ANISOTROPIC CONDUCTIVE FILM STRUCTURES
    22.
    发明申请
    ANISOTROPIC CONDUCTIVE FILM STRUCTURES 有权
    各向异性导电膜结构

    公开(公告)号:US20170062379A1

    公开(公告)日:2017-03-02

    申请号:US14836859

    申请日:2015-08-26

    Applicant: Apple Inc.

    Abstract: Anisotropic conductive film (ACF) structures and manufacturing methods for forming the same are described. The manufacturing methods include preventing clusters of conductive particles from forming between adjacent bonding pads and that are associated with electrical shorting of ACF structures. In some embodiments, the methods involve use of multiple layered ACF materials that include a non-electrically conductive layer that reduces the likelihood of formation of conductive particle clusters between bonding pads. In some embodiment, the methods include the use of ultraviolet sensitive ACF material combined with lithography techniques that eliminate conductive particles from between neighboring bonding pads. In some embodiments, the methods involve the use of insulation spacers that block conductive particles from entering between bonding pads. Any suitable combination of the described methods can be used.

    Abstract translation: 描述各向异性导电膜(ACF)结构及其制造方法。 制造方法包括防止在相邻焊盘之间形成导电颗粒簇并且与ACF结构的电短路相关联。 在一些实施方案中,该方法涉及使用包含非导电层的多层ACF材料,其降低在接合焊盘之间形成导电颗粒簇的可能性。 在一些实施方案中,所述方法包括使用紫外线敏感的ACF材料与光刻技术相结合,从而消除相邻接合焊盘之间的导电颗粒。 在一些实施例中,该方法涉及使用阻挡导电颗粒进入接合焊盘之间的绝缘间隔物。 可以使用所述方法的任何合适的组合。

    Electrical and mechanical interconnection for electronic components
    25.
    发明授权
    Electrical and mechanical interconnection for electronic components 有权
    电子元件的机电互连

    公开(公告)号:US09374898B2

    公开(公告)日:2016-06-21

    申请号:US13869881

    申请日:2013-04-24

    Applicant: Apple Inc.

    Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for forming mechanical and electrical connections between components within an electronic device. In one embodiment, an interconnect component such as a flex cable is attached to a substrate such as a printed circuit board. A plurality of apertures can be created in the interconnect component, passing through bonding pads located on one end of the interconnect component. The interconnect component can then be aligned with bonding pads on the substrate with the bonding pads on the interconnect component facing away from the substrate. A conductive compound can be injected into the apertures through the interconnect component, forming a mechanical and electrical connection between the bonding pads. In some embodiments, an adhesive layer can be used to further strengthen the bond between the interconnect component and the substrate.

    Abstract translation: 所描述的实施例通常涉及电子设备,更具体地涉及用于在电子设备内的组件之间形成机械和电连接的方法。 在一个实施例中,诸如柔性电缆的互连部件附接到诸如印刷电路板的基板。 可以在互连部件中产生穿过位于互连部件的一端上的接合焊盘的多个孔。 然后可以将互连部件与衬底上的接合焊盘对准,并使互连部件上的接合焊盘背离衬底。 可以通过互连部件将导电化合物注入孔中,在接合焊盘之间形成机械和电连接。 在一些实施例中,可以使用粘合剂层来进一步加强互连部件和基底之间的结合。

    Touch Sensitive Display With Graded Index Layer
    27.
    发明申请
    Touch Sensitive Display With Graded Index Layer 审中-公开
    使用渐变索引层触摸敏感显示

    公开(公告)号:US20150077646A1

    公开(公告)日:2015-03-19

    申请号:US14028878

    申请日:2013-09-17

    Applicant: Apple Inc.

    CPC classification number: G06F1/1643 G06F3/0418

    Abstract: An electronic device may have a touch screen display or other input-output device that includes transparent conductive electrodes. The transparent conductive electrodes may be formed from a material that has a relatively high index of refraction such as indium tin oxide. Surrounding layers of the touch screen display such as a touch sensor substrate and an underlying display layer may have lower index of refraction values. To prevent abrupt index-of-refraction discontinuities that lead to unwanted reflections and visible artifacts on the display, the transparent conductive electrodes may be embedded within a dielectric layer. The dielectric layer may have a graded index of refraction. The graded index of refraction may be varied continuously or in a stepwise fashion by adjusting the composition of materials that are incorporated into the dielectric layer as a function of position within the layer.

    Abstract translation: 电子设备可以具有包括透明导电电极的触摸屏显示器或其它输入 - 输出设备。 透明导电电极可以由具有较高折射率的材料形成,例如氧化铟锡。 诸如触摸传感器基板和底层显示层的触摸屏显示器的周围层可以具有较低的折射率值。 为了防止在显示器上导致不想要的反射和可见伪影的突然折射不连续性,透明导电电极可以嵌入在电介质层内。 电介质层可以具有渐变的折射率。 渐变的折射率可以通过调节作为层中位置的函数的结合到介电层中的材料的组成而连续地或以逐步的方式变化。

    THERMAL PRESS AND ULTRAVIOLET CURING FOR DISPLAY ASSEMBLIES
    28.
    发明申请
    THERMAL PRESS AND ULTRAVIOLET CURING FOR DISPLAY ASSEMBLIES 有权
    热压和超紫外线固化显示组件

    公开(公告)号:US20140071354A1

    公开(公告)日:2014-03-13

    申请号:US13941377

    申请日:2013-07-12

    Applicant: Apple Inc.

    CPC classification number: G06F1/1643 B32B38/00 G06F3/041 G06F2203/04103

    Abstract: Methods for controlling deformation of laminated display assemblies are described. The laminated display assemblies can include flexible layers. In some embodiments, the flexible layers are sensor layers. Methods involving the use of a thermal press and ultra violet (UV) curing procedure are described. In one embodiment, a thermal press method can be performed by placing a laminated display assembly including the flexible substrate, an ink layer, an adhesive, and a cover on a temperature controlled fixture. A mechanical press can apply pressure to the top of the laminated display assembly. The mechanical press can remove any planar deformity of the flexible layer and can redistribute portions of the adhesive. Following the mechanical pressing, the laminated display assembly can be exposed to UV light to cure the adhesive and thereby fix in place the planar state of the laminated display assembly.

    Abstract translation: 描述了用于控制层压显示组件变形的方法。 层压显示组件可以包括柔性层。 在一些实施例中,柔性层是传感器层。 描述了涉及使用热压和紫外线(UV)固化程序的方法。 在一个实施例中,可以通过将包括柔性基板,油墨层,粘合剂和盖子的层压显示组件放置在温度控制的夹具上来执行热压方法。 机械压力机可以对叠层显示组件的顶部施加压力。 机械压力机可以去除柔性层的任何平面变形并且可以重新分布粘合剂的部分。 在机械压制之后,层压显示组件可以暴露于UV光以固化粘合剂,从而固定层压显示组件的平面状态。

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