公开(公告)号：US20090203204A1

公开(公告)日：2009-08-13

申请号：US12213230

申请日：2008-06-17

申请人： Gil-sub Kim ,  Yong-il Kim ,  Jong-seop Lee ,  Jai-kyun Park ,  Yun-sung Lee ,  Nam-jung Kang

发明人： Gil-sub Kim ,  Yong-il Kim ,  Jong-seop Lee ,  Jai-kyun Park ,  Yun-sung Lee ,  Nam-jung Kang

IPC分类号： H01L21/28

CPC分类号： H01L21/28061 ,  H01L29/1037 ,  H01L29/4236 ,  H01L29/4941 ,  H01L29/66621

摘要： Methods of manufacturing a semiconductor device having an RCAT are provided. The method includes forming a first recess having a first depth formed in an active region of a semiconductor substrate, and a second recess having a second depth that is less than the first depth formed in an isolation layer. The depth of the second recess is decreased by removing the isolation layer from the upper surface of the isolation layer by a desired thickness. A gate dielectric layer is formed on an inner wall of the first recess and a gate is formed on the gate dielectric layer.

摘要翻译： 提供了具有RCAT的半导体器件的制造方法。 该方法包括形成具有形成在半导体衬底的有源区中的第一深度的第一凹部和具有小于在隔离层中形成的第一深度的第二深度的第二凹部。 通过将隔离层从隔离层的上表面移除希望的厚度来减小第二凹部的深度。 栅电介质层形成在第一凹槽的内壁上，栅极形成在栅介质层上。

公开(公告)号：US20080266483A1

公开(公告)日：2008-10-30

申请号：US12105078

申请日：2008-04-17

申请人： Yong-Il KIM

发明人： Yong-Il KIM

IPC分类号： G02F1/13357 ,  F21V8/00

CPC分类号： G02B6/0088 ,  G02B6/009 ,  G02F1/133308 ,  G02F1/133615 ,  G02F2001/133314 ,  G02F2001/133322 ,  G02F2201/465

摘要： Disclosed is an LCD apparatus having a reduced size and weight. The LCD apparatus includes a bottom chassis having a bottom surface and first to fourth sidewalls. The sidewall of the bottom chassis includes a supporting member for preventing a light guiding plate from being moved and a fixing boss for fixing an optical sheet. The bottom chassis includes a lamp insertion portion for receiving a lamp unit, which is disposed on the third and fourth sidewalls of the bottom chassis. The bottom chassis receives a reflecting plate, the light guiding plate and the optical sheet. A mold frame is coupled to the bottom chassis to fix the reflecting plate, the light guiding plate and the optical sheet to the bottom chassis. A display unit disposed on the mold frame is fixed to the mold frame by a top chassis coupled to the mold frame. Accordingly, a bottom mold frame for receiving a backlight assembly is removed, so that it is able to reduce a cost of the LCD apparatus and a weight thereof.

摘要翻译： 公开了一种具有减小尺寸和重量的LCD装置。 液晶显示装置包括具有底表面和第一至第四侧壁的底架。 底部底盘的侧壁包括用于防止导光板移动的支撑构件和用于固定光学片的固定凸起。 底部底盘包括用于接收灯单元的灯插入部分，该灯单元设置在底部底盘的第三和第四侧壁上。 底部底盘容纳反射板，导光板和光学片。 模具框架联接到底部底盘以将反射板，导光板和光学片固定到底部底盘。 设置在模具框架上的显示单元通过联接到模具框架的顶部底盘固定到模具框架。 因此，用于接收背光组件的底模框架被去除，从而能够降低LCD装置的成本及其重量。

