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    Method for fabricating a gyroscope
    21.
    发明授权
    Method for fabricating a gyroscope 有权
    制造陀螺仪的方法

    公开(公告)号：US07225524B2

    公开(公告)日：2007-06-05

    申请号：US11002241

    申请日：2004-12-03

    申请人： Moon-chul Lee ,  Hyung Choi ,  Seok-jin Kang

    发明人： Moon-chul Lee ,  Hyung Choi ,  Seok-jin Kang

    IPC分类号： H04R31/00

    CPC分类号： G01C19/5769 ,  B81B3/0035 ,  B81B2201/0242 ,  B81C1/00579 ,  B81C1/0092 ,  B81C1/00936 ,  H01R13/52 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T74/12 ,  Y10T74/1229

    摘要： Method for fabricating a gyroscope including: fabricating a SMS wafer where a first wafer, a metal film, and a second wafer are sequentially stacked; forming a cantilever or a bridge shaped-structure on the relevant portion of the first wafer through the photolithography process; attaching to the surface of the first wafer, a first cap made of glass and having a predetermined space for sealing the movable structure in a vacuum state; separating and removing the metal film and the second wafer from the first wafer; and attaching to the backside of the first wafer, the second cap which is structurally and materially symmetric to the first cap. The SMS wafer is fabricated by depositing the metal film on the second wafer and bonding the first wafer on the metal film using metal paste or material of polymer series. With lower material costs, improvements in performance and characteristics can be achieved.

    摘要翻译： 制造陀螺仪的方法，包括：制造顺序堆叠第一晶片，金属膜和第二晶片的SMS晶片; 通过光刻工艺在第一晶片的相关部分上形成悬臂或桥形结构; 附接到第一晶片的表面，由玻璃制成的第一盖，并且具有用于在真空状态下密封可移动结构的预定空间; 从第一晶片分离和去除金属膜和第二晶片; 并且附接到所述第一晶片的所述背面，所述第二盖在所述第一盖结构和物理上对称。 通过在第二晶片上沉积金属膜并使用金属浆料或聚合物系列材料将第一晶片接合在金属膜上来制造SMS晶片。 随着材料成本的降低，可以实现性能和特性的提高。

    Method for gyroscope using SMS wafer and gyroscope fabricated by the same
    22.
    发明申请
    Method for gyroscope using SMS wafer and gyroscope fabricated by the same 有权
    使用SMS晶圆和陀螺仪制作的陀螺仪的方法

    公开(公告)号：US20050132798A1

    公开(公告)日：2005-06-23

    申请号：US11002241

    申请日：2004-12-03

    申请人： Moon-chul Lee ,  Hyung Choi ,  Seok-jin Kang

    发明人： Moon-chul Lee ,  Hyung Choi ,  Seok-jin Kang

    IPC分类号： G01C19/56 ,  B81B3/00 ,  B81C1/00 ,  G01C19/5783 ,  H01R13/52 ,  G01P15/14

    CPC分类号： G01C19/5769 ,  B81B3/0035 ,  B81B2201/0242 ,  B81C1/00579 ,  B81C1/0092 ,  B81C1/00936 ,  H01R13/52 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T74/12 ,  Y10T74/1229

    摘要： Method for fabricating a gyroscope including: fabricating a SMS wafer where a first wafer, a metal film, and a second wafer are sequentially stacked; forming a cantilever or a bridge shaped-structure on the relevant portion of the first wafer through the photolithography process; attaching to the surface of the first wafer, a first cap made of glass and having a predetermined space for sealing the movable structure in a vacuum state; separating and removing the metal film and the second wafer from the first wafer; and attaching to the backside of the first wafer, the second cap which is structurally and materially symmetric to the first cap. The SMS wafer is fabricated by depositing the metal film on the second wafer and bonding the first wafer on the metal film using metal paste or material of polymer series. With lower material costs, improvements in performance and characteristics can be achieved.

