公开(公告)号：US20070200127A1

公开(公告)日：2007-08-30

申请号：US11689868

申请日：2007-03-22

申请人： Peter Andrews ,  Ban Loh

发明人： Peter Andrews ,  Ban Loh

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A light emitting die package is provided which includes a metal substrate having a first surface and a first conductive lead on the first surface. The first conductive lead is insulated from the substrate by an insulating film. The first conductive lead forms a mounting pad for mounting a light emitting device. The package includes a metal lead electrically connected to the first conductive lead and extending away from the first surface.

摘要翻译： 提供一种发光管芯封装，其包括在第一表面上具有第一表面和第一导电引线的金属基板。 第一导电引线通过绝缘膜与基板绝缘。 第一导电引线形成用于安装发光器件的安装焊盘。 该封装包括电连接到第一导电引线并远离第一表面延伸的金属引线。

公开(公告)号：US20070164454A1

公开(公告)日：2007-07-19

申请号：US11334922

申请日：2006-01-19

申请人： Peter Andrews

发明人： Peter Andrews

IPC分类号： H01L23/48

CPC分类号： H05K3/4685 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/3025 ,  H05K1/095 ,  H05K1/142 ,  H05K3/1241 ,  H05K3/321 ,  H05K3/4664 ,  H05K2203/0126 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic device includes a substrate, an electrical element on the substrate, a nonconductive adhesive material on the substrate, and a conductive adhesive material on the electrical element and extending onto the nonconductive adhesive material. Methods of forming a packaged LED include providing a substrate having an electrical element thereon, and dispensing a nonconductive adhesive material on the substrate. The nonconductive adhesive material is at least partially cured, and a conductive adhesive material is dispensed on the electrical element and on the at least partially cured nonconductive material. The conductive adhesive material is at least partially cured. The conductive adhesive material may provide an electrical connection between the electrical element and a second electrical element on the substrate or on another substrate.

摘要翻译： 电子设备包括基板，基板上的电气元件，基板上的非导电粘合剂材料，以及电气元件上的导电粘合剂材料并延伸到非导电粘合剂材料上。 形成封装的LED的方法包括提供其上具有电元件的基板，以及在基板上分配非导电粘合剂材料。 非导电粘合剂材料至少部分固化，并且导电粘合剂材料分配在电气元件上以及至少部分固化的非导电材料上。 导电粘合剂材料至少部分固化。 导电粘合剂材料可以在电气元件和衬底上或另一衬底上的第二电气元件之间提供电连接。

公开(公告)号：US20070161137A1

公开(公告)日：2007-07-12

申请号：US11688605

申请日：2007-03-20

申请人： David Slater ,  Bradley Williams ,  Peter Andrews ,  John Edmond ,  Scott Allen

发明人： David Slater ,  Bradley Williams ,  Peter Andrews ,  John Edmond ,  Scott Allen

IPC分类号： H01L21/00

CPC分类号： H01L33/60 ,  H01L33/20 ,  H01L33/32 ,  H01L33/405 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/01057 ,  H01L2924/12041 ,  H01L2924/00

摘要： Semiconductor light emitting devices, such as light emitting diodes, include a substrate, an epitaxial region on the substrate that includes a light emitting region such as a light emitting diode region, and a multilayer conductive stack including a reflector layer, on the epitaxial region. A barrier layer is provided on the reflector layer and extending on a sidewall of the reflector layer. The multilayer conductive stack can also include an ohmic layer between the reflector and the epitaxial region. The barrier layer further extends on a sidewall of the ohmic layer. The barrier layer can also extend onto the epitaxial region outside the multilayer conductive stack. The barrier layer can be fabricated as a series of alternating first and second sublayers.

