公开(公告)号：US06921466B2

公开(公告)日：2005-07-26

申请号：US09842650

申请日：2001-04-27

申请人： Akihisa Hongo ,  Ichiro Katakabe ,  Shinya Morisawa

发明人： Akihisa Hongo ,  Ichiro Katakabe ,  Shinya Morisawa

IPC分类号： B24B37/34 ,  H01L21/00 ,  H01L21/687 ,  C25D5/02 ,  H01L21/288

CPC分类号： H01L21/68728 ,  B24B37/345 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/06 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67766 ,  H01L21/68707

摘要： A revolution member supporting apparatus holds and rotates a disc-shaped object (object to be rotated) such as a semiconductor wafer. The revolution member supporting apparatus includes a rotatable member which rotates about an axis of roation, and a plurality of holding members which are disposed along a circle having a center corresponding to the axis of rotation of the rotatable member, and which revolve around the axis of rotation when the rotatable member rotates, wherein the holding members are allowed to swing about their own central axes.

摘要翻译： 旋转构件支撑装置保持并旋转诸如半导体晶片的盘形物体（待旋转物体）。 旋转构件支撑装置包括围绕旋转轴线旋转的可旋转构件，以及沿着具有与可旋转构件的旋转轴线对应的中心的圆周设置的多个保持构件， 可旋转构件旋转时的旋转，其中保持构件绕其自身的中心轴线摆动。

公开(公告)号：US06716330B2

公开(公告)日：2004-04-06

申请号：US09983399

申请日：2001-10-24

申请人： Akihisa Hongo ,  Koji Mishima ,  Hiroaki Inoue ,  Norio Kimura ,  Tsutomu Karimata

发明人： Akihisa Hongo ,  Koji Mishima ,  Hiroaki Inoue ,  Norio Kimura ,  Tsutomu Karimata

IPC分类号： C25D2112

CPC分类号： H01L21/76843 ,  C23C18/1619 ,  C23C18/1669 ,  C23C18/1678 ,  H01L21/288 ,  H01L21/76849 ,  H01L21/76874

摘要： An plating apparatus which can easily form a plated film having more uniform thickness on a surface, to be plate, of a material to be plated. The plating apparatus includes a holding portion having a heating portion for holding a material to be plated in such a state that a surface to be plated faces downward, and a plating bath for introducing an electroless plating liquid having a predetermined temperature into a plating chamber, and holding the electroless plating liquid while allowing the electroless plating liquid to overflow an overflow dam. The material which is by the holding portion, is brought into contact with the plating liquid in the plating bath to plate the material.

公开(公告)号：US06582580B1

公开(公告)日：2003-06-24

申请号：US09623361

申请日：2000-10-19

申请人： Akihisa Hongo ,  Kenichi Suzuki ,  Atsushi Chono

发明人： Akihisa Hongo ,  Kenichi Suzuki ,  Atsushi Chono

IPC分类号： C25D502

CPC分类号： H01L21/6723 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67051 ,  H01L21/76807 ,  H01L21/76877

摘要： An object of the present invention is to provide a substrate plating apparatus capable of performing continuous plating operations within one apparatus without the wafers becoming contaminated after the post-plating process by chemicals used in the plating process and the like. Further object is to provide a substrate plating apparatus capable of forming a plating film of uniform thickness on the plating surface of the wafer, while encouraging bubbles to escape from fine holes or grooves in the substrate surface and deterring particles from depositing on the plated surface. According to the present invention, there is provided a substrate plating apparatus for continuously performing a plating process and post-plating process within the same apparatus, the substrate plating apparatus comprising a contaminated zone within which the plating process is performed; a clean zone within which the post-plating process is performed; and a partition dividing the apparatus into the contaminated zone and the clean zone, wherein each zone is independently ventilated. A substrate plating apparatus for plating a surface of a substrate with a plating solution comprises a plating bath that is hermetically sealed and accommodates the substrate to be plated; and a flow path of the plating solution being formed to be parallel to the surface of the substrate.

摘要翻译： 本发明的目的是提供一种能够在一个装置内进行连续电镀操作的基板电镀装置，而不会在通过电镀工艺等中使用的化学品进行后电镀处理后晶片被污染。 另外的目的是提供一种能够在晶片的镀面上形成均匀厚度的镀膜的基板电镀装置，同时鼓励气泡从基板表面的细孔或凹槽中逸出，并阻止颗粒沉积在镀层表面上。 根据本发明，提供一种用于在同一装置内连续进行电镀处理和电镀后处理的基板电镀装置，所述基板电镀装置包括进行电镀处理的污染区域; 执行后电镀处理的清洁区域; 以及将装置分成污染区域和清洁区域的隔板，其中每个区域都是独立通风的。 一种用电镀液对基板的表面进行电镀的基板电镀装置，其特征在于，包括：电镀密封的电镀液，容纳所述电镀基板; 并且所述电镀液的流路形成为平行于所述基板的表面。

