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    INTERFERON ALPHA-INDUCED PHARMACODYNAMIC MARKERS
    21.
    发明申请
    INTERFERON ALPHA-INDUCED PHARMACODYNAMIC MARKERS 审中-公开
    干扰素诱导的药物动力学标记

    公开(公告)号：US20110287022A1

    公开(公告)日：2011-11-24

    申请号：US12999626

    申请日：2009-06-19

    申请人： Yihong Yao ,  Bahija Jallal ,  Ricardo Cibotti ,  Anthony Coyle ,  Peter Kiener ,  Barbara White

    发明人： Yihong Yao ,  Bahija Jallal ,  Ricardo Cibotti ,  Anthony Coyle ,  Peter Kiener ,  Barbara White

    IPC分类号： A61K39/395 ,  C40B30/04 ,  A61P29/00 ,  A61P17/06 ,  A61P19/02 ,  G01N33/53 ,  C12Q1/02

    CPC分类号： C07K16/249 ,  A61K2039/505 ,  C07K2317/76 ,  G01N2800/205 ,  G01N2800/56 ,  G01N2800/60

    摘要： The present invention encompasses type-I IFN and IFNα-induced PD marker expression profiles, kits, and methods for identifying such IFNα-induced PD marker expression profiles. The type-I IFN and IFNα-induced PD marker expression profiles may also be used in, for example, methods of treating patients having a type-I IFN or IFNα-mediated disorder, methods of monitoring disease progression of patients receiving treatment with a therapeutic agent that binds to and modulates IFNα activity, identifying patients as candidates to receive a therapeutic that binds to and neutralizes IFNα activity, and in diagnosing or providing a prognoses to patients having IFNα-induced disorders.

    摘要翻译： 本发明包括I型IFN和IFNα诱导的PD标志物表达谱，试剂盒和用于鉴定这种IFNα诱导的PD标志物表达谱的方法。 I型IFN和IFNα诱导的PD标志物表达谱也可用于例如治疗患有I型IFN或IFNα介导的病症的患者的方法，监测接受治疗的患者的疾病进展的方法 结合并调节IFNα活性的试剂，鉴定患者作为接受结合并中和IFNα活性的治疗剂的候选物，以及诊断或提供具有IFNα诱导的病症的患者的预后。

    Antagonists of Hmgb1 and/or Rage and Methods of Use Thereof
    23.
    发明申请
    Antagonists of Hmgb1 and/or Rage and Methods of Use Thereof 审中-公开
    Hmgb1的拮抗剂和/或愤怒及其使用方法

    公开(公告)号：US20080311122A1

    公开(公告)日：2008-12-18

    申请号：US12094449

    申请日：2006-11-27

    申请人： Herren Wu ,  Ling-Ling An ,  Peter Kiener ,  Anthony Coyle ,  Jane Tian ,  Changsou Gao

    发明人： Herren Wu ,  Ling-Ling An ,  Peter Kiener ,  Anthony Coyle ,  Jane Tian ,  Changsou Gao

    IPC分类号： A61K39/395 ,  A61K31/7105 ,  A61P37/02

    CPC分类号： C07K16/24 ,  A61K2039/505 ,  C07K2317/21 ,  C07K2317/55 ,  C07K2317/73 ,  C07K2317/76 ,  C07K2317/92 ,  C07K2319/32

    摘要： Compositions and methods are disclosed for inhibiting the release of a proinflammatory cytokine from a vertebrate cell, and for inhibiting an inflammatory cytokine cascade in a patient. The compositions comprise, for example, high affinity antibodies that specifically bind HMG1 and antigenic fragments thereof. The high affinity antibodies of the present invention and pharmaceutical compositions comprising the same are useful for many purposes, for example, as therapeutics against a wide range of inflammatory diseases and disorders such as sepsis, rheumatoid arthritis, peritonitis, Crohn s disease, reperfusion injury, septicemia, endotoxic shock, cystic fibrosis, endocarditis, lupus, psoriasis, psoriatic arthritis, arthritis, anaphylactic shock, organ ischemia, reperfusion injury, and allograft rejection. In addition, the high affinity antibodies of the present inventions are useful as diagnostic antibodies.

    摘要翻译： 公开了用于抑制促炎细胞因子从脊椎动物细胞中释放并抑制患者炎性细胞因子级联的组合物和方法。 组合物包含例如特异性结合HMG1的高亲和力抗体及其抗原性片段。 本发明的高亲和力抗体和包含其的药物组合物可用于许多目的，例如作为针对广泛范围的炎性疾病和病症的治疗剂，例如败血症，类风湿性关节炎，腹膜炎，克罗恩病，再灌注损伤， 败血病，内毒素性休克，囊性纤维化，心内膜炎，狼疮，牛皮癣，牛皮癣关节炎，关节炎，过敏性休克，器官缺血，再灌注损伤和同种异体移植排斥。 此外，本发明的高亲和力抗体可用作诊断抗体。

    Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement
    25.
    发明申请
    Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement 审中-公开
    具有集成金属部件用于热增强的半导体封装

    公开(公告)号：US20060226521A1

    公开(公告)日：2006-10-12

    申请号：US11426166

    申请日：2006-06-23

    申请人： Anthony Coyle ,  William Boyd ,  Chris Haga ,  Leland Swanson

    发明人： Anthony Coyle ,  William Boyd ,  Chris Haga ,  Leland Swanson

    IPC分类号： H01L23/495

    CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A semiconductor device comprising a metallic leadframe (103) with a first surface (103a) and a second surface (103b). The leadframe includes a chip pad (104) and a plurality of segments (107); the chip pad is held by a plurality of straps (105), wherein each strap has a groove (106). A chip (101) is mounted on the chip pad and electrically connected to the segments. A heat spreader (110) is disposed on the first surface of the leadframe; the heat spreader has its central portion (110a) spaced above the chip connections (108), and also has positioning members (110b) extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed.

