公开(公告)号：US07587248B2

公开(公告)日：2009-09-08

申请号：US11108641

申请日：2005-04-19

Applicant: Frank Risi ,  Peter Gibson ,  Ya Ling Tam

Inventor： Frank Risi ,  Peter Gibson ,  Ya Ling Tam

IPC: A61N1/04

CPC classification number: A61N1/0541 ,  A61N1/36036

Abstract: An implantable device having an elongate electrode carrier with a longitudinal axis, the carrier having at least one electrode mounted in the electrode carrier so as to provide exposure to the exterior of the electrode carrier, and at least one closed break in the surface of the electrode carrier arranged to allow flexing of the electrode carrier.

Abstract translation: 一种具有纵向轴线的细长电极载体的可植入装置，所述载体具有安装在所述电极载体中的至少一个电极，以便提供暴露于所述电极载体的外部，以及所述电极表面中的至少一个闭合断裂 载体布置成允许电极载体弯曲。

公开(公告)号：US07448016B2

公开(公告)日：2008-11-04

申请号：US11472975

申请日：2006-06-21

Applicant: Chan-Fei Tai ,  Ya-Ling Huang

Inventor： Chan-Fei Tai ,  Ya-Ling Huang

IPC: G06F17/50 ,  H05K1/00 ,  H01R12/00

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A pad layout of a printed circuit board includes a first and a second pad symmetrically arranged on the PCB for cooperatively receiving either a first surface mounted component (SMC) or a second surface mounted component (SMC). Each of the SMCs includes a first footprint and a second footprint. The first pad has a polygonal shape corresponding to a minimum sized shape that accommodates both a shape of the first footprint of the first SMC and a shape of the first footprint of the second SMC. The second pad has a polygonal shape corresponding to a minimum sized shape that accommodates both a shape of the second footprint of the first SMC and a shape of the second footprint of the second SMC.

Abstract translation: 印刷电路板的焊盘布局包括对称地布置在PCB上的第一和第二焊盘，用于协作地接收第一表面安装部件（SMC）或第二表面安装部件（SMC）。 每个SMC包括第一足迹和第二足迹。 第一垫具有对应于最小尺寸形状的多边形形状，其适应第一SMC的第一印迹的形状和第二SMC的第一印迹的形状。 第二垫具有对应于最小尺寸形状的多边形形状，其适应第一SMC的第二印迹的形状和第二SMC的第二印迹的形状。

公开(公告)号：US20070241435A1

公开(公告)日：2007-10-18

申请号：US11580124

申请日：2006-10-13

Applicant: Chih-Yuan Wang ,  Heng-Yi Chang ,  Ya-Ling Hsu ,  Yi-Te Lee

Inventor： Chih-Yuan Wang ,  Heng-Yi Chang ,  Ya-Ling Hsu ,  Yi-Te Lee

IPC: H01L23/02

CPC classification number: H01L24/10 ,  G02F1/13452 ,  H01L24/13 ,  H01L24/81 ,  H01L33/62 ,  H01L2224/10135 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13311 ,  H01L2224/13316 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/16 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81805 ,  H01L2224/83101 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention includes a substrate with a glass plate, a plurality of oxide wires on the glass plate and a plurality of flip chip bumps on the oxide wires and an integrated circuit chip with a plurality of bump pads. The substrate and the integrated circuit chip are hot pressed with a predetermined bonding pressure and temperature to bond the bump pads to the flip chip bumps respectively by eutectic bonding.

Abstract translation: 本发明包括具有玻璃板的基板，玻璃板上的多个氧化物线和氧化物线上的多个倒装芯片凸块和具有多个凸点焊盘的集成电路芯片。 基板和集成电路芯片以预定的接合压力和温度被热压以分别通过共晶接合将凸块焊接到倒装芯片凸块。

公开(公告)号：US07222865B2

公开(公告)日：2007-05-29

申请号：US11012385

申请日：2004-12-14

Applicant: Yu-Tien Chen ,  Qing-Yao Cai ,  Ya-Ling Hung

Inventor： Yu-Tien Chen ,  Qing-Yao Cai ,  Ya-Ling Hung

IPC: B62B1/04

CPC classification number: F16M3/00 ,  B25H1/04

Abstract: A foldable frame assembly includes a base frame having a wheel-carrying end for mounting a wheel unit, a handgrip end, and an intermediate portion connected to a prop member so as to lift the base frame to a standing position. A tabletop has a front tabletop end pivoted to the intermediate portion for suspending a machine above the ground surface so as to enable a rear tabletop end to turn from a working position to a folded position. A bracing member has an anchoring end pivotally mounted on the wheel-carrying end, and a slidable end coupled with the rear tabletop end such that when the rear tabletop end is turned from the working position to the folded position, the slidable end is turned to be close to the intermediate portion. A rear locking unit is disposed to guard against movement of the slidable end.