公开(公告)号：US20070298662A1

公开(公告)日：2007-12-27

申请号：US11765156

申请日：2007-06-19

申请人： Yong-il KIM

发明人： Yong-il KIM

IPC分类号： H01R13/66

CPC分类号： H01R33/02 ,  H01R13/743 ,  Y10T29/49208

摘要： A lamp socket includes a lamp connection unit which is electrically connected to a lamp, a power connection unit which is disposed below and adjacent to the lamp connection unit along a longitudinal axis and is electrically connected to an electric source which supplies power to the lamp, and a fastening member which is disposed on the power connection unit, wherein the power connection unit comprises at least one sub-component which has a surface area perpendicular to the longitudinal axis which is larger than the largest surface area of the lamp connection unit perpendicular to the longitudinal axis and wherein the sub-component of the power connection unit with the largest surface area perpendicular to the longitudinal axis is located proximate to the lamp connection unit.

摘要翻译： 灯座包括与灯电连接的灯连接单元，电源连接单元，其沿着纵向轴线设置在灯连接单元的下方并与灯连接单元相邻并且电连接到向灯供电的电源， 以及紧固构件，其设置在所述电力连接单元上，其中所述电力连接单元包括至少一个子部件，所述至少一个子部件具有垂直于所述纵向轴线的表面积，所述表面面积大于所述灯连接单元的最大表面积垂直于 所述纵向轴线并且其中具有垂直于所述纵向轴线的最大表面积的所述电力连接单元的子部件位于所述灯连接单元附近。

公开(公告)号：US07304249B2

公开(公告)日：2007-12-04

申请号：US10837701

申请日：2004-05-04

申请人： Sung-Gue Lee ,  Yong-Il Kim

发明人： Sung-Gue Lee ,  Yong-Il Kim

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H05K3/243 ,  H05K3/28 ,  H05K2201/09881 ,  H05K2203/0597 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

摘要： Bonding pad(s) for a printed circuit board with circuit patterns are provided. The bonding pad(s) include a plurality of copper patterns formed on the PCB and electrically connected to the circuit patterns, a filler filled between the copper patterns such that an upper surface of the copper pattern is exposed, and a plating layer applied at an upper surface of the copper patterns. An interval between wire bonding pad(s) is reduced by preventing a nickel plating layer and a gold plating layer from protruding at a lower portion of a copper pattern when they are formed on the copper patterns.

摘要翻译： 提供了具有电路图案的印刷电路板的接合焊盘。 焊盘包括形成在PCB上并电连接到电路图案的多个铜图案，填充在铜图案之间的填充物，使得铜图案的上表面暴露，并且镀覆层 铜图案的上表面。 通过防止镀镍层和镀金层在铜图案上形成时在铜图案的下部突出，从而降低引线接合焊盘之间的间隔。

公开(公告)号：US20070153154A1

公开(公告)日：2007-07-05

申请号：US11619237

申请日：2007-01-03

申请人： Sang-hyeok Lee ,  Yong-il Kim ,  Sang-sun Han ,  Jae-min Choi ,  Dong-wook Kim ,  Young-nam Kim

发明人： Sang-hyeok Lee ,  Yong-il Kim ,  Sang-sun Han ,  Jae-min Choi ,  Dong-wook Kim ,  Young-nam Kim

IPC分类号： G02F1/1333

CPC分类号： G02F1/133604 ,  G02F1/133608

摘要： A display device includes a liquid crystal display panel, a light source unit and a housing accommodating the light source unit. The light source unit includes a light source part and a light source supporting member supporting the light source part. The housing includes an insertion accommodating part provided in a bottom surface of the housing. The light source supporting member includes a planar main body, a light source holder and an insertion part protruding from the main body toward the housing to be coupled to the insertion accommodating part. The insertion part includes an engagement part and a connecting part. The insertion part is inserted in the insertion accommodating part and the light source supporting member is rotated at a predetermined angle.

