公开(公告)号：US07696522B2

公开(公告)日：2010-04-13

申请号：US11223431

申请日：2005-09-08

申请人： Masato Ono ,  Shinya Sonobe ,  Hiroyuki Ishida ,  Tsukasa Tokida

发明人： Masato Ono ,  Shinya Sonobe ,  Hiroyuki Ishida ,  Tsukasa Tokida

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/44 ,  H01L33/508 ,  H01L33/56 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2933/0041 ,  H01L2224/05541 ,  H01L2224/05005 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A light emitting device including a light source and a light transforming 101 member containing a fluorescent substance for absorbing at least a part of a light emitted from the light source and for emitting a light having a different wavelength. The light source includes a plurality of semiconductor light emitting units 104, at least a part of which are covered with the light transforming member 101. A shielding member 102 between a first semiconductor light emitting unit 104a covered with the light transforming member 101 and a second semiconductor light emitting unit 104b which is adjacent to the semiconductor light emitting unit 104a.

摘要翻译： 一种发光器件，包括光源和含有用于吸收从光源发射的光的至少一部分并用于发射具有不同波长的光的荧光物质的光转换101元件。 光源包括多个半导体发光单元104，其至少一部分被光转换构件101覆盖。覆盖有光转换构件101的第一半导体发光单元104a和第二半导体发光单元104a之间的屏蔽构件102 与半导体发光单元104a相邻的半导体发光单元104b。

公开(公告)号：US07535727B2

公开(公告)日：2009-05-19

申请号：US11656525

申请日：2007-01-23

申请人： Tsukasa Tokida

发明人： Tsukasa Tokida

IPC分类号： H05K7/00

CPC分类号： F21V29/74 ,  F21S41/147 ,  F21S41/192 ,  F21S45/47 ,  F21V29/76 ,  F21Y2115/10 ,  H01L2224/16225 ,  H05K1/117 ,  H05K3/0061 ,  H05K3/328 ,  H05K2201/09172 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/1034

摘要： A light source module includes a circuit board on which a predetermined conductive pattern is formed, a semiconductor light emitting element mounted on the circuit board, and a plurality of power supplying terminals to which power cords for supplying electric power to the semiconductor light emitting element are connected. An entire lower face of the circuit board is electrically insulated, and the plurality of power supplying terminals is fixed onto the conductive pattern on the circuit board. The plurality of power supplying terminals protrudes from the circuit board.

摘要翻译： 光源模块包括其上形成有预定导电图案的电路板，安装在电路板上的半导体发光元件和多个供电端子，用于向半导体发光元件供电的电源线为 连接的。 电路板的整个下表面是电绝缘的，并且多个供电端子固定在电路板上的导电图案上。 多个供电端子从电路板突出。

公开(公告)号：US20080111143A1

公开(公告)日：2008-05-15

申请号：US11937109

申请日：2007-11-08

申请人： Hiroyuki Ishida ,  Tsukasa Tokida

发明人： Hiroyuki Ishida ,  Tsukasa Tokida

IPC分类号： H01L33/00

CPC分类号： H01L33/38 ,  F21S41/00 ,  F21Y2105/00

摘要： A light-emitting module includes a semiconductor light-emitting element with a generally oblong shape, and a planar electrode formed on a surface of the semiconductor light-emitting element. The planar electrode has a generally right triangular electrode portion that is defined by an oblique cut-off line on any one of four corners of the semiconductor light-emitting element. The planar electrode is formed with a wire bonding portion that establishes a current-carrying connection with the generally right triangular electrode portion.

摘要翻译： 发光模块包括大致椭圆形的半导体发光元件和形成在半导体发光元件的表面上的平面电极。 平面电极具有由半导体发光元件的四个角中的任一个上的倾斜切断线限定的大致直角的三角形电极部。 平面电极形成有与大致右三角形电极部分建立通电连接的引线接合部分。

公开(公告)号：US20080008427A1

公开(公告)日：2008-01-10

申请号：US11825586

申请日：2007-07-06

申请人： Hitoshi Takeda ,  Tsukasa Tokida ,  Kazunori Watanabe ,  Masato Ono

发明人： Hitoshi Takeda ,  Tsukasa Tokida ,  Kazunori Watanabe ,  Masato Ono

IPC分类号： G02B6/36

CPC分类号： F21V19/0015 ,  F21K9/00 ,  F21S41/147 ,  F21S41/192 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： A ceramic board is formed in an almost rectangular shape and has one side surface of an outer peripheral surface formed as an abutting surface, which is caused to abut on positioning surfaces of a radiating member, and one surface in a vertical direction formed as a device disposing surface on which a semiconductor light emitting device is to be disposed. Predetermined conductive patterns are formed on the ceramic board. A light emitting portion has a semiconductor light emitting device. A pair of positive and negative planar electrode portions are formed on the ceramic board and connected to the semiconductor light emitting device through the conductive patterns. At least a part of the pair of planar electrode portions are set to be exposure regions exposed to the device disposing surface of the ceramic board and the exposure regions are positioned in portions other than a portion linked to the abutting surface in an outer peripheral portion of the device disposing surface.