公开(公告)号：US06544585B1

公开(公告)日：2003-04-08

申请号：US09145500

申请日：1998-09-02

申请人： Fumio Kuriyama ,  Akihisa Hongo ,  Hiroaki Inoue ,  Tsuyoshi Tokuoka

发明人： Fumio Kuriyama ,  Akihisa Hongo ,  Hiroaki Inoue ,  Tsuyoshi Tokuoka

IPC分类号： B05D512

CPC分类号： H01L21/6715 ,  H01L21/67144

摘要： A high quality metallic deposit can be produced inside the micro-cavities formed on a surface of a substrate by the present invention. The method involves immersing the substrate in a liquid held in a processing chamber, evacuating the processing chamber so as to remove residual bubbles from the micro-cavities and to degas the liquid within the micro-cavities, and subjecting the liquid to boiling in at least those regions adjacent to the substrate.

摘要翻译： 通过本发明，可以在形成在基板的表面上的微孔内产生高质量的金属沉积物。 该方法包括将基底浸入保持在处理室中的液体中，抽空处理室以从微孔中除去残余气泡并使微腔内的液体脱气，并至少使液体沸腾 那些区域与衬底相邻。

公开(公告)号：US20100136886A1

公开(公告)日：2010-06-03

申请号：US12699318

申请日：2010-02-03

申请人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

发明人： Akihisa Hongo ,  Kenya Ito ,  Kenji Yamaguchi ,  Masayuki Nakanishi

IPC分类号： B24B49/04 ,  B24B49/12 ,  B24B21/18 ,  B24B9/02

CPC分类号： B24B37/02 ,  B24B9/065 ,  B24B21/002

摘要： The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber.

摘要翻译： 本发明涉及一种用于去除在基板的周边部分产生的表面粗糙度或用于去除形成在基板的周边部分上的膜的抛光装置。 抛光装置包括：用于在其中形成抛光室的壳体，用于保持和旋转基板的旋转台;抛光带供给机构，用于将研磨带供给到抛光室中并且吸收已经被供给到抛光的研磨带 用于将抛光带压靠在基板的斜面部分上的抛光头，用于将液体供应到基板的前表面和后表面的液体供应源，以及用于使抛光室的内部压力的调节机构 被设定为低于抛光室的外部压力。

公开(公告)号：US20090026068A1

公开(公告)日：2009-01-29

申请号：US12232364

申请日：2008-09-16

申请人： Akihisa Hongo ,  Ichiro Katakabe ,  Shinya Morisawa

发明人： Akihisa Hongo ,  Ichiro Katakabe ,  Shinya Morisawa

IPC分类号： C25D17/06

CPC分类号： H01L21/68728 ,  B24B37/345 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/06 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67766 ,  H01L21/68707

摘要： A revolution member supporting apparatus holds and rotates a disc-shaped object (object to be rotated) such as a semiconductor wafer. The revolution member supporting apparatus includes a rotatable member which rotates about an axis of rotation, and a plurality of holding members which are disposed along a circle having a center corresponding to the axis of rotation of the rotatable member. The holding members revolve around the axis of rotation when the rotatable member rotates and are allowed to swing about their own central axes.

摘要翻译： 旋转构件支撑装置保持并旋转诸如半导体晶片的盘形物体（待旋转物体）。 旋转构件支撑装置包括围绕旋转轴线旋转的可旋转构件，以及沿着具有与可旋转构件的旋转轴线对应的中心的圆形的多个保持构件。 当可旋转构件旋转时，保持构件围绕旋转轴线旋转并且允许其绕其自身的中心轴线摆动。

公开(公告)号：US06929722B2

公开(公告)日：2005-08-16

申请号：US09945711

申请日：2001-09-05

申请人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

发明人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

IPC分类号： C25D7/12 ,  H01L21/00 ,  H01L21/288 ,  H01L21/768 ,  C25D17/00 ,  H01M4/29 ,  C23B3/00

CPC分类号： H01L21/67167 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/76849 ,  H01L21/76877 ,  Y10S134/902

摘要： A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.

摘要翻译： 基板电镀装置在由微细凹槽和/或限定在基板中的细孔构成的互连区域上形成布线层。 基板电镀装置包括用于在包括互连区域的基板的表面上形成镀层的电镀单元，用于对基板进行化学机械抛光以从基板的表面移除镀层的化学机械抛光单元， 互连区域中的镀层，用于在形成镀层之后对基板进行清洗或基板进行化学机械抛光的清洁单元，用于在清洁基板之后使基板干燥的干燥单元，以及用于将基板转印 第一电镀单元，第一化学机械抛光单元，清洁单元和干燥单元中的每一个的基板。 第一电镀单元，第一化学机械抛光单元，清洁单元，干燥单元和基板转移单元组合成一体的布置。

公开(公告)号：US06615854B1

公开(公告)日：2003-09-09

申请号：US09572432

申请日：2000-05-17

申请人： Akihisa Hongo ,  Shinya Morisawa

发明人： Akihisa Hongo ,  Shinya Morisawa

IPC分类号： B08B302

CPC分类号： H01L21/6708 ,  B08B3/02 ,  H01L21/67051 ,  Y10S134/902

摘要： An object of the present invention is to provide a wafer cleaning apparatus for cleaning wafer that have received various processing such as copper plating and chemical mechanical polishing. An apparatus for cleaning front and back surfaces of a wafer with solution while rotating the wafer that hag been subjected to a fabrication process is disclosed. The apparatus comprises cleaning nozzles for spraying a cleaning solution, respectively, onto a front surface of the wafer that has been processed and onto a back surface thereof and also comprises an etching nozzle for spraying an etching solution onto a vicinity of the outer periphery of the wafer.

