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38 条记录 (耗时 0.054 秒)

    Polishing apparatus
    22.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US5549502A

    公开(公告)日：1996-08-27

    申请号：US162679

    申请日：1993-12-06

    申请人： Kohichi Tanaka ,  Hiromasa Hashimoto ,  Yasuo Inada ,  Makoto Nakajima

    发明人： Kohichi Tanaka ,  Hiromasa Hashimoto ,  Yasuo Inada ,  Makoto Nakajima

    IPC分类号： B24B37/34 ,  B24B1/00

    CPC分类号： B24B37/345

    摘要： A grinding method and apparatus having a position aligning mechanism to correctly achieve the centering of each work on a work table and locate an orientation flat part of each work at a predetermined position, and a displacing mechanism for reciprocally slidably displacing a top ring and the work table in order to assure that the center of each work is positionally aligned with the center of each top ring at an original position after completion of the centering of each work on the work table and the locating of the orientation flat part, and subsequently, centering each top ring with the gravitational center of each work so as to cancel a positional offset state prior to holding the work with the top ring to thrust the work against the grinding or polishing surface. The invention also includes a polishing method and apparatus in which both of a top ring and a rotary disc are reciprocally slidably displaced to improve the polishing efficiency of the device.

    摘要翻译： 一种磨削方法和装置，其具有位置对准机构，以正确地实现每个工件在工作台上的对中并将每个工件的定向平面部分定位在预定位置，以及位移机构，用于可往复地滑动地移动顶环和工件 以确保每个工件的中心在完成每个工件在工作台上的定心和定位平面部分的定位之后在原始位置与每个顶环的中心位置对准，然后定心 每个顶环具有每个工件的重力中心，以便在用顶环保持工件之前取消位置偏移状态，以将工件推向研磨或抛光表面。 本发明还包括抛光方法和装置，其中顶环和旋转盘都可往复滑动地移位，以提高装置的抛光效率。

    Method of chucking semiconductor wafers
    23.
    发明授权
    Method of chucking semiconductor wafers 失效
    夹紧半导体晶片的方法

    公开(公告)号：US5335457A

    公开(公告)日：1994-08-09

    申请号：US966484

    申请日：1992-10-26

    申请人： Akira Matsuda ,  Shigeki Shudo ,  Noboru Shimamoto ,  Kohichi Tanaka ,  Hiromasa Hashimoto ,  Fumio Suzuki

    发明人： Akira Matsuda ,  Shigeki Shudo ,  Noboru Shimamoto ,  Kohichi Tanaka ,  Hiromasa Hashimoto ,  Fumio Suzuki

    IPC分类号： B24B37/04 ,  B24B37/30 ,  H01L21/304 ,  H01L21/683 ,  B24B7/22

    CPC分类号： H01L21/6838

    摘要： A method of chucking semiconductor wafers, in which a silicone elastic layer with high flatness is formed on the surface of a hard substrate having fine through-holes for vacuum chucking. Next fine through-holes in the silicone elastic layer, are provided, each through-hole communicating with the fine through-holes of the hard substrate. Next a semi-conductor wafer is held on the hard substrate by vacuum chucking from the back side of the substrate, so as to hold the semiconductor wafer securely on the substrate only by surface adhesion of the silicone elastic layer during polishing of the wafer. This method does not require wax or similar adhesive for holding the semiconductor wafer on the hard surface during the polishing process, and can realize a high-precision and high-quality surface polishing process for the semiconductor wafers.

