公开(公告)号：US09698186B2

公开(公告)日：2017-07-04

申请号：US14793456

申请日：2015-07-07

Applicant: FUJIFILM Corporation

Inventor： Takashi Kawashima ,  Hidenori Takahashi ,  Toshihide Ezoe

IPC: F21V9/04 ,  F21V9/06 ,  G02B5/22 ,  G02B5/26 ,  H01L27/146 ,  G02B5/20 ,  H01L31/0232 ,  H01L21/00 ,  G02B13/00

CPC classification number: H01L27/14621 ,  G02B5/208 ,  G02B5/223 ,  G02B13/003 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685

Abstract: A near-infrared-absorbing composition includes a copper compound and a compound having a partial structure represented by Formula (1) described below and the content of the copper compound is in a range of 3×10−3 mol to 1 mol in relation to 1 g of the compound having the partial structure represented by Formula (1) described below, in Formula (1), R1 represents a hydrogen atom or an organic group.

公开(公告)号：US12164228B2

公开(公告)日：2024-12-10

申请号：US17003500

申请日：2020-08-26

Applicant: FUJIFILM Corporation

Inventor： Michihiro Ogawa ,  Takashi Kawashima ,  Akihiro Kaneko ,  Akiyoshi Goto

IPC: G03F7/039 ,  C08F212/14 ,  C08F220/18 ,  C08F220/24 ,  C08F226/06 ,  G03F7/004 ,  G03F7/038

Abstract: An object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern thus formed has excellent LER and collapse suppressing ability. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention includes a compound that generates an acid upon irradiation with actinic rays or radiation, and a resin whose polarity increases by the action of an acid, in which the resin includes a repeating unit represented by General Formula (B-1), and a content of the repeating unit represented by General Formula (B-1) is 5% to 70% by mass with respect to all the repeating units in the resin. In General Formula (B-1), Ri represents a hydrogen atom or an organic group, the Ring W1 represents a ring which includes at least one carbon atom and one nitrogen atom, and may have a substituent

公开(公告)号：US12032290B2

公开(公告)日：2024-07-09

申请号：US17344967

申请日：2021-06-11

Applicant: FUJIFILM Corporation

Inventor： Daisuke Asakawa ,  Takashi Kawashima ,  Akiyoshi Goto ,  Michihiro Shirakawa ,  Kei Yamamoto

IPC: G03F7/039 ,  G03F7/004 ,  G03F7/20 ,  G03F7/30 ,  G03F7/32 ,  G03F7/40

CPC classification number: G03F7/0397 ,  G03F7/0045 ,  G03F7/2004 ,  G03F7/30 ,  G03F7/322 ,  G03F7/327 ,  G03F7/40

Abstract: According to the present invention, an actinic ray-sensitive or radiation-sensitive resin composition including a resin P having a repeating unit represented by General Formula (P1) and a compound that generates an acid having a pKa of −1.40 or more upon irradiation with actinic rays or radiation; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the composition, are provided.






Mp represents a single bond or a divalent linking group.
Lp represents a divalent linking group.
Xp represents O, S, or NRN1. RN1 represents a hydrogen atom or a monovalent organic group.
Rp represents a monovalent organic group.

公开(公告)号：US11656548B2

公开(公告)日：2023-05-23

申请号：US16905566

申请日：2020-06-18

Applicant: FUJIFILM Corporation

Inventor： Tomotaka Tsuchimura ,  Takashi Kawashima ,  Akihiro Kaneko ,  Michihiro Ogawa ,  Michihiro Shirakawa ,  Hajime Furutani ,  Kyohei Sakita

IPC: G03F7/004 ,  C08F220/18 ,  C08F220/28 ,  C08F212/14 ,  G03F1/22 ,  G03F7/038 ,  G03F7/039 ,  G03F7/20

CPC classification number: G03F7/0045 ,  C08F212/24 ,  C08F220/1804 ,  C08F220/1806 ,  C08F220/1811 ,  C08F220/281 ,  C08F220/282 ,  G03F1/22 ,  G03F7/038 ,  G03F7/039 ,  G03F7/2004 ,  G03F7/2037

Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition that can provide a resist film with excellent sensitivity and a pattern with excellent LER performance, and can suppress pattern collapse during pattern formation. In addition, the present invention also provides a resist film, a pattern forming method, a mask blank with a resist film, a method for producing a photomask, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a resin X having a repeating unit A represented by General Formula (I), a repeating unit B having an acid-decomposable group, and a repeating unit C selected from a repeating unit c1 represented by General Formula (II) and the like; a compound Y which is a basic compound or ammonium salt compound whose basicity is reduced upon irradiation with actinic rays or radiation; and a photoacid generator Z which is a compound other than the compound Y.

