公开(公告)号：US20230211375A1

公开(公告)日：2023-07-06

申请号：US17995877

申请日：2020-04-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHI HAO CHANG ,  CHIEN-TING LIN ,  KUAN-TING WU

IPC: C23C28/00 ,  C23C14/02 ,  C23C14/34 ,  C23C14/16 ,  C23C14/20 ,  C23C14/58 ,  C25D11/02 ,  C25D11/18

CPC classification number: C23C28/321 ,  C23C14/024 ,  C23C14/34 ,  C23C14/165 ,  C23C14/205 ,  C23C14/58 ,  C25D11/026 ,  C25D11/18

Abstract: A coated substrate for an electronic device can include a substrate, a physical vapor deposition layer over the substrate, and an anti-fingerprint layer over the physical vapor deposition layer. The physical vapor deposition layer can include an alloy of gold and platinum. The anti-fingerprint layer can include an ultraviolet radiation-cured polymer mixed with an anti-fingerprint material. The anti-fingerprint material can include a silane, a fluorinated polymer, a hydrophobic polymer, or a combination thereof.

公开(公告)号：US20230171928A1

公开(公告)日：2023-06-01

申请号：US17995876

申请日：2020-04-10

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHI HAO CHANG ,  HENDRY HUANG ,  KUAN-TING WU

IPC: H05K7/20

CPC classification number: H05K7/2039 ,  H05K7/20336

Abstract: The present disclosure describes thermal modules having solder-free thermal bonds, methods of forming the thermal modules, and electronic devices that include the thermal modules. In one example, a thermal module having a solder-free thermal bond can include an assembly of a heat pipe and a heat sink mechanically connected to the heat pipe at a bonding junction area. The bonding junction area can include a gap between the heat pipe and the heat sink at a portion of the bonding junction area. A ther-mal coating composition can coat the assembly and fill the gap. The thermal coating composition can include a cured resin and thermally conductive particles.

公开(公告)号：US20220411677A1

公开(公告)日：2022-12-29

申请号：US17777729

申请日：2019-12-05

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  HSING-HUNG HSIEH ,  HANG YAN YUEN

IPC: C09J131/04 ,  C09J11/04 ,  B32B7/12 ,  B32B37/12

Abstract: Described herein is a reworkable optically clear adhesive composition comprising: a hot melt adhesive present in an amount of at least about 40 wt. %; a pressure sensitive adhesive present in an amount of at 5 least about 10 wt. %; and titanium dioxide nanoparticles present in an amount of up to about 5 wt. %; wherein the weight percentage of each component is based on the total weight of solids of the adhesive composition. Also described herein is a display for an electronic device comprising the reworkable optically clear adhesive composition and a method of producing the display for an 10 electronic device.

公开(公告)号：US20200283335A1

公开(公告)日：2020-09-10

申请号：US16754123

申请日：2017-11-16

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  KUO-CHIH HUANG ,  HANG YAN YUEN ,  CHI HAO CHANG

IPC: C03C17/42 ,  C03C15/00 ,  C03C23/00 ,  C03C21/00 ,  G02B1/18 ,  G02B5/02

Abstract: In one example, a method is described, which may include chemically etching a glass substrate to form a porous surface, coating an anti-glare layer on the porous surface, coating an anti-fingerprint layer on the anti-glare layer, and curing the anti-glare layer and the anti-fingerprint layer formed on the porous surface to form a protective panel.

公开(公告)号：US20190016028A1

公开(公告)日：2019-01-17

申请号：US16067763

申请日：2016-04-04

Applicant: HEWLETT- PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHI HAO CHANG ,  KUAN-TING WU ,  YU-LING LIN

IPC: B29C45/00 ,  C25D11/06 ,  C25D11/02

Abstract: The present subject matter relates to fabrication of micro-arc oxidation (MAO) based insert-molded components. In an example implementation, a method of fabricating a MAO based insert-molded component comprises forming an insert-molded component and oxidizing the insert-molded component through MAO. The insert-molded component has a metal body molded with a plastic body. On oxidation of the insert-molded component through MAO an oxide layer is formed on the metal body.

公开(公告)号：US20180304307A1

公开(公告)日：2018-10-25

申请号：US15565481

申请日：2015-05-22

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Ya-Ting YEH ,  KUAN-TING WU ,  YICHIEH CHANG

IPC: B05D7/00 ,  B05D3/00 ,  B05D5/08 ,  B05D7/14

CPC classification number: B05D7/54 ,  B05D3/002 ,  B05D5/083 ,  B05D7/14 ,  C08G2150/90 ,  C09D175/04

Abstract: Provided in one examole hod of manufacturing. The method includes disposing over at least a portion of a substrate a first layer, the substrate comprising a metal material and the first layer comprising a water-borne primer. The method includes disposing over at least a portion of the first layer a second layer, the second layer comprising a water-borne basecoat material. The method includes disposing over at least a portion of the second layer a third layer, the third layer comprising a water-bome topcoat material.

