公开(公告)号：US20070077675A1

公开(公告)日：2007-04-05

申请号：US11459187

申请日：2006-07-21

申请人： Bernard Diem

发明人： Bernard Diem

IPC分类号： H01L21/00

CPC分类号： B81C1/00285 ,  B81C2203/0145

摘要： The invention relates to a method to seal a cavity, comprising a hole (6), comprising: the deposition on at least part of the cover, or an electrically conductive material (4, 5), the conveyance of part of this material by electro-migration into the hole (6) to form a plug (20).

摘要翻译： 本发明涉及一种密封空腔的方法，包括一个孔（6），包括：在至少部分盖子上的沉积物或导电材料（4,5），通过电子传递该材料的一部分 - 移入孔（6）以形成塞子（20）。

公开(公告)号：US06546801B2

公开(公告)日：2003-04-15

申请号：US09839134

申请日：2001-04-23

申请人： Elisabeth Orsier ,  Bernard Diem ,  Hélène Wehbe-Alause ,  Olivier Lefort

发明人： Elisabeth Orsier ,  Bernard Diem ,  Hélène Wehbe-Alause ,  Olivier Lefort

IPC分类号： G01P1500

CPC分类号： G01P15/08 ,  B81B3/0051 ,  B81B2201/0235 ,  B81B2203/0307 ,  B81B2203/051 ,  G01P2015/0814

摘要： A mechanical structure (100) comprises a moving mass (3) suspended by beams (4, 5, 6, 7) from a fixed frame (2). The structure (100) comprises elongation means (23-26) mechanically connected to each of the beams (4, 5, 6, 7). The elongation means is designed such that the stiffness of the beams (4, 5, 6, 7) varies only little during movement of the moving mass. The structure is characterized in that the response of an elongation means is asymmetric when acting in tension and in compression. The structure is thus made insensitive to accelerations along a direction parallel to the suspension direction.

公开(公告)号：US5912499A

公开(公告)日：1999-06-15

申请号：US579063

申请日：1995-12-22

申请人： Bernard Diem ,  Marie-Therese Delaye

发明人： Bernard Diem ,  Marie-Therese Delaye

IPC分类号： G01L9/04 ,  B81B3/00 ,  G01L9/00 ,  G01L9/12 ,  H01L29/84 ,  H01L29/82

CPC分类号： B81C1/00158 ,  G01L9/0042 ,  G01L9/0055 ,  G01L9/0073 ,  B81B2201/0264 ,  Y10S148/135 ,  Y10S148/159

摘要： An integrated pressure sensitive transducer incorporating a pressure sensitive structure having a silicon substrate, and at least one monocrystalline silicon diaphragm deformable in a direction perpendicular to the substrate. The diaphragm, which is joined to the substrate at its periphery by means of an etched insulating layer, has a centered insulating stud which bears on the substrate in order to increase the rigidity of the diaphragm. Completing the transducer and for measuring the deformation of the diaphragm is at least one first electrode located in the substrate facing a high deformation region of the diaphragm and remote from the periphery of the diaphragm and the insulating stud, and at least one second electrode facing at least one low deformation region of the diaphragm and in the vicinity of the periphery and/or the insulating stud.

摘要翻译： 一种集成压敏传感器，其包括具有硅衬底的压敏结构，以及至少一个在垂直于衬底的方向上可变形的单晶硅膜片。 通过蚀刻绝缘层在其周边连接到基板的隔膜具有承载在基板上的中心绝缘柱，以增加隔膜的刚性。 完成传感器并测量隔膜的变形是至少一个位于基板中的第一电极，该第一电极面对隔膜的高变形区域并且远离隔膜和绝缘支柱的周边，以及至少一个第二电极 膜片的至少一个低变形区域和周边附近和/或绝缘柱。

公开(公告)号：US08349660B2

公开(公告)日：2013-01-08

申请号：US12693867

申请日：2010-01-26

申请人： Gilles Delapierre ,  Bernard Diem ,  Francois Perruchot

发明人： Gilles Delapierre ,  Bernard Diem ,  Francois Perruchot

IPC分类号： H01L21/00

CPC分类号： B81C1/00293 ,  B81C2203/0145 ,  G01P1/023 ,  G01P15/0802 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： A process for closure of at least one cavity intended to encapsulate or be part of a microelectronic device, comprising the following steps: a) Producing a cavity in a first substrate comprising a first layer traversed by an opening forming an access to the cavity; b) Producing a portion of bond material around the opening, on a surface of the first layer located on the side opposite the cavity; c) Producing, on a second substrate, a portion of fusible material, with a deposition of the fusible material on the second substrate and the use of a mask; d) Placing the portion of fusible material in contact with the portion of bond material; e) Forming a plug for the opening, which adheres to the portion of bond material, by melting and then solidification of the fusible material; f) Separating the plug and the second substrate.