    摘要翻译： 制造陀螺仪的方法，包括：制造顺序堆叠第一晶片，金属膜和第二晶片的SMS晶片; 通过光刻工艺在第一晶片的相关部分上形成悬臂或桥形结构; 附接到第一晶片的表面，由玻璃制成的第一盖，并且具有用于在真空状态下密封可移动结构的预定空间; 从第一晶片分离和去除金属膜和第二晶片; 并且附接到所述第一晶片的所述背面，所述第二盖在所述第一盖结构和物理上对称。 通过在第二晶片上沉积金属膜并使用金属浆料或聚合物系列材料将第一晶片接合在金属膜上来制造SMS晶片。 随着材料成本的降低，可以实现性能和特性的提高。

    Low-loss inductor device and fabrication method thereof
    23.
    发明申请
    Low-loss inductor device and fabrication method thereof 审中-公开
    低损耗电感器件及其制造方法

    公开(公告)号：US20060017539A1

    公开(公告)日：2006-01-26

    申请号：US11184999

    申请日：2005-07-20

    申请人： Moon-chul Lee ,  Hyung Choi

    发明人： Moon-chul Lee ,  Hyung Choi

    IPC分类号： H01F5/00

    CPC分类号： H01L27/08 ,  H01F17/0006 ,  H01F17/02 ,  H01F27/027 ,  H01F2017/002 ,  H01F2017/008

    摘要： An inductor device having an improved quality factor is provided. To obtain the improved quality factor, the inductor device includes a substrate etched away at predetermined intervals; first and second inductors formed on the top and bottom of the substrate, respectively; and first and second protection packages for shielding the first and second inductors, respectively, from outside. The first and second inductors are formed in a symmetrical structure with respect to the substrate, and the inductor device further includes connection parts for electrically connecting the first and second inductors. Further, the inductor device has air gaps between the substrate, first inductor, and second inductor in order for the first and second inductors to be exposed in the air, and the first protection package has an electrode layer formed thereon at predetermined positions to supply electric currents to the inductor device.

    摘要翻译： 提供了具有改进的品质因数的电感器件。 为了获得改进的品质因数，电感器件包括以预定间隔蚀刻掉的衬底; 分别形成在基板的顶部和底部的第一和第二电感器; 以及分别从外部屏蔽第一和第二电感器的第一和第二保护封装。 第一和第二电感器相对于衬底形成对称的结构，并且电感器件还包括用于电连接第一和第二电感器的连接部件。 此外，电感器件在衬底，第一电感器和第二电感器之间具有空气间隙，以便使第一和第二电感器暴露在空气中，并且第一保护封装具有在预定位置形成在其上的电极层以供应电 电流到电感器件。

    Method of forming a via hole through a glass wafer
    24.
    发明授权
    Method of forming a via hole through a glass wafer 有权
    通过玻璃晶片形成通孔的方法

    公开(公告)号：US07084073B2

    公开(公告)日：2006-08-01

    申请号：US10681217

    申请日：2003-10-09

    申请人： Moon-chul Lee ,  Hyung Choi ,  Kyu-dong Jung ,  Mi Jang ,  Seog-woo Hong ,  Seok-whan Chung ,  Chan-bong Jun ,  Seok-jin Kang

    发明人： Moon-chul Lee ,  Hyung Choi ,  Kyu-dong Jung ,  Mi Jang ,  Seog-woo Hong ,  Seok-whan Chung ,  Chan-bong Jun ,  Seok-jin Kang

    IPC分类号： H01L21/302

    CPC分类号： B81C1/00087 ,  H01L21/486 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of forming a via hole through a glass wafer includes depositing a material layer on an outer surface of the glass wafer, the material layer having a selection ratio higher than that of the glass wafer, forming a via-patterned portion on one side of the material layer, performing a first etching in which the via-patterned portion is etched to form a preliminary via hole, eliminating any remaining patterning material used in the formation of the via-patterned portion, performing a second etching in which the preliminary via hole is etched to form a via hole having a smooth surface and extending through the glass wafer, and eliminating the material layer. The method according to the present invention is able to form a via hole through a glass wafer without allowing formation of an undercut or minute cracks, thereby increasing the yield and reliability of MEMS elements.

