摘要:
A printed circuit board having a metal bump, including: an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; wherein the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer.
摘要:
There are provided a semiconductor light emitting device that can be manufactured by a simple process and has excellent light extraction efficiency and a method of manufacturing a semiconductor light emitting device that has high reproducibility and high throughput. A semiconductor light emitting device having a substrate and a lamination in which a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer are sequentially laminated onto the substrate according to an aspect of the invention includes a silica particle layer; and an uneven part formed at a lower part of the silica particle layer.
摘要:
Provided is an optical transceiver module of an optical transceiver, which is used for optical communications. The optical transceiver module prevents electrical crosstalk between a light source and a light receiver. Additionally, the optical transceiver module includes an optical transceiver unit including a light source and a light receiver together integrated into a substrate, a circuit unit including a drive circuit driving the light source and a detect circuit reading a signal of the light receiver, and a crosstalk prevention unit connected between the substrate and ground to prevent electrical crosstalk between the light source and the light receiver.
摘要:
Disclosed is a terahertz wave generator which includes a first light source outputting a first light having a first frequency; a second light source outputting a second light having a second frequency different from the first frequency; a second harmonic generation unit performing second harmonic conversion on the first and second lights to generate a third light and a fourth light; and a photomixer converting a mixing light of the third and fourth lights into a terahertz wave alternating signal and outputting a terahertz wave.
摘要:
A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a metal carrier; forming a barrier layer on the metal carrier including the recess; forming an upper circuit layer on the barrier layer, the upper circuit layer including the metal bump charged in the recess and a circuit pattern; preparing an insulating layer, and transferring the upper circuit layer to the insulating layer; and removing the metal carrier and the barrier layer.
摘要:
Provided is a waveguide photodetector including: a first clad layer disposed on a substrate; a core layer disposed on the first clad layer and for absorbing predetermined light; a second clad layer disposed on the core layer; and at least one subsidiary layer inserted in the first clad layer and the second clad layer. In this structure, the photodetector has about the same spot size as that of an optical fiber or planar lightwave circuit (PLC), so that incident light can be absorbed without loss, and the photodetector can more efficiently combine with the optical fiber or PLC and operate even at high power.