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    Cooling solutions for die-down integrated circuit packages
    21.
    发明申请
    Cooling solutions for die-down integrated circuit packages 有权
    用于降压集成电路封装的冷却解决方案

    公开(公告)号：US20090166855A1

    公开(公告)日：2009-07-02

    申请号：US12006263

    申请日：2007-12-31

    Applicant: Chia-Pin Chiu ,  Ioan Sauciuc

    Inventor： Chia-Pin Chiu ,  Ioan Sauciuc

    IPC: H01L23/473

    CPC classification number: H01L23/473 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253

    Abstract: Systems for cooling the backside of a semiconductor die located in a die-down integrated circuit (IC) package are described. The IC package is attached to the topside of a printed circuit board (PCB) with the backside of the die residing below the topside surface of the PCB. A cooling plate is attached to the backside of the die and thermally connected to a heat sink located above the topside surface of the PCB via conduits that pass through openings in the PCB.

    Abstract translation: 描述了用于冷却位于降压集成电路（IC）封装中的半导体管芯的背面的系统。 IC封装被连接到印刷电路板（PCB）的顶侧，芯片的背面位于PCB的顶侧表面下方。 冷却板附接到模具的背面，并且通过穿过PCB中的开口的导管热连接到位于PCB的顶侧表面上方的散热器。

    SKIVED ELECTRICAL CONTACT FOR CONNECTING AN IC DEVICE TO A CIRCUIT BOARD AND METHOD OF MAKING A CONTACT BY SKIVING
    24.
    发明申请
    SKIVED ELECTRICAL CONTACT FOR CONNECTING AN IC DEVICE TO A CIRCUIT BOARD AND METHOD OF MAKING A CONTACT BY SKIVING 有权
    用于将IC器件连接到电路板的滑动电气接点和通过滑动接触的方法

    公开(公告)号：US20090004890A1

    公开(公告)日：2009-01-01

    申请号：US11768382

    申请日：2007-06-26

    Applicant: Chia-Pin Chiu

    Inventor： Chia-Pin Chiu

    IPC: H01R12/00

    CPC classification number: H01R13/2407 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01R13/2442 ,  H05K3/326 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10719 ,  Y02P70/611 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

    Abstract: The disclosed embodiments relate to the formation of an electrical contact using a skiving technique. The electrical contact includes a spring structure that has been skived away from an underlying metal body, but the spring remains coupled with the metal body which provides a base for the spring structure. The skived spring portion of the electrical contact may comprise a cantilever-like spring, a coil-like spring, or any other suitable type of spring. Such a spring contact may be used to form an electrical connection between an integrated circuit device and a circuit board (or other substrate). Other embodiments are described and claimed.

    Abstract translation: 所公开的实施例涉及使用刮削技术形成电接触。 电触点包括已经从下面的金属体滑开的弹簧结构，但是弹簧保持与金属体结合，该金属体为弹簧结构提供基座。 电接触件的刮刀弹簧部分可包括悬臂状弹簧，线圈状弹簧或任何其它合适类型的弹簧。 这种弹簧接点可用于在集成电路器件和电路板（或其他衬底）之间形成电连接。 描述和要求保护其他实施例。

    Thermal bus bar design for an electronic cartridge
    27.
    发明授权
    Thermal bus bar design for an electronic cartridge 失效
    电子墨盒的热母线设计

    公开(公告)号：US5990549A

    公开(公告)日：1999-11-23

    申请号：US19570

    申请日：1998-02-06

    Applicant: Chia-Pin Chiu ,  Imran Yusuf ,  Banerjee Koushik ,  Todd Young ,  Gary Solbrekken

    Inventor： Chia-Pin Chiu ,  Imran Yusuf ,  Banerjee Koushik ,  Todd Young ,  Gary Solbrekken

    IPC: H01L29/40 ,  H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K7/20 ,  H01L23/48 ,  H01L23/10 ,  H01L23/34

    CPC classification number: H05K7/20509 ,  H01L23/367 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/3011

    Abstract: One embodiment of the present invention is an electronic assembly which may have a first integrated circuit package mounted to a first side of a substrate and a second integrated circuit package mounted to a second side of the substrate. A thermal plate may be thermally coupled to the first integrated circuit package. A heat sink may be mounted to the thermal plate. A thermal bus may be is thermally coupled to the second integrated circuit package and the thermal plate. The thermal bus bar allows heat to flow from the second integrated circuit package to the thermal plate and heat sink. The electronic assembly of the present invention can thus remove heat from integrated circuit packages located on both sides of a substrate with only one heat sink.

