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公开(公告)号：US10159149B2
公开(公告)日：2018-12-18
申请号：US15581947
申请日：2017-04-28
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , FuKui Precision Component (Shenzhen) Co., Ltd.
发明人： Xian-Qin Hu , Mei Yang , Cheng-Jia Li
摘要： A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.
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公开(公告)号：US09693448B2
公开(公告)日：2017-06-27
申请号：US14926195
申请日：2015-10-29
申请人： FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Zhen Ding Technology Co., Ltd.
发明人： Xian-Qin Hu , Ming-Jaan Ho
CPC分类号： H05K1/0219 , H05K1/0221 , H05K1/024 , H05K1/0296 , H05K3/022 , H05K3/06 , H05K3/4697 , H05K2201/05 , H05K2201/0715
摘要： A flexible circuit board includes a wiring layer, two photosensitive resin layers, and two electromagnetic interference shielding layers. The wiring layer includes at least one signal line, two ground lines and at least two gaps. Each gap includes two opening portions. The two photosensitive resin layers cover the signal line and the opening portions, and are connected to each end of each ground line. Each electromagnetic interference shielding layer covers one photosensitive resin layer away from the signal line, portions of the two ground lines not connected to the photosensitive resin layer, and portions of the gaps not covered by the two photosensitive resin layers, thereby causing the portions of each gap not covered by the two photosensitive resin layers to define a receiving chamber. Each end of each receiving chamber communicates with one opening portion of the corresponding gap to define a cavity.
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公开(公告)号：US09485859B1
公开(公告)日：2016-11-01
申请号：US14859857
申请日：2015-09-21
申请人： FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Zhen Ding Technology Co., Ltd.
发明人： Xian-Qin Hu , Fu-Yun Shen , Jian Luo , Ming-Jaan Ho , Yi-Qiang Zhuang
CPC分类号： H05K1/0219 , H01P3/003 , H01P3/085 , H01P11/003 , H05K1/024 , H05K1/189 , H05K3/4652 , H05K3/4697 , H05K2201/0154 , H05K2201/05 , H05K2201/0715 , H05K2201/09618 , H05K2201/09809
摘要： A flexible circuit board includes a first base layer, a circuit layer, a second base layer and a bonding layer. The circuit layer is coupled to a side of the first base layer and includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. The bonding layer couples the second base layer to the circuit layer and defines a first opening corresponding to the linear signal line and communicating with the hollow areas of the circuit layer. The first opening of the bonding layer and the hollow areas of the circuit layer cooperatively define an air medium layer surrounding the linear signal line. A method for manufacturing the flexible circuit board is also provided.
摘要翻译： 柔性电路板包括第一基底层，电路层，第二基底层和结合层。 电路层耦合到第一基极层的一侧，并且包括线性信号线，位于线性信号线的两个相对侧的两个接地线以及位于线性信号线和接地线之间的两个中空区域。 接合层将第二基底层耦合到电路层，并且限定对应于线性信号线的第一开口并与电路层的中空区域连通。 接合层和电路层的中空区域的第一开口协调地限定围绕线性信号线的空气介质层。 还提供了一种用于制造柔性电路板的方法。
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公开(公告)号：US11979977B2
公开(公告)日：2024-05-07
申请号：US16978842
申请日：2019-08-31
发明人： Hsiao-Ting Hsu , Tao-Ming Liao , Ming-Jaan Ho , Xian-Qin Hu , Fu-Yun Shen
CPC分类号： H05K1/0207 , H05K1/0206 , H05K3/423 , H05K3/4641 , H05K1/0203 , H05K1/0272 , H05K1/11 , H05K1/14
摘要： A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.
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公开(公告)号：US11665833B2
公开(公告)日：2023-05-30
申请号：US17527320
申请日：2021-11-16
发明人： Ming-Jaan Ho , Xian-Qin Hu , Fu-Yun Shen , Hsiao-Ting Hsu , Yong-Chao Wei
CPC分类号： H05K3/4644 , H05K1/111 , H05K3/04 , H05K3/107 , H05K3/4614 , H05K2201/0394 , H05K2201/09563
摘要： A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.
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公开(公告)号：US11417890B2
公开(公告)日：2022-08-16
申请号：US16699966
申请日：2019-12-02
发明人： Xian-Qin Hu , Hsiao-Ting Hsu
IPC分类号： H01M4/66 , H01M4/139 , H01M10/0585 , H01M10/0525 , H01M4/74
摘要： A flexible battery assembly includes a positive plate, a first filling film, a separator, a second filling film, and a negative plate stacked in order. The positive plate includes a first insulating layer, spaced first current collectors, and a positive electrode active layer. The negative plate includes a second insulating layer, spaced second current collectors, and a negative electrode active layer. Each first current collector corresponds to one second current collector. The first filling film comprises first openings each corresponding to one first current collector, and the first current collectors are embedded in the first openings. The second filling film comprises second openings each corresponding to one second current collector, and the second current collectors are embedded in the second openings. An electrolyte is sealed in the first openings and the second openings. A method for manufacturing such flexible battery assembly is also disclosed.
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公开(公告)号：US11523517B2
公开(公告)日：2022-12-06
申请号：US17038244
申请日：2020-09-30
发明人： Ying-Qiu Zheng , Chao Peng , Xian-Qin Hu
IPC分类号： H05K1/00 , H05K3/00 , H05K3/28 , H05K3/42 , H05K3/46 , G03F7/20 , G03F7/32 , H05K3/24 , H05K3/06 , H05K3/40 , H05K1/09
摘要： A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
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公开(公告)号：US11197368B1
公开(公告)日：2021-12-07
申请号：US17029355
申请日：2020-09-23
发明人： Fu-Yun Shen , Xian-Qin Hu
IPC分类号： H05K1/00 , H05K1/02 , H05K1/09 , H05K1/14 , H05K3/06 , H05K3/28 , H05K3/40 , H05K3/46 , H01P5/103
摘要： A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.
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公开(公告)号：US12063750B2
公开(公告)日：2024-08-13
申请号：US17979150
申请日：2022-11-02
发明人： Ying-Qiu Zheng , Chao Peng , Xian-Qin Hu
IPC分类号： H05K1/02 , H05K1/05 , H05K1/09 , H05K3/06 , H05K3/24 , H05K3/28 , H05K3/38 , H05K3/40 , H05K3/46
CPC分类号： H05K3/246 , H05K1/095 , H05K3/067 , H05K3/4069 , H05K3/4664 , H05K3/28 , H05K2201/0347 , H05K2201/0379 , H05K2203/0514 , H05K2203/0723
摘要： A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
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公开(公告)号：US11264701B1
公开(公告)日：2022-03-01
申请号：US17027936
申请日：2020-09-22
发明人： Zi-Qiang Gao , Chih-Wen Cheng , Ke He , Xian-Qin Hu
摘要： A method for manufacturing an antenna printed circuit board includes the following steps: providing a flexible-rigid printed circuit board comprising a flexible region and a rigid region. The flexible region comprises at least one first connecting pad and at least one second connecting pad arranged opposite sides of the rigid region. At least one antenna module is attached to the first connecting pad through a conductive paste. The antenna module is fixed on the rigid region by a first reflow soldering process. At least one radio frequency integrated circuit structure is attached to the second connecting pad through a conductive paste. The radio frequency integrated circuit is fixed on the rigid region by a second reflow soldering process. A gap between the antenna module and the rigid region and a gap between the radio frequency integrated circuit structure and the rigid region are filled with dielectric materials and cured.
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