Abstract:
A system to find wirebonded leads by obtaining an image of the crescent formed on a lead after wire bonding, or a difference image (taken from an image of the lead before bonding and the crescent and wire formed after bonding) to create an intermediate image having the desired rotation and registration characteristics. Using a caliper or other wire-finding tool, the invention locates the wire and generates a threshold value for a boundary tracker that will make the located wire the expected width. An alternative preferred embodiment uses the gray value of an edge of the wire as the threshold. An optional artificial boundary is created as a limit for a boundary tracker. The invention then applies a boundary tracker to the intermediate image using the threshold value generated and any artificial boundary created. It then applies a corner finder that restricts starting corner orientations and analyzes the boundary and its features to find crescent tips and extrema to obtain measurements for inspection.
Abstract:
A method is provided for determining a calibration relationship between a reference frame of motion of an object and a reference frame of a camera that generates images of the object. The method includes the steps of coupling a target to an object and placing the object at each of plural locations and orientations that are known with respect to the motion reference frame of the object. The location of the target(s) with respect to the object need not be known. An image of the object and target is generated while the object is at each of those locations/orientations. From each those images, the method determines the location/orientation of the target with respect to the reference frame of the camera. The method then calls for determining the calibration relationship between the reference frame of motion of the object and the camera reference frame as a function of the locations/orientations of the object with respect to the motion reference frame of the object and the locations/orientations of the target in the corresponding images with respect to the reference frame of the camera.
Abstract:
This invention provides a method and apparatus for automatically inspecting the connection of a wire to a lead on lead frame containing a semiconductor chip or similar device. Using an image processor to locate the general position of a soldered lead in a digitized image, the present invention creates a template of an idealized optical indentation left by a good bond; determines parameters such as wire angle, idealized position and shape thresholds for applying the template; conducts a normalized correlation search of the digitized image; compares the results returned to the parameters and reports the resulting signals generated by this comparison to a host controller or other control module.
Abstract:
A mix for forming a carbon-bonded refractory comprising from about 8 to 30 wt. % of a high purity carbon, about 0.1 to 1 wt. % of aluminum metal, magnesium metal, or a mixture thereof, and the balance a high purity magnesite, and for each 100 wt. % of said magnesite, carbon, and metal, a carbonaceous bonding agent in an amount sufficient to bond the mix; said carbon containing at least about 98% carbon and said magnesite containing at least about 98% MgO, and containing less than about 0.03% boron oxide, less than about 0.3% silica, and having a CaO/SiO.sub.2 weight ratio above about 2, and the resultant carbon-bonded refractory shapes and liners for metal processing equipment, especially BOF, made from such shapes and the method of increasing the life of liners for such equipment.
Abstract:
The disclosure relates to weighing moving objects in a weighing platform functionally coupled to a computer-vision tracking platform. The objects can translate, rotate, and translate and rotate. Weighing of the objects can be accomplished through combination of object imaging and upstream weighing. Object imaging can permit tracking, through computer vision, a logical object moving in a trajectory from the first location to the second location, wherein a logical object is a formal representation of one or more physical objects. Upstream weighing can permit updating a record indicative of weight of the one or more physical objects associated with the tracked logical object. As a part of weighing termination, data integrity check(s) can be performed on a plurality of records indicative of a weight of a single physical object. Based on outcome of the data integrity check(s), a record indicative of the weight of the single physical object can be supplied.
Abstract:
Digital image processing methods are applied to an image of a semiconductor interconnection pad to preprocess the image prior to an inspection or registration. An image of a semiconductor pads exhibiting spatial patterns from structure, texture or features are filtered without affecting features in the image not associated with structure or texture. The filtered image is inspected in a probe mark inspection operation.
Abstract:
Digital image processing methods are applied to an image of a semiconductor interconnection pad to preprocess the image prior to an inspection or registration. An image of a semiconductor pads exhibiting spatial patterns from structure, texture or features are filtered without affecting features in the image not associated with structure or texture. The filtered image is inspected in a probe mark inspection operation.
Abstract:
A system and method for analyzing 3D captured image data of scanned surfaces to locate object of interest, such as solder balls. A 3D model is created of an object of interest, the 3D model including weighted “don't care” areas where a match is not required. The 3D models which are used include geometric shapes, including a frustum, and models created from actual 3D image data of real objects. The 3D captured image data is processed to locate objects matching the 3D models, including processing by normalized correlation. Once the objects are located, the system selects data points within the 3D captured image data that are a predetermined distance away from the located objects. These data points are analyzed to determine a surface plane which fits the selected data points, thereby locating the surface in the 3D capture image data.
Abstract:
Inspection of solder paste on a printed circuit board using a before printing image (pre-application image) to normalize an after printing image (post-application image) of the printed circuit board. Existing lighting and optics used for alignment of the screen-printing stencil to the printed circuit board are used for the solder paste inspection. An embodiment is described wherein pad regions of the printed circuit board are inspected for information about the solder paste applied on the pad regions of the printed circuit board. A stencil in the screen printing process is also inspected using a before printing image (pre-application) to normalize an after printing image (post-application) of the stencil.
Abstract:
A method is provided for determining a calibration relationship between a reference frame of motion of an object and a reference frame of a camera that generates images of the object. The method includes the steps of coupling a target to an object and placing the object at each of plural locations and orientations that are known with respect to the motion reference frame of the object. The location of the target(s) with respect to the object need not be known. An image of the object and target is generated while the object is at each of those locations/orientations. From each those images, the method determines the location/orientation of the target with respect to the reference frame of the camera. The method then calls for determining the calibration relationship between the reference frame of motion of the object and the camera reference frame as a function of the locations/orientations of the object with respect to the motion reference frame of the object and the locations/orientations of the target in the corresponding images with respect to the reference frame of the camera.