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    Light emitting device package and method for manufacturing the same
    21.
    发明授权
    Light emitting device package and method for manufacturing the same 有权
    发光器件封装及其制造方法

    公开(公告)号：US08546838B2

    公开(公告)日：2013-10-01

    申请号：US13191247

    申请日：2011-07-26

    申请人： Geun Ho Kim ,  Seung Yeob Lee ,  Yu Ho Won

    发明人： Geun Ho Kim ,  Seung Yeob Lee ,  Yu Ho Won

    IPC分类号： H01L33/48

    CPC分类号： H01L33/486 ,  H01L23/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/62 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting device package capable of achieving an enhancement in light emission efficiency and a reduction in thermal resistance, and a method for manufacturing the same are disclosed. The method includes forming a mounting hole in a first substrate, forming through holes in a second substrate, forming a metal film in the through holes, forming at least one pair of metal layers on upper and lower surfaces of the second substrate such that the metal layers are electrically connected to the metal film, bonding the first substrate to the second substrate, and mounting at least one light emitting device in the mounting hole such that the light emitting device is electrically connected to the metal layers formed on the upper surface of the second substrate.

    摘要翻译： 公开了能够实现发光效率提高和耐热性降低的发光器件封装及其制造方法。 该方法包括在第一基板中形成安装孔，在第二基板中形成通孔，在通孔中形成金属膜，在第二基板的上表面和下表面上形成至少一对金属层，使金属 层与金属膜电连接，将第一衬底接合到第二衬底，并且在安装孔中安装至少一个发光器件，使得发光器件电连接到形成在第二衬底的上表面上的金属层 第二基板。

    Light emitting device
    22.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号：US08410514B2

    公开(公告)日：2013-04-02

    申请号：US12871346

    申请日：2010-08-30

    申请人： Geun Ho Kim

    发明人： Geun Ho Kim

    IPC分类号： H01L33/00

    CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/49107 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1461 ,  H05B33/0812 ,  H05B33/0821 ,  H05B33/0827 ,  Y02B20/343 ,  H01L2924/00

    摘要： Provided are a light emitting device. The light emitting device comprises a package body, an insulating layer on a surface of the package body, first and second electrode layers on the insulating layer, a light emitting diode disposed on the package body and electrically connected to the first and second electrode layers, a resistor layer connected to the first electrode layer, a first element part in a first doping region within the package body, a second element part in a second doping region within the package body, and a third electrode layer connected to the first element part and the second element part.

    摘要翻译： 提供了一种发光器件。 发光器件包括封装主体，封装体表面上的绝缘层，绝缘层上的第一和第二电极层，设置在封装主体上并电连接到第一和第二电极层的发光二极管， 连接到第一电极层的电阻层，封装主体内的第一掺杂区域中的第一元件部分，封装主体内的第二掺杂区域中的第二元件部分，以及连接到第一元件部分的第三电极层，以及 第二个元素部分。

    Submount substrate for mounting light emitting device and method of fabricating the same
    29.
    发明授权
    Submount substrate for mounting light emitting device and method of fabricating the same 有权
    用于安装发光器件的底座基板及其制造方法

    公开(公告)号：US07354846B2

    公开(公告)日：2008-04-08

    申请号：US11633613

    申请日：2006-12-05

    申请人： Geun Ho Kim ,  Chil Keun Park

    发明人： Geun Ho Kim ,  Chil Keun Park

    IPC分类号： H01L21/22 ,  H01L21/38

    CPC分类号： H01L25/167 ,  H01L2224/14 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10S438/942 ,  H01L2924/00

    摘要： A submount substrate for mounting a light emitting device and a method of fabricating the same, wherein since a submount substrate for mouthing a light emitting device in which a Zener diode device is integrated can be fabricated by means of a silicon bulk micromachining process without using a diffusion mask, some steps of processes related to the diffusion mask can be eliminated to reduce the manufacturing costs, and wherein since a light emitting device can be flip-chip bonded directly to a submount substrate for a light emitting device in which a Zener diode device is integrated, a process of packaging the light emitting device and the voltage regulator device can be simplified.

    摘要翻译： 一种用于安装发光器件的副安装座基板及其制造方法，其特征在于，由于用于使齐纳二极管器件集成在其中的发光器件的吸嘴用底座基板可以通过硅体微加工工艺制造而不使用 扩散掩模，可以消除与扩散掩模相关的一些工艺步骤以降低制造成本，并且其中由于发光器件可以直接倒装芯片贴合到用于发光器件的底座衬底，其中齐纳二极管器件 是集成的，可以简化封装发光器件和电压调节器器件的过程。