled to the semiconductor light emitting element The pair of plane-shaped electrode portions is separated in first opposite directions, and a center of the semiconductor light emitting element is shifted from a center of the board in one of second opposite directions. End faces of the pair of plane-shaped electrode portions do not protrude in the one of the second opposite directions from an end face of the semiconductor light emitting element on a side facing toward the one of the second opposite directions. The first opposite directions are directions along which one pair of opposite sides of the board extend, and the second opposite directions are directions along which the other pair of opposite sides of the board extend.

摘要翻译： 发光模块包括设置在矩形板上的半导体发光元件和形成在板上并耦合到半导体发光元件的一对平面形状的电极部分。一对平面形电极部分在第一相对的 方向，并且半导体发光元件的中心在第二相反方向之一上从板的中心偏移。 一对平面状电极部的端面从与半导体发光元件的朝向第二相反方向一侧的端面的第二相反方向的一方突出。 第一相反方向是板的一对相对侧延伸的方向，并且第二相对方向是板的另一对相对侧延伸的方向。

公开(公告)号：US07282747B2

公开(公告)日：2007-10-16

申请号：US11033872

申请日：2005-01-13

申请人： Hitoshi Takeda ,  Hisayoshi Daichou ,  Tsukasa Tokida ,  Hiroyuki Ishida

发明人： Hitoshi Takeda ,  Hisayoshi Daichou ,  Tsukasa Tokida ,  Hiroyuki Ishida

IPC分类号： H01L29/22 ,  H01L29/24

CPC分类号： H01L33/56 ,  F21S41/00 ,  F21Y2115/10 ,  H01L2933/0091

摘要： A light-emitting module having a light-emitting efficiency. The light-emitting module that emits light includes a semiconductor light-emitting element operable to emit light, and a sealing member operable to seal the semiconductor light-emitting element with materials that transmit the light emitted from the light-emitting module, in which the semiconductor light-emitting element includes a sapphire substrate that transmits light toward the sealing member to send the transmitted light from a facing face facing the sealing member and forms a sub-wavelength grating for reducing reflection of light on the facing face in grid periods shorter than a wavelength of the light transmitted through the sapphire substrate, and a semiconductor layer that is formed on a rear face of the facing face in the sapphire substrate by crystal growth and emits light toward the sapphire substrate.

摘要翻译： 具有发光效率的发光模块。 发光的发光模块包括可操作以发光的半导体发光元件和可操作以用透射从发光模块发出的光的材料密封半导体发光元件的密封构件，其中， 半导体发光元件包括：蓝宝石衬底，其将光朝向密封构件透射以从面向密封构件的面对面发送透射光，并形成子波长光栅，用于减少面对面上的光的反射，栅格周期短于 通过蓝宝石衬底透射的光的波长，以及通过晶体生长形成在蓝宝石衬底的面对面的后表面上并向蓝宝石衬底发光的半导体层。

公开(公告)号：US20070171662A1

公开(公告)日：2007-07-26

申请号：US11656525

申请日：2007-01-23

申请人： Tsukasa Tokida

发明人： Tsukasa Tokida

IPC分类号： B60Q1/00

CPC分类号： F21V29/74 ,  F21S41/147 ,  F21S41/192 ,  F21S45/47 ,  F21V29/76 ,  F21Y2115/10 ,  H01L2224/16225 ,  H05K1/117 ,  H05K3/0061 ,  H05K3/328 ,  H05K2201/09172 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/1034

摘要： A light source module includes a circuit board on which a predetermined conductive pattern is formed, a semiconductor light emitting element mounted on the circuit board, and a plurality of power supplying terminals to which power cords for supplying electric power to the semiconductor light emitting element are connected. An entire lower face of the circuit board is electrically insulated, and the plurality of power supplying terminals is fixed onto the conductive pattern on the circuit board. The plurality of power supplying terminals protrudes from the circuit board.

摘要翻译： 光源模块包括其上形成有预定导电图案的电路板，安装在电路板上的半导体发光元件和多个供电端子，用于向半导体发光元件供电的电源线为 连接的。 电路板的整个下表面是电绝缘的，并且多个供电端子固定在电路板上的导电图案上。 多个供电端子从电路板突出。

公开(公告)号：US20060284161A1

公开(公告)日：2006-12-21

申请号：US11451404

申请日：2006-06-13

申请人： Tsukasa Tokida

发明人： Tsukasa Tokida

IPC分类号： H01L29/06 ,  H01L31/00

CPC分类号： H01L33/52 ,  F21S41/147 ,  F21S41/25 ,  F21Y2115/10 ,  H01L33/58

摘要： A light source module is provided with a semiconductor light emitting element disposed in a hollow airtight region within a cover fixed to a circuit board, and electrodes which are disposed outside of the airtight region and supplies a current to the semiconductor light emitting element. The circuit board is provided with a non-conductive layer serving as a base member and having non-conductivity and also provided with conductive patterns for coupling the semiconductor light emitting element to the electrodes. Then, the cover is fixed on the non-conductive layer.

摘要翻译： 光源模块设置有设置在固定到电路板的盖内的空心气密区域中的半导体发光元件，以及设置在气密区域外部并将电流提供给半导体发光元件的电极。 该电路板设置有用作基底构件并具有非导电性的非导电层，并且还设置有用于将半导体发光元件耦合到电极的导电图案。 然后，将盖固定在非导电层上。