    Abstract translation: 本发明的一个实施例是一种电子组件，其可以具有安装到基板的第一侧的第一集成电路封装和安装到基板的第二侧的第二集成电路封装。 热板可以热耦合到第一集成电路封装。 散热器可以安装在热板上。 热母线可以被热耦合到第二集成电路封装和热板。 热母线允许热量从第二集成电路封装流到热板和散热片。 因此，本发明的电子组件可以仅使用一个散热器从位于基板两侧的集成电路封装件去除热量。

    Thermal interface attach mechanism for electrical packages
    28.
    发明授权
    Thermal interface attach mechanism for electrical packages 失效
    电气封装的热接口连接机构

    公开(公告)号：US5965937A

    公开(公告)日：1999-10-12

    申请号：US990856

    申请日：1997-12-15

    Applicant: Chia-Pin Chiu ,  Gregory Turturro

    Inventor： Chia-Pin Chiu ,  Gregory Turturro

    IPC: H01L23/433 ,  H05K7/20 ,  H01L23/16

    CPC classification number: H01L23/433 ,  H05K7/2049 ,  H01L2924/0002

    Abstract: An electrical cartridge of the present invention includes a spring that pushes an integrated circuit package into a thermal plate. The integrated circuit package and substrate are attached to a substrate such as a printed circuit board. A cover may be attached to an opposite side of the substrate. There is typically a space between the integrated circuit package and the thermal plate that is filled with a thermal grease. The spring is located between the cover and the substrate in a manner which deflects the spring and exerts a force on the substrate. The spring force pushes the substrate and the integrated circuit package into the thermal plate. The spring may be designed to always provide a sufficient force to ensure a minimum space between the integrated circuit package and the thermal plate for assemblies produced in a mass production process.

    Abstract translation: 本发明的电子盒包括将集成电路封装件推入热板的弹簧。 集成电路封装和基板连接到诸如印刷电路板的基板。 盖可以附接到基板的相对侧。 在集成电路封装和热板之间通常有一个填充有导热油脂的空间。 弹簧以使弹簧偏转并在基底上施加力的方式位于盖和基板之间。 弹簧力将基板和集成电路封装推入热板。 弹簧可以设计成总是提供足够的力以确保集成电路封装和用于在批量生产过程中生产的组件的热板之间的最小空间。

    Push and pull dual-fan heat sink design
    29.
    发明授权
    Push and pull dual-fan heat sink design 失效
    推拉双风扇散热器设计

    公开(公告)号：US5953209A

    公开(公告)日：1999-09-14

    申请号：US990713

    申请日：1997-12-15

    Applicant: Chia-Pin Chiu

    Inventor： Chia-Pin Chiu

    IPC: H05K7/20 ,  H05H7/20

    CPC classification number: H05K7/20154

    Abstract: An electronic cartridge that includes a pair of fans which push and pull air from a heat sink of an electronic cartridge. The heat sink is mounted to the electronic cartridge. The cartridge may include integrated circuit packages which generate heat that flows into the heat sink. A first fan is attached to the heat sink and induces a flow of air into the sink. A second fan is attached to the heat sink and induces a flow of air away from the sink. The heat sink typically has a plurality of fins that are separated by a plurality of channels. The fans induce a flow of air across the channels from the first fan to the second fan. The flow of air across the channels reduces the likelihood of dead air zones within the heat sink and hot spots on the cartridge.

    Abstract translation: 一种电子墨盒，包括一对风扇，其从电子墨盒的散热片推动和拉出空气。 散热器安装在电子墨盒上。 墨盒可以包括产生流入散热器的热的集成电路封装。 第一个风扇连接到散热器，并引起空气流入水槽。 第二个风扇连接到散热器，并引起空气流离开水槽。 散热器通常具有由多个通道分离的多个散热片。 风扇引导空气从第一风扇到第二风扇通过通道。 穿过通道的空气流减少了散热片内的死气区和墨盒上的热点的可能性。

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