    摘要翻译： 一种半导体器件，包括具有第一表面（103a）和第二表面（103b）的金属引线框架（103）。 引线框架包括芯片焊盘（104）和多个段（107）; 芯片垫由多个带（105）保持，其中每个带具有凹槽（106）。 芯片（101）安装在芯片焊盘上并电连接到段上。 散热器（110）设置在引线框架的第一表面上; 散热器具有在芯片连接件（108）上方间隔开的中心部分（110a），并且还具有从中心部分的边缘向外延伸的定位构件（110b），使得它们搁置在带的凹槽中。 封装材料围绕芯片，电连接和扩展器定位构件，并且填充扩展器和芯片之间的空间，同时使第二引线框表面和中心扩展器部分露出。

    High affinity antibodies against HMGB1 and methods of use thereof
    27.
    发明授权
    High affinity antibodies against HMGB1 and methods of use thereof 失效
    针对HMGB1的高亲和力抗体及其使用方法

    公开(公告)号：US08153131B2

    公开(公告)日：2012-04-10

    申请号：US12534217

    申请日：2009-08-03

    申请人： Herren Wu ,  Christian Allan ,  Changshou Gao ,  Ling-Ling An ,  Peter Kiener ,  Su-Yau Mao ,  Anthony Coyle

    发明人： Herren Wu ,  Christian Allan ,  Changshou Gao ,  Ling-Ling An ,  Peter Kiener ,  Su-Yau Mao ,  Anthony Coyle

    IPC分类号： A61K39/395

    CPC分类号： C07K16/24 ,  A61K2039/505 ,  C07K2317/21 ,  C07K2317/55 ,  C07K2317/565 ,  C07K2317/76 ,  C07K2317/92 ,  C07K2319/30 ,  Y02A50/412

    摘要： Compositions and methods are disclosed for inhibiting the release of a proinflammatory cytokine from a vertebrate cell, and for inhibiting an inflammatory cytokine cascade in a patient. The compositions comprise, for example, high affinity antibodies that specifically bind HMG1 and antigenic fragments thereof. The high affinity antibodies of the present invention and pharmaceutical compositions comprising the same are useful for many purposes, for example, as therapeutics against a wide range of inflammatory diseases and disorders such as sepsis, rheumatoid arthritis, peritonitis, Crohn's disease, reperfusion injury, septicemia, endotoxic shock, cystic fibrosis, endocarditis, psoriasis, psoriatic arthritis, arthritis, anaphylactic shock, organ ischemia, reperfusion injury, and allograft rejection. In addition, the high affinity antibodies of the present inventions are useful as diagnostic antibodies.

    摘要翻译： 公开了用于抑制促炎细胞因子从脊椎动物细胞中释放并抑制患者炎性细胞因子级联的组合物和方法。 组合物包含例如特异性结合HMG1的高亲和力抗体及其抗原性片段。 本发明的高亲和力抗体和包含其的药物组合物可用于许多目的，例如作为针对广泛范围的炎性疾病和病症的治疗剂，例如败血症，类风湿性关节炎，腹膜炎，克罗恩病，再灌注损伤，败血症 内毒素性休克，囊性纤维化，心内膜炎，牛皮癣，牛皮癣关节炎，关节炎，过敏性休克，器官缺血，再灌注损伤和同种异体移植排斥。 此外，本发明的高亲和力抗体可用作诊断抗体。

    Integrated Circuit Chip Packaging Assembly
    30.
    发明申请
    Integrated Circuit Chip Packaging Assembly 有权
    集成电路芯片封装组件

    公开(公告)号：US20070259484A1

    公开(公告)日：2007-11-08

    申请号：US11774879

    申请日：2007-07-09

    申请人： Steven Kummerl ,  Anthony Coyle ,  Bernhard Lange

    发明人： Steven Kummerl ,  Anthony Coyle ,  Bernhard Lange

    IPC分类号： H01L21/00

    CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.

    摘要翻译： 一种具有第一和第二封装侧的集成电路芯片封装组件。 集成电路芯片具有基板侧和有源电路侧。 芯片包括形成在有源电路侧的集成电路器件。 芯片的有源电路侧位于第一封装侧。 模片垫具有从其延伸的至少一个浇道构件，其可以朝着第一封装侧弯曲。 芯片的有源电路侧连接到管芯焊盘。 芯片焊盘相对于芯片在第一封装侧。 封装模具化合物形成在芯片焊盘，芯片的至少一部分和流道部件的至少一部分之上。 芯片的基板侧的至少一部分和/或流道部件的至少一部分可以不被封装模具化合物覆盖。