摘要翻译： 显示装置包括液晶显示面板，光源单元和容纳光源单元的壳体。 光源单元包括支撑光源部的光源部和光源支撑部。 壳体包括设置在壳体的底表面中的插入容纳部分。 光源支撑构件包括平面主体，光源保持器和从主体朝向壳体突出以与接合到插入容纳部分的插入部分。 插入部包括接合部和连接部。 插入部插入到插入容纳部中，光源支撑构件以预定角度旋转。

公开(公告)号：US07178967B2

公开(公告)日：2007-02-20

申请号：US10418425

申请日：2003-04-17

申请人： Yong-Il Kim

发明人： Yong-Il Kim

IPC分类号： F21V7/04

CPC分类号： G02F1/133308 ,  G02F1/133604 ,  G02F1/133605 ,  G02F2001/133317 ,  G02F2001/133328 ,  G02F2201/46

摘要： A backlight assembly and an LCD apparatus that includes the backlight assembly are disclosed. A first receiving container has at least two members that can be combined into a frame and receive a plurality of lamps and a light diffusing member. A receiving container may be fabricated using the two or more members. Even though the size of the frame made of the members is small relative to the LCD apparatus, the receiving container can be used with the LCD apparatus. Accordingly, manufacturing processes of the LCD apparatus may be simplified and cost of production may be reduced.

摘要翻译： 公开了一种背光组件和包括背光组件的LCD装置。 第一接收容器具有至少两个可以组合成框架并且容纳多个灯和光漫射构件的构件。 可以使用两个或更多个构件来制造接收容器。 即使由构件制成的框架的尺寸相对于LCD装置也是小的，所以接收容器可以与LCD装置一起使用。 因此，可以简化LCD装置的制造工艺，并且可以降低生产成本。

公开(公告)号：US20060203144A1

公开(公告)日：2006-09-14

申请号：US11430568

申请日：2006-05-09

申请人： Yong-Il Kim

发明人： Yong-Il Kim

IPC分类号： G02F1/1333

CPC分类号： G02B6/0088 ,  G02B6/009 ,  G02F1/133308 ,  G02F1/133615 ,  G02F2001/133314 ,  G02F2001/133322 ,  G02F2201/465

摘要： Disclosed is an LCD apparatus having a reduced size and weight. The LCD apparatus includes a bottom chassis having a bottom surface and first to fourth sidewalls. The sidewall of the bottom chassis includes a supporting member for preventing a light guiding plate from being moved and a fixing boss for fixing an optical sheet. The bottom chassis includes a lamp insertion portion for receiving a lamp unit, which is disposed on the third and fourth sidewalls of the bottom chassis. The bottom chassis receives a reflecting plate, the light guiding plate and the optical sheet. A mold frame is coupled to the bottom chassis to fix the reflecting plate, the light guiding plate and the optical sheet to the bottom chassis. A display unit disposed on the mold frame is fixed to the mold frame by a top chassis coupled to the mold frame. Accordingly, a bottom mold frame for receiving a backlight assembly is removed, so that it is able to reduce a cost of the LCD apparatus and a weight thereof.

公开(公告)号：US20050265020A1

公开(公告)日：2005-12-01

申请号：US11122400

申请日：2005-05-05

申请人： Yong-Il Kim

发明人： Yong-Il Kim

IPC分类号： G02F1/1333 ,  F21S2/00 ,  F21S4/00 ,  F21V7/00 ,  F21V19/00 ,  F21Y103/025 ,  G02F1/1335 ,  G02F1/13357

CPC分类号： G02F1/133604 ,  G02F1/133605

摘要： A backlight assembly with a simplified structure and a display device provided with the same includes lamps supplying light, lamp holders holding the lamps, a fixing member receiving the lamp holders, and a reflecting sheet. The lamp holders have exposed surfaces. The reflecting sheet includes an inclined portion covering a side of the fixing member. The reflecting sheet reflects light emitted by the lamps.

