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公开(公告)号：US09655251B2
公开(公告)日：2017-05-16
申请号：US14627382
申请日：2015-02-20
申请人： Via Mechanics, Ltd.
发明人： Yujiro Araki , Toru Yuki , Katsunori Tokinaga
CPC分类号： H05K3/0047 , H05K1/0251 , H05K3/429 , H05K2203/0207 , Y10T408/03 , Y10T408/173
摘要： The present invention aims to provide a backdrilling method and a backdrilling apparatus that can ensure the backdrilling depth accuracy. Using a multilayer printed wiring board in which a reference depth detection region is allocated where a reference depth detection layer is formed in the same layer with an internal wiring layer electrically connected to a stub, the thickness and the depth of the reference depth detection layer are measured in the reference depth detection region using a drill bit. The drill bit is moved relative to the multilayer printed wiring board to a backdrilling portion. The drilling is performed using the drill bit to the depth which is calculated using the ratio of the depth of the reference depth detection layer to the thickness of the multilayer printed wiring board in the reference depth detection region.
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22.发明授权Laser machining method, laser machining apparatus, and laser machining program 有权激光加工方法，激光加工设备和激光加工程序公开(公告)号：US09269058B2
公开(公告)日：2016-02-23
申请号：US13945509
申请日：2013-07-18
申请人： Via Mechanics, Ltd.
发明人： Hidekatsu Ozawa
IPC分类号： B23K26/04 , B23K26/382 , H05K3/00 , G06Q10/04 , B23K26/38 , B23K26/06 , B23K26/08 , B23K26/40 , B23K26/02
CPC分类号： G06Q10/043 , B23K26/02 , B23K26/04 , B23K26/0648 , B23K26/082 , B23K26/0853 , B23K26/38 , B23K26/382 , B23K26/40 , B23K2103/50 , H05K3/00 , H05K3/0005 , H05K3/0008 , H05K3/0026
摘要： Variation in hole diameter due to heating effects is minimized even if the shortest machining route is set, and machining quality is improved. A printed circuit board to be scanned by a laser beam is divided into a plurality of scan areas (S1). An order of drilling within the scan area is sorted to obtain a scanning route with the shortest distance (S2). The order of the (N+1)th hole and the (N+2)th hole is swapped in each scanning area if it is determined that the distance between the Nth hole and the (N+1)th hole (here, N is an integer in a range of 1≦N≦“the maximum number of holes to be drilled in the area”−1″) is less than a predetermined threshold value, and that N+1 is not correspond to the maximum number of holes to be drilled in the scanning area (S3). The scanning area is machined and then machining each scanning area, specifically in machining the (N+1)th hole, after pausing for a period of a predetermined heat dissipation time if it is determined that the distance between the N-th hole and the (N+1)th hole swapped is less than the predetermined threshold value. Subsequently, machining is performed (S4).
摘要翻译： 即使设置最短的加工路径，并且加工质量得到改善，由于加热效果而导致的孔径的变化被最小化。 由激光束扫描的印刷电路板被划分为多个扫描区域（S1）。 对扫描区域内的钻孔顺序进行排序，得到距离最短的扫描路线（S2）。 如果确定第N孔和第（N + 1）孔之间的距离（这里为N（N + 1））孔，则在每个扫描区域中交替排列第（N + 1）孔和第（N + 是1＆nlE范围内的整数; N＆nlE;“区域”-1“中要钻孔的最大数量）小于预定阈值，并且N + 1不对应于最大孔数 在扫描区域中钻（S3）。 对扫描区域进行加工，然后加工每个扫描区域，特别是在第（N + 1）孔加工一段预定的散热时间后，如果确定第N个孔和 （N + 1）个孔小于预定阈值。 随后，进行加工（S4）。
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公开(公告)号：US20240040704A1
公开(公告)日：2024-02-01
申请号：US18356419
申请日：2023-07-21
申请人： Via Mechanics, Ltd.
发明人： Yasushi ITO , Takumi OSANAI
IPC分类号： H05K3/00
CPC分类号： H05K3/007 , H05K3/0052 , H05K3/0029 , H05K3/4688
摘要： A purpose of the present invention is to provide a method of processing a substrate to improve a processing efficiency of the substrate. The method includes steps of: dividing a raw ceramic substrate into small substrates; annealing the divided small substrates; arraying the annealed small substrates; fixing the arrayed small substrates by using an organic member to form a large substrate; emitting laser beam to the arrayed small substrates in the large substrate to process a through hole; filling the through hole with a conductor; printing a wiring on the arrayed small substrates in the large substrate; stacking a new layer on front and back surfaces of the arrayed small substrates in the large substrate; and cutting the organic member of the large substrate to divide the large substrate into the small substrates.