Abstract translation: 可折叠框架组件包括具有用于安装车轮单元的车轮承载端的底座框架，手柄端部和连接到支架构件的中间部分，以便将基座框架提升到站立位置。 桌面具有枢转到中间部分的前台面端部，用于将机器悬挂在地面上方，以使得后台面端部能够从工作位置转动到折叠位置。 支撑构件具有枢转地安装在车轮承载端上的锚定端，以及与后台面端部联接的可滑动端，使得当后台面端部从工作位置转动到折叠位置时，可滑动端部转向 靠近中间部分。 设置后锁定单元以防止可滑动端的运动。

公开(公告)号：US07094697B2

公开(公告)日：2006-08-22

申请号：US10979161

申请日：2004-11-03

Applicant: Meng Fen Cheng ,  Ya Ling Po ,  Ting Sing Wang

Inventor： Meng Fen Cheng ,  Ya Ling Po ,  Ting Sing Wang

IPC: H01L21/311 ,  H01L21/8242 ,  H01L21/20

CPC classification number: H01L29/66181 ,  H01L21/30604 ,  H01L21/30608 ,  H01L27/1087

Abstract: The method for preparing a deep trench uses a dry etching process to form a trench in a silicon substrate, and an etching mixture is then coated on the surface of the silicon substrate and inside the deep trench. A portion of etching mixture is removed from the surface of the silicon substrate and the trench above a predetermined depth from the surface of the substrate, and an etching process is then performed using the etching mixture remaining inside the trench to etch the silicon substrate below the predetermined depth so as to form the deep trench. The etching mixture comprises a conveying solution and an etchant, and the viscosity of the conveying solution is higher than that of the etchant. The conveying solution is spin-on-glass or a photoresist, and the etchant is tetramethylammonium hydroxide, ammonium, or hydrofluoric acid. The volume ratio of the conveying solution and the etchant is preferably between 50:1 and 20:1.

Abstract translation: 制备深沟槽的方法使用干蚀刻工艺在硅衬底中形成沟槽，然后将蚀刻混合物涂覆在硅衬底的表面上和深沟槽内。 蚀刻混合物的一部分从硅衬底的表面和沟槽上方超过衬底表面的预定深度去除，然后使用残留在沟槽内的蚀刻混合物进行蚀刻工艺，以将硅衬底 预定深度以形成深沟槽。 蚀刻混合物包括输送溶液和蚀刻剂，并且输送溶液的粘度高于蚀刻剂的粘度。 输送溶液是旋涂玻璃或光致抗蚀剂，蚀刻剂是四甲基氢氧化铵，铵或氢氟酸。 输送溶液和蚀刻剂的体积比优选为50:1至20:1。

公开(公告)号：US20060090179A1

公开(公告)日：2006-04-27

申请号：US10973675

申请日：2004-10-26

Applicant: Ya-Ling Hsu ,  Wen-Hsiang Lee

Inventor： Ya-Ling Hsu ,  Wen-Hsiang Lee

IPC: H04H9/00

CPC classification number: H04H20/31

Abstract: An apparatus includes a processor and a memory. The memory has a supplemental information module stored therein. The processor is in communication with the memory, and the processor is adapted to receive a given work of multimedia content and implement the supplemental information module to generate a supplemental information record, which includes supplemental information related to the given work of content. The processor is also adapted to generate an enhanced work of content by embedding the supplemental information record into a bit stream comprising the given work of content.