摘要翻译： 陶瓷板形成为大致矩形形状，并且具有形成为邻接表面的外周面的一个侧表面，该侧表面被抵接在散热构件的定位表面上，并且在竖直方向上形成为一个表面作为装置 配置半导体发光装置的配置面。 在陶瓷板上形成预定的导电图案。 发光部分具有半导体发光器件。 一对正极和负极平面电极部分形成在陶瓷板上，并通过导电图案连接到半导体发光器件。 一对平面电极部的至少一部分被设定为暴露于陶瓷板的器件配置面的曝光区域，曝光区域位于除了与 设备布置表面。

公开(公告)号：US07282748B2

公开(公告)日：2007-10-16

申请号：US11033900

申请日：2005-01-13

申请人： Hitoshi Takeda ,  Hisayoshi Daichou ,  Tsukasa Tokida ,  Hiroyuki Ishida

发明人： Hitoshi Takeda ,  Hisayoshi Daichou ,  Tsukasa Tokida ,  Hiroyuki Ishida

IPC分类号： H01L33/00

CPC分类号： F21S41/155 ,  F21S41/143 ,  F21Y2113/00 ,  F21Y2115/10 ,  H01L33/56 ,  H01L2933/0091

摘要： A light-emitting module having a light-emitting efficiency. The light-emitting module that emits light includes a semiconductor light-emitting element that emits light; and a light transmission member that is provided to cover the semiconductor light-emitting element with materials for transmitting the light emitted from the semiconductor light-emitting element and forms a sub-wavelength grating for reducing reflection of the light on its outgoing face for sending the light incident from an interface facing said semiconductor light-emitting element to its outside in grid periods shorter than a wavelength of the light transmitted by the light transmission member.

摘要翻译： 具有发光效率的发光模块。 发光的发光模块包括发光的半导体发光元件; 以及透光构件，其被设置为用于透射从半导体发光元件发射的光的材料覆盖半导体发光元件，并形成用于减少其出射面上的光的反射的亚波长光栅，用于发送 从面向所述半导体发光元件的界面以比光透射构件透射的光的波长短的网格周期入射到其外部的光。

公开(公告)号：US20070109806A1

公开(公告)日：2007-05-17

申请号：US11589663

申请日：2006-10-30

申请人： Hironori Tsukamoto ,  Tsukasa Tokida

发明人： Hironori Tsukamoto ,  Tsukasa Tokida

IPC分类号： F21S8/10

CPC分类号： F21S41/147 ,  F21S41/192 ,  F21S45/47 ,  F21Y2115/10 ,  Y10S362/80

摘要： A vehicular lamp 10 including an LED module 60 that is a light source and a power supply socket 70 for connecting the LED module to a power supply. The LED module is made of an LED substrate 61, an LED 62 mounted on the LED substrate, a pair of positive and negative current-conducting parts 63 connected to the LED and formed on both sides of the LED. The power supply socket includes a base body 71 made from an insulating material and a pair of positive and negative terminals 72 held in a pair of holding portions 73 of the base body. When the LED module is set in the power supply socket, the holding portions of power supply socket hold the side edge portions of the LED module, and the pair of positive and negative terminals come into contact with the current-conducting parts of the LED module.

摘要翻译： 包括作为光源的LED模块60和用于将LED模块连接到电源的电源插座70的车辆灯10。 LED模块由LED基板61，安装在LED基板上的LED62，连接到LED并形成在LED两侧的一对正极和负极导电部63构成。 电源插座包括由绝缘材料制成的基体71和保持在基体的一对保持部73中的一对正极和负极72。 当LED模块设置在电源插座中时，电源插座的保持部分保持LED模块的侧边缘部分，并且一对正极端子和负极端子与LED模块的导电部件接触 。

公开(公告)号：US20060284303A1

公开(公告)日：2006-12-21

申请号：US11448229

申请日：2006-06-07

申请人： Tsukasa Tokida

发明人： Tsukasa Tokida

IPC分类号： H01L23/48

CPC分类号： H01L33/62 ,  F21S41/141 ,  F21S41/147 ,  F21Y2115/10 ,  H01L25/167 ,  H01L33/483 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K3/328 ,  H05K2201/10106 ,  H05K2201/10977 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a light-emitting device, a mount member mounting a semiconductor light-emitting element is mounted on a circuit board. A multilayer board is used for the mount member. A first conductive pattern formed on the surface layer of the multilayer board and a semiconductor light-emitting element are electrically connected. On the multilayer board, a second conductive pattern formed on an intermediate layer positioned closer to the circuit board than the first conductive pattern is electrically connected to the conductor part of the circuit board with a conductive wire such as a gold wire. Power is fed from the conductor part to the semiconductor light-emitting element via the conductive wire and the conductive patterns.