    摘要翻译： 一种夹持半导体晶片的方法，其中在具有用于真空吸附的精细通孔的硬质基板的表面上形成具有高平坦度的硅氧烷弹性层。 在硅弹性层中的下一个细小的通孔中，每个通孔与硬质基底的细通孔相通。 接下来，半导体晶片通过从基板的背面真空夹持而保持在硬质基板上，以便仅在晶片抛光期间通过硅树脂弹性层的表面粘合将半导体晶片牢固地保持在基板上。 该方法不需要在抛光过程中将半导体晶片保持在硬表面上的蜡或类似的粘合剂，并且可以实现用于半导体晶片的高精度和高质量的表面抛光工艺。

    Polishing head and polishing apparatus
    24.
    发明授权
    Polishing head and polishing apparatus 有权
    抛光头和抛光装置

    公开(公告)号：US09278425B2

    公开(公告)日：2016-03-08

    申请号：US13522370

    申请日：2011-01-20

    申请人： Hiromasa Hashimoto ,  Kouji Morita ,  Takashi Aratani ,  Hiromi Kishida ,  Satoru Arakawa

    发明人： Hiromasa Hashimoto ,  Kouji Morita ,  Takashi Aratani ,  Hiromi Kishida ,  Satoru Arakawa

    IPC分类号： B24B37/30 ,  B24B37/32 ,  H01L21/02

    CPC分类号： B24B37/30 ,  B24B37/32 ,  H01L21/02024

    摘要： A polishing head including, below a polishing head body, a rubber film held by a disk-shaped mid plate and an annular guide ring disposed around the rubber film holding the back surface of the workpiece on a lower face portion of the rubber film. The polishing head also includes a base member that is coupled to a polishing head body through an elastic film and holds the guide ring and the mid plate such that the lower surface of the guide ring does not contact the polishing pad during polishing. The polishing head and polishing apparatus, are operable in both of the rough polishing process and final polishing process, that can stably achieve predetermined high flatness and high polishing stock removal uniformity in polishing of a workpiece and can obtain a workpiece with fewer fine particles having a diameter of 45 nm or more.

    摘要翻译： 一种抛光头，其包括在抛光头本体下面的由盘形中间板保持的橡胶膜和设置在橡胶膜周围的橡胶膜周围的环形引导环，橡胶膜在橡胶膜的下表面部分上保持工件的后表面。 抛光头还包括通过弹性膜联接到抛光头本体并且保持引导环和中间板的基部构件，使得在抛光期间导向环的下表面不接触抛光垫。 抛光头和抛光装置可以在粗抛光工艺和最终抛光工艺中操作，可以稳定地实现工件抛光中预定的高平整度和高抛光余料去除均匀性，并且可以获得具有更少的具有 直径为45nm以上。

    System and method for file processing and file processing program
    25.
    发明授权
    System and method for file processing and file processing program 有权
    文件处理和文件处理程序的系统和方法

    公开(公告)号：US08307408B2

    公开(公告)日：2012-11-06

    申请号：US12095392

    申请日：2007-06-15

    申请人： Hiromasa Hashimoto ,  Tateki Harada

    发明人： Hiromasa Hashimoto ,  Tateki Harada

    IPC分类号： G06F21/00

    CPC分类号： G06F21/6209

    摘要： A cipher processing system for allowing file access while maintaining the integrity without a user being aware of the difference between files when the user accesses a file in a folder containing both a ciphertext file and a plaintext file. If a folder stores both a ciphertext file and a plaintext file, the ciphertext file is attached with identification information (preferably, footer information) indicating that the file is a ciphertext file, so that a plaintext file and a ciphertext file can be differentiated from each other when the files are read. A deciphered file gained by removing identification information from a ciphertext file and deciphering the file is delivered to an upper-level application. If the read file is a plaintext file, decipher processing is not executed on the plaintext file but the plaintext file is passed to the upper-level application program.