Abstract translation: 一种装置包括处理器和存储器。 存储器具有存储在其中的补充信息模块。 处理器与存储器通信，并且处理器适于接收给定的多媒体内容工作，并且实现补充信息模块以生成补充信息记录，其包括与给定的内容工作相关的补充信息。 处理器还适于通过将补充信息记录嵌入到包括给定的内容工作的比特流中来生成增强的内容工作。

公开(公告)号：US20050139994A1

公开(公告)日：2005-06-30

申请号：US11023353

申请日：2004-12-29

Applicant: Hung-Ta Hsu ,  Tzu-Bin Lin ,  Ya-Ling Huang

Inventor： Hung-Ta Hsu ,  Tzu-Bin Lin ,  Ya-Ling Huang

IPC: H01L23/31 ,  H01L23/36 ,  H01L23/373 ,  H01L23/34 ,  H01L21/48

CPC classification number: H01L23/3737 ,  H01L23/3128 ,  H01L23/36 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package includes a die attached to a substrate. Multitudes of conductive structures are conductively connected the die and the substrate. One molding compound encapsulates the die, and thermal interface material is on the molding compound. Next, a heat sink is on the thermal interface material. The mold compound material performs a coefficient of thermal expansion smaller than the heat sink so as to prevent the die or substrate from the damages of internal stresses.

Abstract translation: 半导体封装包括附接到衬底的管芯。 多个导电结构导电地连接管芯和衬底。 一种模塑料封装模具，热界面材料在模塑料上。 接下来，散热器在热界面材料上。 模具复合材料的热膨胀系数小于散热器，以防止模具或衬底损坏内部应力。

公开(公告)号：US06547588B1

公开(公告)日：2003-04-15

申请号：US09428523

申请日：1999-10-28

Applicant: Chun-Hsien Hsu ,  Ya-Ling Hung

Inventor： Chun-Hsien Hsu ,  Ya-Ling Hung

IPC: H01R1360

CPC classification number: H01R13/518

Abstract: An embedded type connector comprises a connector main body and at least one embedded socket stage. The connector main body is of hollow shape and has a bottom wall, a left wall, a right wall and a rear wall on inner sides thereof. The left wall and the right wall have two vertically extended insertion grooves and two projecting rails, respectively. The bottom wall has a plurality of terminal holes. The embedded socket stage comprises an insertion plate and a socket mounted on the plate and having a plurality of terminal holes. The insertion plate has dents on both sides thereof with separation same as the rails, The embedded socket stage is inserted into the main body with the dent fitted with the projecting rail and slides downward. In this way, the at least one embedded socket stage can be stacked within the main body.

Abstract translation: 嵌入式连接器包括连接器主体和至少一个嵌入式插座级。 连接器主体为中空形状，在其内侧具有底壁，左壁，右壁和后壁。 左壁和右壁分别具有两个垂直延伸的插入槽和两个突出轨道。 底壁具有多个端子孔。 嵌入式插座级包括插入板和安装在板上并具有多个端子孔的插座。 插入板在两侧具有与轨道相同的凹槽。嵌入式插座台插入主体，凹陷装有突出的导轨并向下滑动。 以这种方式，至少一个嵌入式插座级可以堆叠在主体内。

公开(公告)号：US10206433B2

公开(公告)日：2019-02-19

申请号：US15391874

申请日：2016-12-28

Applicant: Ya-Ling Ding

Inventor： Ya-Ling Ding

IPC: A24F47/00 ,  H05B1/02

Abstract: A controlling method for an electronic cigarette with multiple output modes and an electronic cigarette are disclosed. The controlling method comprises receiving a first operation signal for switching between output modes when the electronic cigarette is in a standby state. An output mode is in a memory, the output mode corresponding to the first operation signal and displacing a previous output mode. When the electronic cigarette receives a smoking signal, outputs are controlled according to the output mode stored in the memory.

公开(公告)号：US09625691B2

公开(公告)日：2017-04-18

申请号：US13589187

申请日：2012-08-20

Applicant: Ya-Ling Hsu ,  Yi-Hsueh Chen ,  Hsin-Hung Lin ,  Ching-Lun Lin ,  Wan-Chiang Wang ,  Chao-Shun Chen

Inventor： Ya-Ling Hsu ,  Yi-Hsueh Chen ,  Hsin-Hung Lin ,  Ching-Lun Lin ,  Wan-Chiang Wang ,  Chao-Shun Chen

IPC: G02B17/08 ,  G02B5/10

CPC classification number: G02B17/08 ,  G02B5/10

Abstract: A projection lens configured to form an image from an image source which is disposed at an object side is provided. The projection lens includes a lens group and an aspheric mirror. The lens group has a first optical axis, and an intermediate image is formed by the lens group from the image source. The aspheric mirror has a second optical axis and an aspheric surface. The lens group is disposed between the object side and the aspheric mirror. The aspheric surface faces the lens group and reflects the intermediate image to form the image at an image side. The first optical axis is not coaxial with the second optical axis, and an offset of the image relative to the first optical axis is larger than or equal to 100%.