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公开(公告)号：US20210187667A1
公开(公告)日：2021-06-24
申请号：US17132987
申请日：2020-12-23
申请人： Via Mechanics, Ltd.
发明人： Yuki Saeki
IPC分类号： B23K26/382 , B23K26/00 , B23K26/04 , B23K26/046 , B23K26/0622 , B23K26/064 , B23K26/082
摘要： A purpose of the present invention is to quickly change a focal point of a laser emission system so that processing with high quality and good processing efficiency can be performed. In a laser processing apparatus including: a laser oscillator configured to output a laser pulse; a laser polarizer configured to polarize the laser pulse in a two-dimensional direction; and a controller configured to control the laser oscillator and the laser polarizer, the laser processing apparatus being configured to emit the laser pulse to a workpiece for processing the workpiece, the laser processing apparatus has a feature in which an electrooptic device capable of, under control of the controller, electrically changing a focal point of the laser pulse to be input to the laser polarizer is arranged in an input side of the laser polarizer.
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公开(公告)号：US20200004057A1
公开(公告)日：2020-01-02
申请号：US16447474
申请日：2019-06-20
申请人： Via Mechanics, Ltd.
发明人： Kazuya MATSUMOTO , Kazuo WATANABE , Atsushi SAKAMOTO , Masanori SATO , Mitsuru KATO , Masaru KIKUCHI
IPC分类号： G02F1/11 , H01S3/00 , H05K3/00 , B23K26/382
摘要： A laser processing apparatus disclosed in the present application includes: an optical deflection unit capable of changing a deflection direction of and outgoing energy of an incoming laser pulse by changes of a frequency of and an amplitude of a driving signal to be supplied; and a control unit configured to supply driving signals with amplitudes corresponding to respective frequencies. In a laser processing apparatus configured to process a workpiece by leading outgoing laser pulse of the optical deflection unit to the workpiece and irradiating the workpiece with the laser pulse, as the amplitude corresponding to each of the frequencies, the control unit supplies an amplitude having the ratio that is close to the lowest ratio among ratios of the outgoing energy with respect to the incoming energy of the laser pulse at an amplitude having the largest outgoing energy of the optical deflection unit.
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公开(公告)号：US10086472B2
公开(公告)日：2018-10-02
申请号：US14262055
申请日：2014-04-25
申请人： Via Mechanics, Ltd.
IPC分类号： B23K26/08 , B23K26/38 , B23K26/0622 , B23K26/364 , H05K3/00 , B23K103/00
摘要： A laser machining method for cutting or cutting grooves on a workpiece using an apparatus having an X-Y table for mounting the workpiece, a laser source emitting a continuous wave or a quasi-continuous wave laser beam, modulator forming a pulsed laser beam by a high-speed modulation of the continuous wave or quasi-continuous wave laser beam, and an optical system capable of converging the pulsed laser beam on the workpiece, wherein the method comprising cutting with the pulsed laser beams along a locus including a portion where the moving speed of the X-Y table is decreased, and the pitch of holes machined with said laser pulses is kept constant by adjusting the intervals between successive said laser pulses in accordance with the moving speed of said workpiece, the method further comprising increasing the pulse widths of the laser pulses in accordance with the decrease in moving speed of the X-Y table in the portion where the moving speed of the X-Y table is decreased.
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公开(公告)号：US09030061B2
公开(公告)日：2015-05-12
申请号：US14296576
申请日：2014-06-05
申请人： Via Mechanics, Ltd.
CPC分类号： H02K33/00 , G02B26/105 , H02K1/276 , H02K1/2766 , H02K21/12 , H02K21/14 , H02K26/00 , H02K2213/03
摘要： A galvanoscanner including: a rotor including a shaft as a rotational center, and permanent magnets disposed around the shaft and polarized to a plurality of poles in a circumferential direction of the shaft; and a stator disposed in the outside of the rotor through a clearance and including coils, a yoke, and an outer casing so that the rotor swings in a predetermined angle range; wherein: the permanent magnets are provided with grooves which are formed in a direction of the rotation shaft so as to straddle circumferentially adjacent magnetic poles of the permanent magnets; and the permanent magnets are parted into at least two parts per pole by parting lines. Thus, the ratio of the torque constant to the moment of inertia can be improved so that the current required for driving can be reduced and reduction of power consumption at driving time can be attained.
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公开(公告)号：US09008143B2
公开(公告)日：2015-04-14
申请号：US14470148
申请日：2014-08-27
申请人： Via Mechanics, Ltd.