    摘要翻译： 通过玻璃晶片形成通孔的方法包括在玻璃晶片的外表面上沉积材料层，该材料层的选择比率高于玻璃晶片的选择比，在玻璃晶片的一侧上形成通孔图案部分 所述材料层进行蚀刻所述通路图案部分以形成预备通孔的第一蚀刻，消除在形成所述通路图案部分中使用的剩余图案材料，进行第二蚀刻，其中所述预通孔 被蚀刻以形成具有光滑表面并延伸穿过玻璃晶片的通孔，并且消除材料层。 根据本发明的方法能够通过玻璃晶片形成通孔，而不会形成底切或微小的裂缝，从而提高MEMS元件的成品率和可靠性。

    Cooler and display device having the same
    25.
    发明授权
    Cooler and display device having the same 有权
    具有相同的冷却器和显示装置

    公开(公告)号：US08254121B2

    公开(公告)日：2012-08-28

    申请号：US12868061

    申请日：2010-08-25

    申请人： Moon-chul Lee ,  Min-soo Kim ,  Yong-soo Lee ,  Sru Kim

    发明人： Moon-chul Lee ,  Min-soo Kim ,  Yong-soo Lee ,  Sru Kim

    IPC分类号： H05K7/20 ,  F01D9/00

    CPC分类号： H05K7/20972 ,  F04D25/166 ,  F04D29/441 ,  F04D29/444 ,  F05D2250/52 ,  H05K7/20172

    摘要： A cooler and a display device including the cooler. The cooler includes: a housing; an air blowing unit disposed inside the housing and sucking external air and blowing the external air in the housing, wherein the air blowing unit includes a plurality of groups each including two air blowers; a guide vane disposed above the air blowing unit and to guide air flowed out from the air blowing unit to flow in different directions; and a plurality of auxiliary guide vanes disposed between the air blowing unit and the guide vane, and each disposed in each of the groups each including two air blowers, so as to guide air flowing below the air blowing unit to flow toward the guide vane.

    摘要翻译： 一种冷却器和包括该冷却器的显示装置。 冷却器包括：一个外壳; 吹风单元，其设置在所述壳体内部并吸入外部空气并吹送所述壳体中的外部空气，其中所述吹风单元包括多个组，每组包括两个鼓风机; 引导叶片，其设置在所述吹风单元的上方，并且引导从所述送风单元流出的空气沿不同方向流动; 以及设置在送风单元和导向叶片之间的多个辅助导向叶片，并且每个辅助导向叶片各自设置在每个组中，每个组包括两个鼓风机，以便引导在吹风单元下方流动的空气流向导向叶片。

    Micro antenna and method of manufacturing the same
    26.
    发明授权
    Micro antenna and method of manufacturing the same 失效
    微天线及其制造方法

    公开(公告)号：US07926165B2

    公开(公告)日：2011-04-19

    申请号：US11712526

    申请日：2007-03-01

    申请人： Young-tack Hong ,  Moon-chul Lee ,  In-sang Song ,  Sang-wook Kwon ,  Chang-won Jung ,  Eun-seok Park

    发明人： Young-tack Hong ,  Moon-chul Lee ,  In-sang Song ,  Sang-wook Kwon ,  Chang-won Jung ,  Eun-seok Park

    IPC分类号： H01P11/00 ,  H01Q13/00 ,  H01Q17/00 ,  H01Q1/36 ,  H05K3/36 ,  H01K3/10

    CPC分类号： H01Q1/2283 ,  H01F17/0033 ,  H01F41/041 ,  H01Q1/362 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49126 ,  Y10T29/49165

    摘要： A method of manufacturing a micro antenna is provided. The method includes forming a plurality of holes penetrating a first substrate, filling each of the plurality of holes with a conductive material to form a plurality of vertical conducting parts, forming a plurality of horizontal conducting parts on each of two different surfaces of the first substrate, wherein the each of the horizontal conducting parts is electrically connected to the corresponding vertical conducting parts, bonding the first substrate, on which the vertical conducting parts and the horizontal conducting parts have been formed, to a second substrate, and removing the first substrate to expose a whole structure of a 3D micro antenna which is formed on the second substrate and includes the vertical conducting parts and the horizontal conducting parts connected to each other.

