摘要:
A QFN package includes a die attach pad having a recessed area; a semiconductor die mounted inside the recessed area; an inner terminal lead disposed adjacent to the die attach pad; a first wire bonding the inner terminal lead to the semiconductor die; an outer terminal lead; an intermediary terminal disposed between the inner terminal lead and the outer terminal lead; a second wire bonding the intermediary terminal to the semiconductor die; and a third wire bonding the intermediary terminal to the outer terminal lead. A circuit board includes a core layer; a first metal trace disposed over a first side of the core layer; and a first solder mask covering the first metal trace. The QFN package is mounted over the first solder mask. No metal pad of the first metal trace is formed within an area corresponding to the intermediary terminal.
摘要:
A method for making a quad flat non-lead (QFN) semiconductor package includes half etching a first side of a carrier to form top portions of a lead array and a die attach surface of a die attach pad, wherein the lead array includes at least one inner terminal lead disposed adjacent to the die attach pad, at least one extended, outer terminal lead disposed along periphery of the QFN semiconductor package, and at least one intermediary terminal disposed between the inner terminal lead and the extended, outer terminal lead, wherein the intermediary terminal is disposed between the inner terminal lead and the extended, outer terminal lead.
摘要:
A semiconductor chip package includes a chip; first and second connection pads arranged in a matrix and disposed about the chip, and the first and second connection pads have different bottom surface shapes when viewed from a bottom of the QFN package; bonding pads provided on an active surface of the chip and being electrically connected with corresponding said connection pads through bonding wires; and a package body encapsulating the chip, the bonding wires and an upper portion of each of the connection pads such that a lower portion of each of the connection pads extends outward from a bottom of the package body.
摘要:
A quad flat non-lead (QFN) semiconductor package includes a die attach pad having a recessed area; a semiconductor die mounted inside the recessed area of the die attach pad; at least one row of inner terminal leads disposed adjacent to the die attach pad; first wires bonding respective said inner terminal leads to the semiconductor die; at least one row of extended, outer terminal leads disposed along periphery of the QFN semiconductor package; at least one row of intermediary terminals disposed between the inner terminal leads and the extended, outer terminal leads; second wires bonding respective the intermediary terminals to the semiconductor die; and third wires bonding respective the intermediary terminals to the extended, outer terminal leads.