公开(公告)号：US11149141B2

公开(公告)日：2021-10-19

申请号：US16525687

申请日：2019-07-30

Applicant: FUJIFILM Corporation

Inventor： Ryosuke Kato ,  Takashi Kawashima ,  Yoshinori Taguchi

IPC: C08L33/10 ,  C08G61/12 ,  C08J3/24 ,  C08K3/22 ,  C08K5/1535 ,  C08K5/1575 ,  C08K5/3475 ,  C08L33/02 ,  C08L33/06 ,  C08L47/00 ,  G02B1/04

Abstract: A composition includes: a compound represented by the following Formula (1); a pigment; and a solvent. In a case where a film having a thickness of 4.0 m is formed using the composition, a maximum value of a light transmittance of the film in a thickness direction in a wavelength range of 360 nm to 700 nm is lower than 40%. In Formula (1), Z1 represents an (m+n)-valent linking group, Y1 and Y2 each independently represent a single bond or a linking group, A represents a group including a pigment adsorption portion, P1 represents a polymer chain, n represents 1 to 20, m represents 1 to 20, and m+n represents 3 to 21, at least one of Z1, A1, or P1 includes a photocurable group.

公开(公告)号：US10989846B2

公开(公告)日：2021-04-27

申请号：US16008209

申请日：2018-06-14

Applicant: FUJIFILM Corporation

Inventor： Seiichi Hitomi ,  Takashi Kawashima ,  Keisuke Arimura ,  Takahiro Okawara

IPC: C08K5/29 ,  G02B5/22 ,  C08L33/10 ,  C08L43/04 ,  C08L101/02 ,  C08K5/00 ,  C08L101/10 ,  C08K5/52 ,  H01L27/146 ,  G02B5/20 ,  C08L101/12 ,  C08K5/3437 ,  G02B5/00 ,  H01L27/14 ,  C08K5/3417 ,  C08K5/16 ,  C08K5/01 ,  C08K5/54 ,  G02B5/28

Abstract: Provided are a near infrared absorbing composition with which a cured film having excellent solvent resistance and thermal shock resistance can be manufactured, a near infrared cut filter, a method of manufacturing a near infrared cut filter, a solid image pickup element, a camera module, and an image display device. The near infrared absorbing composition includes: a resin A that satisfies the following condition a1; an infrared absorber B; and a solvent D. At least the resin A has a crosslinking group, or the near infrared absorbing composition further includes a compound C having a crosslinking group that is different from the resin A. condition a1: in a case where the resin A does not have a crosslinking group, a glass transition temperature of the resin A measured by differential scanning calorimetry is 0° C. to 100° C., and in a case where the resin A has a crosslinking group, a glass transition temperature of a resin having a structure in which a portion which forms a crosslinking bond in the crosslinking group of the resin A is substituted with a hydrogen atom is 0° C. to 100° C., the glass transition temperature being measured by differential scanning calorimetry.

公开(公告)号：US20190219922A1

公开(公告)日：2019-07-18

申请号：US16363238

申请日：2019-03-25

Applicant: FujiFilm Corporation

Inventor： Akihiro KANEKO ,  Shuji Hirano ,  Takashi Kawashima ,  Michihiro Ogawa ,  Hajime Furutani ,  Wataru Nihashi ,  Hideaki Tsubaki ,  Kyohei Sakita

IPC: G03F7/038 ,  G03F7/004 ,  G03F7/20

CPC classification number: G03F7/0382 ,  C08F12/14 ,  G03F7/0045 ,  G03F7/038 ,  G03F7/0381 ,  G03F7/039 ,  G03F7/20 ,  G03F7/2053 ,  G03F7/325

Abstract: There is provided a resist composition containing a resin. The resin includes a repeating unit (a) having one or more *—OY0 groups substituted for an aromatic ring; and a phenolic hydroxyl group (b) or a partial structure (c) represented by Formula (X). Here, the *—OY0 group is a group that is decomposed due to an action of an acid to generate a phenolic hydroxyl group, and Y0 is a specific protective group. In a case where the repeating unit (a) includes none of the phenolic hydroxyl group (b) and the partial structure (c), the repeating unit (a) is a repeating unit in which the *—OY0 group is decomposed due to an action of an acid to generate two or more phenolic hydroxyl groups.

公开(公告)号：US09618666B2

公开(公告)日：2017-04-11

申请号：US14753189

申请日：2015-06-29

Applicant: FUJIFILM Corporation

Inventor： Takashi Kawashima ,  Seiichi Hitomi ,  Hidenori Takahashi ,  Yuki Nara ,  Seongmu Bak

IPC: G02B5/20 ,  C07F1/08 ,  H04N5/225 ,  H04N5/33 ,  C08F2/44 ,  C08K5/42 ,  C08L63/00 ,  G02B5/22 ,  C08K5/00 ,  H01L27/146

CPC classification number: G02B5/208 ,  C07F1/08 ,  C08F2/44 ,  C08K5/0091 ,  C08K5/42 ,  C08L63/00 ,  C09D5/32 ,  G02B5/22 ,  G02B5/223 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/11 ,  H04N5/2254 ,  H04N5/332

Abstract: An object of the present invention is to provide a near-infrared-absorbing composition capable of forming a cured film having excellent heat resistance while maintaining strong near-infrared shielding properties when a cured film is produced. The near-infrared-absorbing composition of the present invention includes a copper complex obtained by reacting two or more kinds of sulfonic acids represented by General Formula (I) described below or salts thereof with a copper component and a solvent.