公开(公告)号：US20180244949A1

公开(公告)日：2018-08-30

申请号：US15758130

申请日：2015-10-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  YU-CHUAN KANG ,  CHI-HAO CHANG

IPC: C09D175/04 ,  C09D1/00

CPC classification number: C09D175/04 ,  C08G18/4854 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/0856 ,  C08K2003/0862 ,  C08L25/06 ,  C08L27/06 ,  C08L27/16 ,  C08L27/18 ,  C08L33/08 ,  C08L55/02 ,  C08L63/00 ,  C08L69/00 ,  C08L77/00 ,  C08L79/08 ,  C09D1/00 ,  C09D7/61 ,  C09D175/08 ,  C08K5/5415 ,  C08L33/12

Abstract: This disclosure provides a sol-gel hybrid coating composition, comprising a sol-gel precursor, a polymer and a solvent, wherein the sol-gel precursor comprises tetraethyl orthosilicate and the polymer comprises polyurethane and polyacrylic. This disclosure also provides a coating process, comprising: subjecting a light metal to micro-arc oxidation treatment to form a first protection layer on the light metal, and coating the sol-gel hybrid coating composition onto the first protection layer to form a second protection layer. This disclosure further provides composite coating layers, comprising: a first layer obtained by micro-arc oxidation treatment, and a second layer obtained by dip coating with the sol-gel hybrid coating composition.

公开(公告)号：US20180216247A1

公开(公告)日：2018-08-02

申请号：US15747205

申请日：2015-09-11

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHI HAO CHANG ,  KUAN-TING WU ,  CHIEN-TING LIN

IPC: C25D11/24 ,  C25D11/02 ,  B05D7/00

CPC classification number: C25D11/246 ,  B05D7/52 ,  B05D2202/20 ,  B05D2202/25 ,  B05D2202/35 ,  B05D2350/60 ,  C09D5/00 ,  C09D5/08 ,  C09D7/61 ,  C23C18/1212 ,  C23C18/1216 ,  C23C18/122 ,  C23C18/1245 ,  C23C18/1254 ,  C23C22/05 ,  C23C26/02 ,  C23C28/32 ,  C23C28/321 ,  C23C28/345 ,  C23C28/3455 ,  C25D11/026 ,  C25D11/06 ,  C25D11/26 ,  C25D11/30 ,  C25D11/34

Abstract: Substrates comprising a light metal layer, an oxidized layer formed on the light metal layer, and a polymer hybrid layer formed on the oxidized layer; and methods for forming the substrates are disclosed.

公开(公告)号：US20180173073A1

公开(公告)日：2018-06-21

申请号：US15563150

申请日：2015-07-08

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  WEI KUANG CHU ,  KEVIN VOSS

IPC: G02F1/167 ,  G02B5/22 ,  G06F1/16

CPC classification number: G02F1/167 ,  G02B5/22 ,  G02F2001/1678 ,  G02F2203/01 ,  G06F1/1637

Abstract: An electrophoretic privacy device may include an electrophoretic cell coupled between a first electrode and a second electrode. The electrophoretic cell may comprise a plurality of semi-transparent positively-charged particles and a plurality of semi-transparent negatively-charged particles. The particles may be dispersed in a dielectric fluid in the electrophoretic cell. At least one of the first electrode and the second electrode may be transparent.

公开(公告)号：US20180136696A1

公开(公告)日：2018-05-17

申请号：US15563967

申请日：2015-05-04

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： WEI-CHUNG CHEN ,  WEI-KUANG CHU ,  CHI-HAO CHANG ,  KUAN-TING WU ,  CHENG-FENG LIAO ,  CHARLIE KU ,  kUN CHIH WANG

IPC: G06F1/16 ,  H04M1/02

CPC classification number: G06F1/1652 ,  G06F1/1681 ,  H04M1/0216 ,  H04M1/022

Abstract: Examples of a hinge for foldable components are described herein. In an example, the hinge can include a plurality of bracing elements, a bracing element from the plurality of bracing elements can be operably coupled to an adjacent bracing element from the plurality of bracing elements, to fold the plurality of bracing elements into an arcuate shape. Each bracing element can be supported and locked against the adjacent bracing element in the arcuate shape. The hinge can further include an end coupler at each longitudinal end of the hinge to couple the hinge to a flexible element.