    摘要翻译： 一种密码处理系统，用于当用户访问包含密文文件和明文文件的文件夹中的文件时，允许文件访问，同时保持完整性，而不用户不知道文件之间的差异。 如果文件夹存储密文文件和明文文件，则密文文件附有指示文件是密文文件的标识信息（优选地，脚注信息），使得可以从每个文件中区分明文文件和密文文件 其他文件读取时。 通过从密文文件中移除识别信息并解密文件获得的解密文件被传送到上级应用程序。 如果读取的文件是明文文件，则不对明文文件执行解密处理，而是将明文文件传递给上级应用程序。

    Control apparatus and control method for internal combustion engine
    27.
    发明授权
    Control apparatus and control method for internal combustion engine 失效
    内燃机控制装置及控制方法

    公开(公告)号：US06883324B2

    公开(公告)日：2005-04-26

    申请号：US10802946

    申请日：2004-03-18

    申请人： Osamu Igarashi ,  Koichi Akita ,  Shoji Sasaki ,  Hiromasa Hashimoto

    发明人： Osamu Igarashi ,  Koichi Akita ,  Shoji Sasaki ,  Hiromasa Hashimoto

    IPC分类号： F02B33/44 ,  F02B33/40 ,  F02B37/04 ,  F02B37/12 ,  F02B37/24 ,  F02B39/10 ,  F02B39/16 ,  F02D23/00 ,  F02D41/00

    CPC分类号： F02B39/10 ,  F02B33/40 ,  F02B37/04 ,  F02B37/24 ,  F02B39/16 ,  F02D41/0007 ,  F02D41/187 ,  F02D2041/2027 ,  F02D2200/0404 ,  F02D2200/0406 ,  F02D2200/602 ,  Y02T10/144

    摘要： A control apparatus for an internal combustion engine in accordance with the invention includes a supercharger, a bypass passage, a flow amount adjustment device, an operational state detection portion, and a driving time determination portion. The supercharger is connected to an intake passage of an internal combustion engine and is driven by a motor. The bypass passage is provided for the intake passage in such a manner as to bypass the supercharger. By being driven electrically, the flow amount adjustment device can arbitrarily adjust a flow amount of air flowing through the bypass passage. The operational state detection portion detects an operational state of the internal combustion engine. The driving time determination portion determines a time at which the flow rate adjustment device is driven based on a result of detection performed by the operational state detection portion.

    摘要翻译： 根据本发明的用于内燃机的控制装置包括增压器，旁通通道，流量调节装置，操作状态检测部分和行驶时间确定部分。 增压器连接到内燃机的进气通道并由马达驱动。 旁路通道为进气通道以旁路增压器的方式设置。 通过电动驱动，流量调节装置可以任意地调节流过旁路通路的空气的流量。 操作状态检测部检测内燃机的运转状态。 驾驶时间确定部分基于由操作状态检测部分执行的检测结果来确定驱动流量调节装置的时间。

    Heterocyclic aromatic oxazole compounds and use thereof
    29.
    发明授权
    Heterocyclic aromatic oxazole compounds and use thereof 失效
    杂环芳族恶唑化合物及其用途

    公开(公告)号：US06362209B1

    公开(公告)日：2002-03-26

    申请号：US09398997

    申请日：1999-09-17

    申请人： Junichi Haruta ,  Hiromasa Hashimoto ,  Mutsuyoshi Matsushita

    发明人： Junichi Haruta ,  Hiromasa Hashimoto ,  Mutsuyoshi Matsushita

    IPC分类号： A61K3142

    CPC分类号： C07D413/04 ,  C07C45/004 ,  C07C49/567 ,  C07C49/813 ,  C07C69/007 ,  C07C233/31 ,  C07C233/47 ,  C07C251/42 ,  C07C311/16 ,  C07C311/29 ,  C07C311/32 ,  C07C311/37 ,  C07C317/24 ,  C07C317/32 ,  C07C2601/14 ,  C07D263/32

    摘要： A heterocyclic aromatic oxazole compound of the formula (I) wherein Z is an oxygen atom; one of R and R1 is a group of the formula wherein R3 is lower alkyl, amino or lower alkylamino, and R4, R5, R6 and R7 are the same or different and each is hydrogen atom, halogen atom, lower alkyl, lower alkoxy, trifluoromethyl, hydroxy or amino, provided that at least one of R4, R5, R6 and R7 is not hydrogen atom, and the other is an optionally substituted cycloalkyl, an optionally substituted heterocyclic group or an optionally substituted aryl; and R2 is a lower alkyl or a halogenated lower alkyl, and a pharmaceutically acceptable salt thereof. The heterocyclic aromatic oxazole compound and pharmaceutically acceptable salts thereof have antipyretic action, analgesic action, anti-inflammatory action, and particularly, selective inhibitory action on cyclooxygenase-2 (COX-2), and are expected to be useful as anti-inflammatory agents with less side-effects such as digestive tract disorders.