摘要翻译： 一种用于封闭旨在封装或成为微电子器件的一部分的至少一个空腔的方法，包括以下步骤：a）在第一衬底中产生空腔，该第一衬底包括由形成对腔的通路的开口穿过的第一层; b）在位于与空腔相对的一侧的第一层的表面上，在开口周围产生粘合材料的一部分; c）在第二基板上产生可熔材料的一部分，在第二基板上沉积可熔材料并使用掩模; d）将可熔材料的一部分放置在与粘合材料部分接触的位置; e）通过熔化然后固化可熔材料，形成粘合到粘合材料部分上的开口的塞子; f）分离插头和第二基板。

公开(公告)号：US20110220470A1

公开(公告)日：2011-09-15

申请号：US12879261

申请日：2010-09-10

申请人： Bernard Diem ,  Henri Sibuet

发明人： Bernard Diem ,  Henri Sibuet

IPC分类号： H01H59/00

CPC分类号： H01H59/0009 ,  H01H1/0036 ,  H01H2001/0042 ,  H01H2001/0084

摘要： A micromachined electromechanical (MEMS) actuator including, for example, an electrostatically actuated electrical switch, is provided, including a first set of conducting plates forming part of the movable element of the switch, interdigitated with a set of conducting plates forming part of the substrate. The plates are, in principle, vertical relative to the surface of the substrate; they are in partial heightwise overlap and a control voltage applied between the two sets of plates exerts a vertical force acting so as to move the movable element closer to the substrate. The conducting plates of the movable element are connected to one another by conducting end crosspieces connecting the ends of these plates so as to surround, laterally, the stationary conducting plates. The distance separating one stationary plate end from the mobile crosspiece is the same at both ends so that the forces exerted in the elongation direction of the plates cancel out. This distance is preferably the same for all the plates.

摘要翻译： 提供包括例如静电驱动的电开关的微加工机电（MEMS）致动器，其包括形成开关的可移动元件的一部分的第一组导电板，与形成基板的一部分的一组导电板相互交错 。 原则上，板相对于基板的表面是垂直的; 它们处于部分高度重叠，并且施加在两组板之间的控制电压发挥作用以使可移动元件更靠近基板的垂直力。 可移动元件的导电板通过连接这些板的端部的端部挡板彼此连接，以便围绕固定导电板的侧面。 将一个固定板端与移动横档分开的距离在两端相同，使得沿板延伸方向施加的力抵消。 对于所有板，该距离优选相同。

公开(公告)号：US20110129757A1

公开(公告)日：2011-06-02

申请号：US12993609

申请日：2009-05-07

申请人： Bernard Diem ,  Philippe Baclet ,  Jean Dijon ,  Jean-Yves Laurent ,  Pascal Schott

发明人： Bernard Diem ,  Philippe Baclet ,  Jean Dijon ,  Jean-Yves Laurent ,  Pascal Schott

IPC分类号： H01M8/10 ,  H01M8/00 ,  H01M8/24 ,  B82Y30/00

CPC分类号： H01M8/1097 ,  H01M8/0234 ,  H01M8/0289 ,  H01M8/2415 ,  H01M8/2484 ,  H01M2008/1095 ,  Y02P70/56

摘要： A fuel cell includes at least one stack the main elements whereof are perpendicular to a support substrate. This stack is provided with an electrolytic membrane situated between a first and second electrode. The first and second electrodes each include a catalytic layer in contact with the electrolytic membrane. Each electrode includes an electrically conductive porous diffusion layer, and each stack is inserted between electrically conductive first and second support partitions perpendicular to the support substrate and constituting current collectors of the stack. The support partitions are electrically insulated from one another.