摘要翻译： 本发明的目的是提供一种用于清洗晶片的晶圆清洗装置，该晶片清洗装置已经接收了诸如镀铜和化学机械抛光的各种处理。 公开了一种用于在旋转已经经受制造工艺的晶片的同时用溶液清洁晶片的正面和背面的装置。 该装置包括清洗喷嘴，分别将清洗液喷射到已加工的晶片的前表面上并在其后表面上，并且还包括用于将蚀刻溶液喷涂到所述蚀刻溶液的外周附近的蚀刻喷嘴 晶圆。

公开(公告)号：US06500317B1

公开(公告)日：2002-12-31

申请号：US09581761

申请日：2000-06-16

申请人： Junichiro Yoshioka ,  Satoshi Sendai ,  Atsushi Chono ,  Mitsuo Tada ,  Akihisa Hongo ,  Yoshitaka Mukaiyama ,  Kenya Tomioka ,  Akira Ogata ,  Kenichi Suzuki ,  Naomitsu Ozawa

发明人： Junichiro Yoshioka ,  Satoshi Sendai ,  Atsushi Chono ,  Mitsuo Tada ,  Akihisa Hongo ,  Yoshitaka Mukaiyama ,  Kenya Tomioka ,  Akira Ogata ,  Kenichi Suzuki ,  Naomitsu Ozawa

IPC分类号： C25B904

CPC分类号： G01R31/026 ,  C25D21/12

摘要： The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating film of uniform thickness by supplying a uniform plating current through a plurality of feeder contacts.

摘要翻译： 本发明提供一种电导率检测装置，其能够检测与基板的导电区域接触的多个馈电触点的导电性（接触状态），以及能够通过提供均匀电镀电流形成均匀厚度的镀膜的电镀装置 通过多个馈线接触。

公开(公告)号：US06495004B1

公开(公告)日：2002-12-17

申请号：US09555650

申请日：2000-06-29

申请人： Fumio Kuriyama ,  Naoaki Ogure ,  Akihisa Hongo

发明人： Fumio Kuriyama ,  Naoaki Ogure ,  Akihisa Hongo

IPC分类号： C25D1700

CPC分类号： H01L21/67161 ,  C23C18/1632 ,  C25D7/123 ,  C25D17/001 ,  H01L21/67173 ,  H01L21/6723

摘要： A substrate plating apparatus forms a plating layer on the surface of a substrate and stores the substrate until the next process in a way that the substrate is not exposed to the atmosphere. The substrate plating apparatus is not only capable of introducing semiconductor wafers continuously one by one into the plating apparatus without loading the wafers into cassettes, but is also capable of preventing particle contamination and the formation of oxidized film on the surface of the wafers, thus reducing the number of process and reducing the installation area required for the apparatus. The substrate plating apparatus includes a plating process section (20) for plating a substrate, a washing process section (10) for washing the substrate after the plating process, and a storage vessel (16) containing a storing solution in which the substrate is immersed after having been plated and washed. A substrate conveyor is provided in the substrate plating apparatus for loading substrates into the substrate plating apparatus and discharging substrates out of the substrate plating apparatus, or for performing at least one of the loading or discharging operations, such that the substrates are loaded into the substrate plating apparatus one at a time, plated in the plating process section, washed in the washing process section, and subsequently discharged one at a time from the substrate plating apparatus.

摘要翻译： 基板电镀装置在基板的表面上形成镀层，并以基板不暴露于大气的方式将基板存储到下一工序。 基板电镀装置不仅可以将半导体晶片连续地引入电镀装置，而且不将晶片装载到盒中，而且还能够防止颗粒污染和在晶片表面上形成氧化膜，从而减少 过程的数量和减少设备所需的安装面积。 基板电镀设备包括用于电镀基板的电镀处理部分（20），用于在电镀工艺之后洗涤基板的洗涤处理部分（10），以及储存容器（16），所述储存容器包含浸没所述基板的储存溶液 经过电镀和洗涤。 基板输送机设置在基板电镀装置中，用于将基板装载到基板电镀装置中，并将基板从基板镀敷装置中排出，或者进行至少一个装载或放电操作，使得基板被装入基板 电镀装置一次，镀在电镀处理部分中，在洗涤工序部分洗涤，然后一次从基板镀敷装置中排出。