摘要翻译： 诸如发光二极管的半导体发光器件包括衬底，在衬底上的包括诸如发光二极管区域的发光区域的外延区域和在外延区域上包括反射器层的多层导电堆叠。 阻挡层设置在反射器层上并在反射器层的侧壁上延伸。 多层导电叠层还可以包括在反射器和外延区之间的欧姆层。 阻挡层进一步在欧姆层的侧壁上延伸。 阻挡层还可以延伸到多层导电叠层外的外延区域上。 阻挡层可以制成一系列交替的第一和第二子层。

公开(公告)号：US20070115013A1

公开(公告)日：2007-05-24

申请号：US11655605

申请日：2007-01-19

申请人： Peter Andrews ,  Brad Froemke ,  John Dunklee

发明人： Peter Andrews ,  Brad Froemke ,  John Dunklee

IPC分类号： G01R31/02

CPC分类号： G01R31/2887

摘要： An improved chuck with lift pins within a probe station.

公开(公告)号：US20060167237A1

公开(公告)日：2006-07-27

申请号：US10524048

申请日：2003-08-08

申请人： Michael West ,  Peter Andrews ,  Tracie Ramsdale ,  Wim Meutermans ,  Giang Thanh Le ,  Chris Clark ,  Giovanni Abbenante ,  Ligong Liu

发明人： Michael West ,  Peter Andrews ,  Tracie Ramsdale ,  Wim Meutermans ,  Giang Thanh Le ,  Chris Clark ,  Giovanni Abbenante ,  Ligong Liu

IPC分类号： C07H5/04

CPC分类号： C07H23/00 ,  C07H5/06 ,  C07H15/18

摘要： New compounds and methods for the preparation of combinatorial libraries of potentially biologically active compounds are based on monosaccharides of formula I being a derivative of a furanose or pyranose form of a monosaccharide,

摘要翻译： 用于制备潜在生物活性化合物的组合文库的新化合物和方法基于式I的单糖，其为呋喃糖或吡喃糖形式的单糖衍生物，

公开(公告)号：US20060079082A1

公开(公告)日：2006-04-13

申请号：US11273008

申请日：2005-11-14

申请人： Michael Bruhns ,  Brad Williams ,  Jeff LaHaye ,  Peter Andrews

发明人： Michael Bruhns ,  Brad Williams ,  Jeff LaHaye ,  Peter Andrews

IPC分类号： H01L21/4763

CPC分类号： H01L33/20 ,  H01L33/0095 ,  H01L2224/48463 ,  H01L2224/73265

摘要： A method is provided for forming semiconductor devices using a semiconductor substrate having first and second opposed sides, and at least one device layer on the second side of the substrate, the at least one device layer including first and second device portions. A first trench is formed in the first side of the substrate between the first and second device portions. A second trench is formed in the second side of the substrate between the first and second device portions.

摘要翻译： 提供了一种使用具有第一和第二相对侧的半导体衬底形成半导体器件的方法，以及在衬底的第二侧上的至少一个器件层，所述至少一个器件层包括第一和第二器件部分。 第一沟槽形成在第一和第二器件部分之间的衬底的第一侧。 第二沟槽形成在第一和第二器件部分之间的衬底的第二侧。

公开(公告)号：US07008861B2

公开(公告)日：2006-03-07

申请号：US10733845

申请日：2003-12-11

申请人： Peter Andrews ,  Elbert Brown ,  Gerald H. Negley

发明人： Peter Andrews ,  Elbert Brown ,  Gerald H. Negley

IPC分类号： H01L21/301 ,  H01L23/00

CPC分类号： H01L21/78 ,  B23K26/3568 ,  B23K26/359 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D1/221 ,  B28D5/0011 ,  H01L33/0095 ,  H01L2924/10155

摘要： A method for forming semiconductor devices using a semiconductor substrate having first and second opposed surfaces and including first and second device regions includes directing a beam of laser light at the substrate such that the beam of laser light is focused within the substrate between the first and second surfaces thereof and the beam of laser light forms a thermally weakened zone (TWZ) in the substrate. The TWZ extends between the first and second device regions and defines a break line.