公开(公告)号：US20050105301A1

公开(公告)日：2005-05-19

申请号：US10985714

申请日：2004-11-10

申请人： Hitoshi Takeda ,  Tsukasa Tokida

发明人： Hitoshi Takeda ,  Tsukasa Tokida

IPC分类号： F21S8/12 ,  F21S8/10 ,  F21V9/16 ,  F21V13/00 ,  F21W101/10 ,  F21Y101/02

CPC分类号： F21S41/155 ,  F21S41/14 ,  F21S41/143 ,  F21S41/147 ,  F21S41/16 ,  F21V9/30 ,  F21Y2115/10 ,  F21Y2115/30

摘要： The lamp for generating light, comprises a semiconductor light emitting element for emitting light, a fluorescent material, provided away from the semiconductor light emitting element, a first optical member operable to focus the light generated by the semiconductor light emitting element on the fluorescent material; and a second optical member having an optical center at a position where the fluorescent material is provided, operable to emit light generated by the fluorescent material based on the light focused by the first optical member to an outside of the lamp. The lamp is used as a headlamp in a vehicle, and the second optical member emits the light generated by the fluorescent material to the outside of the lamp, so that the second optical member form sat least one of a part of a cut line that defines a boundary between a bright region and a dark region of the headlamp.

摘要翻译： 用于产生光的灯包括用于发射光的半导体发光元件，远离半导体发光元件设置的荧光材料，可操作以将由半导体发光元件产生的光聚焦在荧光材料上的第一光学元件; 以及第二光学构件，其具有在设置有荧光材料的位置处的光学中心，可操作以基于由第一光学构件聚焦的光将荧光材料产生的光发射到灯的外部。 灯被用作车辆中的前照灯，第二光学构件将由荧光材料产生的光发射到灯的外部，使得第二光学构件形成至少一个切割线的一部分，其限定 前照灯的亮区域和暗区域之间的边界。

公开(公告)号：US20140151726A1

公开(公告)日：2014-06-05

申请号：US14232364

申请日：2012-06-21

申请人： Shinpei Maeda ,  Tsukasa Tokida

发明人： Shinpei Maeda ,  Tsukasa Tokida

IPC分类号： H01L33/54

CPC分类号： H01L33/54 ,  F21S41/143 ,  F21S41/24 ,  F21S41/285 ,  F21S41/321 ,  F21S41/322 ,  F21S45/43 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/507 ,  H01L33/52 ,  H01L33/58 ,  H01L2224/17 ,  H01L2924/0002 ,  H01L2933/0058 ,  H01L2924/00

摘要： There are provided a light emitting module including a luminescent material layer (15) which is disposed so as to cover a light emitting surface (13a) of a semiconductor light emitting element (13) and which changes a wavelength of at least part of light emitted from the semiconductor light emitting element, and a light shielding wall (16) which surrounds the semiconductor light emitting element and the luminescent material layer from the circumference thereof, and the luminescent material layer is bonded to the semiconductor light emitting element and the light shielding wall with a bonding resin (23) having a light transmittivity, a distal end portion of the light shielding wall is caused to project further forwards than the luminescent material layer, and a transparent resin (24) is applied so as to cover an exposed surface (20a) of a distal end portion (21) of the light shielding wall.

摘要翻译： 提供了一种发光模块，其包括发光材料层（15），该发光材料层被设置为覆盖半导体发光元件（13）的发光表面（13a）并且改变至少部分发射的光的波长 从半导体发光元件和从其周围包围半导体发光元件和发光材料层的遮光壁（16），发光材料层与半导体发光元件和遮光壁 通过具有透光性的接合树脂（23），使遮光壁的前端部比发光材料层向前方突出，并且施加透明树脂（24）以覆盖露出面（ 20a）的遮光壁的远端部分（21）。

公开(公告)号：US07901123B2

公开(公告)日：2011-03-08

申请号：US11805193

申请日：2007-05-22

申请人： Hitoshi Takeda ,  Tsukasa Tokida ,  Hiroyuki Ishida

发明人： Hitoshi Takeda ,  Tsukasa Tokida ,  Hiroyuki Ishida

IPC分类号： F21V7/04

CPC分类号： F21V19/001 ,  F21S41/147 ,  F21S41/32 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting module includes a semiconductor light emitting element disposed on a rectangular board, and a pair of plane-shaped electrode portions formed on the board and coupled to the semiconductor light emitting element. The pair of plane-shaped electrode portions is separated in first opposite directions, and a center of the semiconductor light emitting element is shifted from a center of the board in one of second opposite directions. End faces of the pair of plane-shaped electrode portions do not protrude in the one of the second opposite directions from an end face of the semiconductor light emitting element on a side facing toward the one of the second opposite directions. The first opposite directions are directions along which one pair of opposite sides of the board extend, and the second opposite directions are directions along which the other pair of opposite sides of the board extend.

摘要翻译： 发光模块包括设置在矩形板上的半导体发光元件和形成在板上并耦合到半导体发光元件的一对平面状电极部。 一对平面状电极部分在第一相反方向上分离，并且半导体发光元件的中心在第二相反方向之一上从板的中心偏移。 一对平面状电极部的端面从与半导体发光元件的朝向第二相反方向一侧的端面的第二相反方向的一方突出。 第一相反方向是板的一对相对侧延伸的方向，并且第二相对方向是板的另一对相对侧延伸的方向。