摘要翻译： 燃料电池包括至少一个堆叠，其主要元件垂直于支撑衬底。 该叠层设置有位于第一和第二电极之间的电解膜。 第一和第二电极各自包括与电解质膜接触的催化剂层。 每个电极包括导电多孔扩散层，并且每个堆叠被插入垂直于支撑衬底的导电的第一和第二支撑分隔件之间，并且构成堆叠的集流器。 支撑隔板彼此电绝缘。

公开(公告)号：US07906439B2

公开(公告)日：2011-03-15

申请号：US12488898

申请日：2009-06-22

申请人： François Perruchot ,  Bernard Diem ,  Vincent Larrey ,  Laurent Clavelier ,  Emmanuel Defay

发明人： François Perruchot ,  Bernard Diem ,  Vincent Larrey ,  Laurent Clavelier ,  Emmanuel Defay

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： B81C1/00507 ,  B81B2201/0271 ,  B81C2201/0115 ,  B81C2201/0136 ,  B81C2201/0177 ,  B81C2203/0136 ,  B81C2203/0145 ,  H03H3/0072 ,  H03H9/175 ,  H03H9/2436 ,  Y10S438/933

摘要： The invention provides a method of fabricating and electromechanical device having an active element on at least one substrate, the method having the steps of: a) making a heterogeneous substrate having a first portion, an interface layer, and a second portion, the first portion including one or more buried zones sandwiched between first and second regions formed in a first monocrystalline material, the first region extending to the surface of the first portion, and the second region extending to the interface layer, at least one said buried zone being made at least in part out of a second monocrystalline material so as to make it selectively attackable relative to the first and second regions; b) making openings from the surface of the first portion and through the first region, which openings open out to at least one said buried zone; and c) etching at least part of at least one buried zone to form at least one cavity so as to define at least one active element that is at least a portion of the second region between said cavity and said interface layer; wherein the first and second portions of the substrate are constituted respectively from first and second substrates that are assembled together by bonding, at least one of them including at least one said interface layer over at least a fraction of its surface.

摘要翻译： 本发明提供一种在至少一个基板上具有有源元件的制造方法和机电装置，该方法具有以下步骤：a）制造具有第一部分，界面层和第二部分的非均相基底，第一部分 包括夹在形成于第一单晶材料中的第一和第二区域之间的一个或多个掩埋区域，第一区域延伸到第一部分的表面，第二区域延伸到界面层，至少一个所述掩埋区域 至少部分地由第二单晶材料制成，以使其相对于第一和第二区域选择性地具有攻击性; b）从所述第一部分的表面和所述第一区域制造开口，所述第一区域开放到至少一个所述掩埋区域; 以及c）蚀刻至少一个掩埋区域的至少一部分以形成至少一个空腔，以便限定至少一个有源元件，所述至少一个有源元件是所述腔和所述界面层之间的第二区域的至少一部分; 其中所述基板的第一和第二部分分别由通过粘接而组装在一起的第一和第二基板构成，其中至少一个在其表面的至少一部分上包括至少一个所述界面层。

公开(公告)号：US20090321887A1

公开(公告)日：2009-12-31

申请号：US12488841

申请日：2009-06-22

申请人： Vincent Larrey ,  François Perruchot ,  Bernard Diem ,  Laurent Clavelier ,  Philippe Robert

发明人： Vincent Larrey ,  François Perruchot ,  Bernard Diem ,  Laurent Clavelier ,  Philippe Robert

IPC分类号： H01L21/30 ,  H01L23/58

CPC分类号： H01L29/66007 ,  B81B2201/0264 ,  B81C1/00357 ,  B81C1/00682 ,  B81C2201/019 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention relates to a method of fabricating an electromechanical structure presenting a first substrate (1) including at least one layer (1′) of monocrystalline material covered in a sacrificial layer (2) that presents a free surface, the structure presenting at least one mechanical reinforcing pillar received in said sacrificial layer, the method being characterized in that it comprises: a) making at least one well region (51, 52) in the sacrificial layer (2) by etching, at least in the entire thickness of the sacrificial layer (2), the well region defining at least one said mechanical pillar; b) depositing a first functionalization layer (4, 31) of a first material, relative to which the sacrificial layer is suitable for being etched selectively, the functionalization layer (4) filling at least one well region (51) at least partially and covering the free surface of the sacrificial layer (2) at least around the well region(s); and b′) depositing a filler layer (6, 32) of a second material different from the first material for terminating the filling of the well region(s) (5′), said filler layer (6) covering the first functionalization layer (4) at least in part around the well region(s) (5′), and planarizing the filler layer (6, 32), the pillar(s) being formed by the superposition of at least the first material and the second material in the well region(s); and releasing the electromechanical structure by removing at least partially the sacrificial layer (2). The invention also relates to an electromechanical structure obtained by the method.