摘要翻译： 使用具有第一和第二相对表面并且包括第一和第二器件区域的半导体衬底形成半导体器件的方法包括将激光束引导到衬底，使得激光束聚焦在衬底内的第一和第二 其表面和激光束在衬底中形成热弱化区（TWZ）。 TWZ在第一和第二装置区域之间延伸并且限定断裂线。

公开(公告)号：US20050202428A1

公开(公告)日：2005-09-15

申请号：US10504173

申请日：2003-02-12

申请人： Peter Andrews ,  James Walsh ,  Paul Gokhale

发明人： Peter Andrews ,  James Walsh ,  Paul Gokhale

IPC分类号： A61K35/12 ,  A61K38/00 ,  C12N5/0735 ,  C12N15/113 ,  C12Q1/68 ,  C07H21/02 ,  C12N5/08 ,  C12N15/85

CPC分类号： C12N5/0606 ,  A61K35/12 ,  A61K38/00 ,  C12N15/113 ,  C12N2310/14 ,  C12N2310/53 ,  C12N2510/00

摘要： We describe a method to manipulate the phenotype of stem cells, preferably pluripotential stem cells including nucleic acids and vectors used in said methods.

摘要翻译： 我们描述了一种操纵干细胞表型的方法，优选多能干细胞，包括用于所述方法的核酸和载体。

公开(公告)号：US20050194603A1

公开(公告)日：2005-09-08

申请号：US11039566

申请日：2005-01-20

申请人： David Slater ,  Bradley Williams ,  Peter Andrews ,  John Edmond ,  Scott Allen

发明人： David Slater ,  Bradley Williams ,  Peter Andrews ,  John Edmond ,  Scott Allen

IPC分类号： H01L33/20 ,  H01L33/40 ,  H01L33/44 ,  H01L33/62 ,  H01L21/00 ,  H01L33/00

CPC分类号： H01L33/60 ,  H01L33/20 ,  H01L33/32 ,  H01L33/405 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/01057 ,  H01L2924/12041 ,  H01L2924/00

摘要： Semiconductor light emitting devices, such as light emitting diodes, include a substrate, an epitaxial region on the substrate that includes a light emitting region such as a light emitting diode region, and a multilayer conductive stack including a reflector layer, on the epitaxial region. A barrier layer is provided on the reflector layer and extending on a sidewall of the reflector layer. The multilayer conductive stack can also include an ohmic layer between the reflector and the epitaxial region. The barrier layer further extends on a sidewall of the ohmic layer. The barrier layer can also extend onto the epitaxial region outside the multilayer conductive stack. The barrier layer can be fabricated as a series of alternating first and second sublayers.

摘要翻译： 诸如发光二极管的半导体发光器件包括衬底，在衬底上的包括诸如发光二极管区域的发光区域的外延区域和在外延区域上包括反射器层的多层导电堆叠。 阻挡层设置在反射器层上并在反射器层的侧壁上延伸。 多层导电叠层还可以包括在反射器和外延区之间的欧姆层。 阻挡层进一步在欧姆层的侧壁上延伸。 阻挡层还可以延伸到多层导电叠层外的外延区域上。 阻挡层可以制成一系列交替的第一和第二子层。

公开(公告)号：US20050121686A1

公开(公告)日：2005-06-09

申请号：US10987894

申请日：2004-11-12

申请人： Bernd Keller ,  James Ibbetson ,  Peter Andrews ,  Gerald Negley ,  Norbert Hiller

发明人： Bernd Keller ,  James Ibbetson ,  Peter Andrews ,  Gerald Negley ,  Norbert Hiller

IPC分类号： H01L25/16 ,  H01L29/22 ,  H01L33/50 ,  H01S5/022 ,  H01S5/323

CPC分类号： H01L33/507 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in the cavity to couple to a first node of a light emitting device received in the cavity. A second bond pad is positioned in the cavity to couple to a second node of a light emitting device positioned therein. Light emitting devices including a solid wavelength conversion member and methods for forming the same are also provided.

摘要翻译： 半导体发光器件的基座包括其中具有腔室的半导体衬底，其配置为接收发光器件。 第一接合焊盘定位在空腔中以耦合到容纳在空腔中的发光器件的第一节点。 第二接合焊盘定位在空腔中以耦合到定位在其中的发光器件的第二节点。 还提供了包括固体波长转换元件的发光器件及其形成方法。