摘要翻译： 具有简化结构的背光组件和具有其的显示装置包括提供灯的灯，保持灯的灯座，接收灯座的固定构件和反射片。 灯座具有暴露的表面。 反射片包括覆盖固定部件一侧的倾斜部分。 反射片反射灯发出的光。

公开(公告)号：US06954985B2

公开(公告)日：2005-10-18

申请号：US10043146

申请日：2002-01-14

申请人： Sung Gue Lee ,  Sung Sik Cho ,  Yong Il Kim ,  Yong Soon Jang ,  Ho Sung Choi ,  Sang Jin Kong ,  Young Hwan Kim

发明人： Sung Gue Lee ,  Sung Sik Cho ,  Yong Il Kim ,  Yong Soon Jang ,  Ho Sung Choi ,  Sang Jin Kong ,  Young Hwan Kim

IPC分类号： H05K3/28 ,  H05K3/00 ,  H05K3/12 ,  H05K3/42 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K3/0094 ,  H05K3/1225 ,  H05K3/28 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0278 ,  H05K2203/0557 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49135 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board is positioned on the board having the via hole and the through hole to electrically connect circuit patterns formed on the surface of the board and in the board and an insulating material is plugged in the via hole by abutting and pushing the material on the surface of the board. Therefore, the insulating material can be plugged smoothly without a void, the processing is simplified by plugging the insulating material just to the height of the circuit pattern in a space between the circuit patterns and accordingly, damage to the circuit pattern can be prevented.

摘要翻译： 用于印刷电路板的孔堵塞方法，根据本发明的孔堵装置及其制造方法，其中用于选择性地暴露印刷电路板的通孔，通孔和表面图案的掩模位于 具有通孔和通孔的电路板电连接板和表面上形成的电路图案和绝缘材料，通过邻接和推动板的表面上的材料而被堵塞在通孔中。 因此，绝缘材料可以没有空隙而平滑地插入，通过将绝缘材料刚好插入电路图案之间的空间中的电路图案的高度来简化处理，因此可以防止电路图案的损坏。

公开(公告)号：US06803257B2

公开(公告)日：2004-10-12

申请号：US10175912

申请日：2002-06-21

申请人： Sung Gue Lee ,  Yong Il Kim

发明人： Sung Gue Lee ,  Yong Il Kim

IPC分类号： H01L2144

CPC分类号： H05K1/021 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H05K1/056 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/0097 ,  H05K3/321 ,  H05K3/4644 ,  H05K2203/0315 ,  H05K2203/049 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/00

摘要： A printed circuit board (PCB) with a heat dissipation element, a method for manufacturing the PCB, and a semiconductor package using the PCB dissipates heat generated from the semiconductor chip and reduces a printed circuit board height. The PCB includes a heat sink panel, an alloy panel attached to one surface of the heat sink panel serving to ground and to dissipate heat, a circuit pattern layer having via holes formed on one surface of the alloy panel and electrically coupled to the alloy panel, and a cavity formed by perforating the circuit pattern layer and the alloy panel. A semiconductor chip is on the heat sink panel in the cavity and electrically coupled to the circuit pattern layer. The alloy panels with the circuit patterns can be manufactured in pairs with an insulation carrier therebetween. A plurality of dissipation protrusions can be formed on the surface of the alloy panel or the surface of the heat sink panel to couple the same.

摘要翻译： 具有散热元件的印刷电路板（PCB），PCB的制造方法以及使用该PCB的半导体封装消耗了半导体芯片产生的热量并降低了印刷电路板的高度。 PCB包括散热面板，附接到用于接地并散热的散热板的一个表面的合金面板，具有形成在合金面板的一个表面上并且电耦合到合金面板的通孔的电路图案层 以及通过对电路图案层和合金面板进行穿孔而形成的空腔。 半导体芯片位于空腔中的散热板上并电耦合到电路图案层。 具有电路图案的合金面板可以与它们之间的绝缘载体成对地制造。 可以在合金面板的表面或散热面板的表面上形成多个耗散突起，以将其连接。