    摘要翻译： 式（I）的杂环芳族恶唑化合物，其中Z是氧原子; R和R中的一个是一个基团，其中R 3是低级烷基，氨基或低级烷基氨基，R 4，R 5，R 6和R 7相同或不同，各自为氢原子，卤素原子，低级烷基，低级烷氧基，三氟甲基 ，羟基或氨基，条件是R 4，R 5，R 6和R 7中的至少一个不是氢原子，另一个是任选取代的环烷基，任选取代的杂环基或任选取代的芳基; 和R2是低级烷基或卤代低级烷基，及其药学上可接受的盐。 杂芳基恶唑化合物及其药学上可接受的盐具有解热作用，止痛作用，抗炎作用，特别是对环氧合酶-2（COX-2）的选择性抑制作用，并且预期可用作抗炎剂， 较少的副作用如消化道疾病。

    Fuel injection apparatus and method for direct injection type engines
    30.
    发明授权
    Fuel injection apparatus and method for direct injection type engines 失效
    直喷式发动机燃油喷射装置及方法

    公开(公告)号：US5941209A

    公开(公告)日：1999-08-24

    申请号：US992480

    申请日：1997-12-17

    申请人： Hiromasa Hashimoto

    发明人： Hiromasa Hashimoto

    IPC分类号： F02M55/02 ,  F02B75/12 ,  F02D37/02 ,  F02D41/02 ,  F02D41/04 ,  F02D41/06 ,  F02D41/30 ,  F02D41/32 ,  F02D41/34 ,  F02D41/38 ,  F02D45/00 ,  F02M69/04 ,  F02B17/00

    CPC分类号： F02D41/3818 ,  F02D37/02 ,  F02D41/062 ,  F02D41/32 ,  F02D41/345 ,  F02B2075/125 ,  F02D2041/389 ,  F02D41/3029 ,  Y02T10/123 ,  Y02T10/44

    摘要： An improved controller for controlling fuel injection in an internal combustion engine. The engine includes a fuel injection valve for directly injecting fuel into a combustion chamber. A fuel pressure sensor detects the fuel pressure within the injection valve. An ECU computes opening time of the injection valve and closing time of the injection valve based on a required fuel injection amount. The ECU computes a reference time at which the pressure in the combustion chamber reaches the injection pressure of the injection valve based on the detected fuel pressure. If necessary, the ECU advances the computed opening time and the computed closing time. As a result, the fuel injection from the injection valve is finished before the reference time. This prevents matter inside the combustion chamber from entering the fuel injection valve, and it guarantees that fuel will be able to exit the fuel injection valve during injection.

    摘要翻译： 一种用于控制内燃机中的燃料喷射的改进的控制器。 发动机包括用于将燃料直接喷射到燃烧室中的燃料喷射阀。 燃料压力传感器检测喷射阀内的燃料压力。 ECU根据所需的燃料喷射量计算喷射阀的打开时间和喷射阀的关闭时间。 ECU根据检测到的燃料压力计算燃烧室内的压力达到喷射阀的喷射压力的参考时间。 如有必要，ECU将提前计算的打开时间和计算的关闭时间。 结果，在基准时间之前完成从喷射阀的燃料喷射。 这样可以防止燃烧室内的物质进入燃料喷射阀，并保证燃油在喷射过程中能够离开燃油喷射阀。