    摘要翻译： 提供一种制造微型天线的方法。 该方法包括：形成穿过第一基板的多个孔，用导电材料填充多个孔中的每个孔，以形成多个垂直导电部分，在第一基板的两个不同表面的每一个上形成多个水平导电部件 其中，每个水平导电部分电连接到相应的垂直导电部分，将其上形成有垂直导电部分和水平导电部分的第一基板接合到第二基板，并且将第一基板去除 露出形成在第二基板上的3D微型天线的整体结构，并且包括彼此连接的垂直导电部分和水平导电部件。

    MICRO PUMP
    27.
    发明申请
    MICRO PUMP 有权
    微型泵

    公开(公告)号：US20110020140A1

    公开(公告)日：2011-01-27

    申请号：US11266903

    申请日：2005-11-04

    申请人： Tae-sik Park ,  Young-il Kim ,  Jung-ho Kang ,  Moon-chul Lee

    发明人： Tae-sik Park ,  Young-il Kim ,  Jung-ho Kang ,  Moon-chul Lee

    IPC分类号： F04B37/02

    CPC分类号： F04B19/006 ,  F04B43/043

    摘要： Provided is a micro pump having a simple structure. The micro pump includes a pump chamber including inflow and outflow passages through which a drive fluid flows, a first valve configured to open or close the inflow passage, a second valve configured to open or close the outflow passage, and a pump chamber heating and cooling unit configured to heat or cool the pump chamber.

    摘要翻译： 提供一种结构简单的微型泵。 微型泵包括泵室，其包括驱动流体流过的流入和流出通道，构造成打开或关闭流入通道的第一阀，构造成打开或关闭流出通道的第二阀，以及泵室加热和冷却 单元被配置为加热或冷却泵室。

    Wafer level package for surface acoustic wave device and fabrication method thereof
    28.
    发明授权
    Wafer level package for surface acoustic wave device and fabrication method thereof 有权
    用于表面声波器件的晶片级封装及其制造方法

    公开(公告)号：US07545017B2

    公开(公告)日：2009-06-09

    申请号：US11447969

    申请日：2006-06-07

    申请人： Moon-chul Lee ,  Jun-sik Hwang ,  Ji-hyuk Lim ,  Woon-bae Kim

    发明人： Moon-chul Lee ,  Jun-sik Hwang ,  Ji-hyuk Lim ,  Woon-bae Kim

    IPC分类号： H01L29/84

    CPC分类号： H03H9/1092 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H01L2924/00014

    摘要： A wafer level package for a surface acoustic wave (SAW) device and a fabrication method thereof. The SAW device wafer level package includes a SAW device in which a SAW element is formed on a top surface of a device wafer, a cap wafer which is bonded with a top surface of the SAW device and has a viahole penetrating the cap wafer, and a conductive member to fill a part of the viahole. The viahole has a first via portion and a second via portion, the first via portion has a gradually smaller diameter from a bottom surface of the cap wafer until a certain depth, and the second via portion has a gradually greater diameter from the first via portion until a top surface of the cap wafer.

    摘要翻译： 一种用于表面声波（SAW）器件的晶片级封装及其制造方法。 SAW器件晶片级封装包括SAW器件，其中SAW元件形成在器件晶片的顶表面上，盖晶片与SAW器件的顶表面结合并具有穿透盖晶片的通孔，以及 用于填充通孔的一部分的导电构件。 通孔具有第一通孔部分和第二通孔部分，第一通孔部分具有从盖子晶片的底表面到一定深度的逐渐变小的直径，并且第二通孔部分具有从第一通孔部分 直到盖晶片的顶表面。