摘要翻译： 本发明涉及一种制造机电结构的方法，所述机电结构呈现第一衬底（1），所述第一衬底（1）包括覆盖在呈现自由表面的牺牲层（2）中的至少一层单晶材料层（1'），所述结构呈现至少一个 所述方法的特征在于：其包括：a）至少在所述牺牲层的整个厚度中通过蚀刻在所述牺牲层（2）中制造至少一个阱区域（51,52） 层（2），所述阱区限定至少一个所述机械支柱; b）沉积第一材料的第一官能化层（4,31），所述第一材料相对于所述第一材料，所述第一材料相对于所述第一材料，所述牺牲层适于被选择性地蚀刻，所述官能化层（4）至少部分填充至少一个阱区域（51）并且覆盖 所述牺牲层（2）的至少围绕所述阱区域的自由表面; 和b'）沉积与所述第一材料不同的第二材料的填充层（6,32），以终止所述阱区域（5'）的填充，所述填充层（6）覆盖所述第一官能化层（ 4）至少部分地围绕所述阱区域（5'）周围，并且平坦化所述填充层（6,32），所述柱通过至少所述第一材料和所述第二材料的叠加形成 井区; 以及通过至少部分去除所述牺牲层（2）来释放所述机电结构。 本发明还涉及通过该方法获得的机电结构。

公开(公告)号：US07443002B2

公开(公告)日：2008-10-28

申请号：US10537372

申请日：2003-12-18

申请人： Bernard Diem ,  Gilles Delapierre

发明人： Bernard Diem ,  Gilles Delapierre

IPC分类号： G01L1/12

CPC分类号： B81B7/007 ,  B81C2203/0145

摘要： A microstructure including in a first layer insulated from a substrate by an insulator layer at least one sensitive element connected to at least one contact pad by an electrical connection and protected by a package cap. The sensitive element, the electrical connection, and the contact pad form an assembly delimited in the first layer by at least one trench, the assembly being covered by the package cap. The package cap includes at least one opening above the contact pad and is integral with the contact pad on the edges of the opening and with a zone located beyond the trench in relation to the assembly. Such a microstructure can find application in particular in microelectromechanical structures.

摘要翻译： 一种微结构，包括通过绝缘体层与基板绝缘的第一层，至少一个敏感元件通过电连接连接至至少一个接触焊盘并由封装盖保护。 敏感元件，电连接和接触垫形成在第一层中由至少一个沟槽限定的组件，该组件被封装盖覆盖。 封装盖包括在接触焊盘上方的至少一个开口，并且与开口边缘上的接触垫一体，并且相对于组件位于沟槽之外。 这种微结构可以特别在微机电结构中得到应用。

公开(公告)号：US6001666A

公开(公告)日：1999-12-14

申请号：US824084

申请日：1997-03-24

申请人： Bernard Diem ,  Sylvie Viollet-Bosson ,  Patricia Touret

发明人： Bernard Diem ,  Sylvie Viollet-Bosson ,  Patricia Touret

IPC分类号： G01L1/18 ,  G01B7/16 ,  G01L9/00 ,  H01L29/84 ,  H01L41/08 ,  H01L21/00

CPC分类号： G01L9/0055 ,  G01L9/0042 ,  Y10S148/159 ,  Y10S438/973

摘要： This invention relates to the manufacture of a strain gauge sensor using the piezoresistive effect, comprising a structure (1) made of a monocrystalline material acting as support to at least one strain gauge (2) made of a semiconducting material with a freely chosen doping type. The strain gauge (2) is an element made along a crystallographic plane determined to improve its piezoresistivity coefficient. The structure (1) is a structure etched along a crystallographic plane determined to improve its etching. The strain gauge (2) is fixed to the structure (1) by bonding means capable of obtaining said sensor.

摘要翻译： 本发明涉及使用压阻效应的应变仪传感器的制造，其包括由单晶材料制成的结构（1），该单晶材料作为至少一个由具有自由选择的掺杂型的半导体材料制成的应变仪（2） 。 应变仪（2）是沿着确定提高其压阻系数的晶面制造的元件。 结构（1）是沿着确定为改善其蚀刻的结晶面蚀刻的结构。 应变计（2）通过能够获得所述传感器的接合装置固定到结构（1）。