发明人： Hideho Yamamura , Goichi Ohmae , Nobuyoshi Ohtani
CPC分类号： H01S3/032 , H01S3/03 , H01S3/0305 , H01S3/034 , H01S3/036 , H01S3/09705 , H01S3/134
摘要： The present invention aims to prevent, in a gas laser resonator, the deterioration in quality of discharge by reduction of the change of the pressure in a discharge chamber and the inflow of impurity gases, such as air, into the discharge chamber. A bracket 6 is attached to one end of a tube 1 interposing a gasket 13 only for sealing an opening of the discharge chamber 2 only and a gasket 14 for sealing both openings of the discharge chamber 2 and a buffer chamber 12. Also, a glass plate 8 and further a bracket 9 are attached to the other end of the tube 1 interposing a gasket 15 only for sealing the opening of the discharge chamber 2 and a gasket 16 for sealing both openings of the discharge chamber 2 and the buffer chamber 12. The pressure in the buffer chamber 12 is set lower than that of the discharge chamber 2 or set higher than the atmospheric pressure to decrease the inflow of the impurity gases to the discharge chamber 2.
摘要翻译： 本发明旨在通过减小放电室中的压力变化和诸如空气的杂质气体的流入而在气体激光谐振器中防止放电质量的劣化进入放电室。 托架6安装在插入垫圈13的管1的一端，仅用于密封排出室2的开口和用于密封排出室2和缓冲室12的两个开口的垫圈14。 板8和另外的支架9附接到管1的另一端，该管1插入仅用于密封排出室2的开口的垫圈15和用于密封排出室2和缓冲室12的两个开口的垫圈16。 缓冲室12中的压力被设定为低于排放室2的压力或设定为高于大气压，以减少杂质气体流入排放室2。
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公开(公告)号：US20150063397A1
公开(公告)日：2015-03-05
申请号：US14470148
申请日：2014-08-27
申请人： Via Mechanics, Ltd.
发明人： Hideho YAMAMURA , Goichi OHMAE , Nobuyoshi OHTANI
CPC分类号： H01S3/032 , H01S3/03 , H01S3/0305 , H01S3/034 , H01S3/036 , H01S3/09705 , H01S3/134
摘要： The present invention aims to prevent, in a gas laser resonator, the deterioration in quality of discharge by reduction of the change of the pressure in a discharge chamber and the inflow of impurity gases, such as air, into the discharge chamber.A bracket 6 is attached to one end of a tube 1 interposing a gasket 13 only for sealing an opening of the discharge chamber 2 only and a gasket 14 for sealing both openings of the discharge chamber 2 and a buffer chamber 12. Also, a glass plate 8 and further a bracket 9 are attached to the other end of the tube 1 interposing a gasket 15 only for sealing the opening of the discharge chamber 2 and a gasket 16 for sealing both openings of the discharge chamber 2 and the buffer chamber 12. The pressure in the buffer chamber 12 is set lower than that of the discharge chamber 2 or set higher than the atmospheric pressure to decrease the inflow of the impurity gases to the discharge chamber 2.
摘要翻译： 本发明旨在通过减小放电室中的压力变化和诸如空气的杂质气体的流入而在气体激光谐振器中防止放电质量的劣化进入放电室。 托架6安装在插入垫圈13的管1的一端，仅用于密封排出室2的开口和用于密封排出室2和缓冲室12的两个开口的垫圈14。 板8和另外的支架9附接到管1的另一端，该管1插入仅用于密封排出室2的开口的垫圈15和用于密封排出室2和缓冲室12的两个开口的垫圈16。 缓冲室12中的压力被设定为低于排放室2的压力或设定为高于大气压，以减少杂质气体流入排放室2。
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公开(公告)号：US20140285036A1
公开(公告)日：2014-09-25
申请号：US14296523
申请日：2014-06-05
申请人： Via Mechanics, Ltd.
IPC分类号： H02K33/00
CPC分类号： H02K33/00 , G02B26/105 , H02K1/276 , H02K1/2766 , H02K21/12 , H02K21/14 , H02K26/00 , H02K2213/03
摘要： A galvanoscanner including: a rotor including a shaft as a rotational center, and permanent magnets disposed around the shaft and polarized to a plurality of poles in a circumferential direction of the shaft; and a stator disposed in the outside of the rotor through a clearance and including coils, a yoke, and an outer casing so that the rotor swings in a predetermined angle range; wherein: the permanent magnets are provided with grooves which are formed in a direction of the rotation shaft so as to straddle circumferentially adjacent magnetic poles of the permanent magnets; and the permanent magnets are parted into at least two parts per pole by parting lines. Thus, the ratio of the torque constant to the moment of inertia can be improved so that the current required for driving can be reduced and reduction of power consumption at driving time can be attained.
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