公开(公告)号：US20160274621A1

公开(公告)日：2016-09-22

申请号：US14778070

申请日：2014-11-12

Applicant: INTEL CORPORATION

Inventor： Thorsten Meyer ,  Dirk Plenkers ,  Hans-Joachim Barth ,  Bernd Waidhas ,  Yen Hsiang Chew ,  Kooi Chi Ooi ,  Howe Yin Loo

IPC: G06F1/16 ,  B29C65/48 ,  B29C39/02 ,  B29C39/10 ,  G02C11/00 ,  G02C5/14

CPC classification number: G06F1/163 ,  B29C39/021 ,  B29C39/10 ,  B29C65/4825 ,  B29L2031/3481 ,  G02C5/143 ,  G02C11/10

Abstract: Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the user's skin in the portion of the user's body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the user's body, the second electrode is arranged to not contact the user's skin in the portion of the user's body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.

Abstract translation: 可穿戴式电子设备，其组件以及相关系统和技术的实施例在此公开。 例如，可穿戴电子设备可以包括具有第一表面和第二表面的可穿戴支撑结构; 位于所述第一表面的第一电极，其中当所述可穿戴电子设备被所述用户佩戴在所述用户身体的一部分上时，所述第一电极布置成在所述用户身体的所述部分中接触所述用户的皮肤; 位于所述第二表面的第二电极，其中，当所述可佩戴的电子装置被使用者佩戴在所述使用者身体的所述部分上时，所述第二电极被布置成在所述使用者身体的所述部分中不接触所述使用者的皮肤; 以及电阻开关，其具有分别耦合到第一和第二电极的第一和第二输入端子。 可以公开和/或要求保护其他实施例。

公开(公告)号：US09904321B2

公开(公告)日：2018-02-27

申请号：US14778070

申请日：2014-11-12

Applicant: INTEL CORPORATION

Inventor： Thorsten Meyer ,  Dirk Plenkers ,  Hans-Joachim Barth ,  Bernd Waidhas ,  Yen Hsiang Chew ,  Kooi Chi Ooi ,  Howe Yin Loo

IPC: G06F1/16 ,  B29C39/02 ,  B29C39/10 ,  B29C65/48 ,  G02C5/14 ,  G02C11/00 ,  B29L31/34

CPC classification number: G06F1/163 ,  B29C39/021 ,  B29C39/10 ,  B29C65/4825 ,  B29L2031/3481 ,  G02C5/143 ,  G02C11/10

Abstract: Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the user's skin in the portion of the user's body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the user's body, the second electrode is arranged to not contact the user's skin in the portion of the user's body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.

公开(公告)号：US20170271594A1

公开(公告)日：2017-09-21

申请号：US15614306

申请日：2017-06-05

Applicant: INTEL CORPORATION

Inventor： Hans-Joachim Barth

IPC: H01L51/00 ,  H01L21/48 ,  H01L21/768 ,  H01L23/14 ,  H01L23/498 ,  H01L23/522 ,  H01L23/532 ,  H01L23/00 ,  H01L23/64 ,  H01L29/16

CPC classification number: H01L51/0048 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/768 ,  H01L21/76805 ,  H01L21/76849 ,  H01L21/76852 ,  H01L21/76879 ,  H01L23/147 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49872 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/53276 ,  H01L23/645 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L29/1606 ,  H01L2221/1094 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for hybrid carbon-metal interconnect structures in integrated circuit assemblies. In one embodiment, an apparatus includes a substrate, a metal interconnect layer disposed on the substrate and configured to serve as a growth initiation layer for a graphene layer and the graphene layer, wherein the graphene layer is formed directly on the metal interconnect layer, the metal interconnect layer and the graphene layer being configured to route electrical signals. Other embodiments may be described and/or claimed.

公开(公告)号：US09627804B2

公开(公告)日：2017-04-18

申请号：US14578187

申请日：2014-12-19

Applicant: Intel Corporation

Inventor： Hans-Joachim Barth ,  Bastiaan Elshof ,  Jan Proschwitz

IPC: H01R33/00 ,  H01R13/627 ,  A41D1/00 ,  A44B17/00

CPC classification number: H01R33/00 ,  A41D1/005 ,  A44B17/0023 ,  A44B17/0064 ,  H01R4/64 ,  H01R13/627 ,  H01R13/6273 ,  H01R13/6277

Abstract: Embodiments are generally directed to a snap button fastener providing electrical connection. An embodiment of a fastener includes a first mechanical part, the first mechanical part including at least a stud portion, the first mechanical part including a first electrical connector; a second mechanical part, the second mechanical part including at least a socket portion with a spring element and the socket portion, the second mechanical part including a second electrical connector. The stud portion of the first mechanical part and the socket portion of second mechanical part, if separated, are to interlock upon the application of a first force towards each other, and, if interlocked, to separate upon the application of a second force away from each other. The first electrical connector and the second electrical connector are to be electrically connected when the first mechanical part and the mechanical part are interlocked, and first electrical connector and the second electrical connector are to be disconnected when the first mechanical part and second mechanical part are separated.

公开(公告)号：US09515049B2

公开(公告)日：2016-12-06

申请号：US14368434

申请日：2013-12-19

Applicant: Intel Corporation

Inventor： Sven Albers ,  Michael Skinner ,  Hans-Joachim Barth ,  Peter Baumgartner ,  Harald Gossner

IPC: H01L25/065 ,  H01L23/552 ,  H01L23/522 ,  H01L29/06 ,  H01L23/00 ,  H01L27/02

CPC classification number: H01L25/0652 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/552 ,  H01L23/562 ,  H01L23/564 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L25/065 ,  H01L25/0657 ,  H01L27/0207 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/16105 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/481 ,  H01L2224/48106 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48482 ,  H01L2224/49 ,  H01L2224/73257 ,  H01L2224/81001 ,  H01L2224/81007 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/85801 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06551 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/19104 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/014 ,  H01L2924/00012

Abstract: Embodiments of a flexibly-wrapped integrated circuit die device and a method for mounting a flexibly-wrapped integrated circuit die to a substrate are disclosed. In some embodiments, the flexibly-wrapped integrated circuit die device includes a substrate and a flexible integrated circuit die coupled to the substrate in a substantially vertical orientation with reference to a surface of the substrate.

Abstract translation: 公开了一种柔性包裹的集成电路管芯器件的实施例和用于将柔性封装的集成电路管芯安装到衬底的方法。 在一些实施例中，柔性包裹的集成电路管芯器件包括基板和柔性集成电路管芯，所述基板和基板相对于基板的表面以基本垂直的取向联接到基板。

公开(公告)号：US09209136B2

公开(公告)日：2015-12-08

申请号：US13854449

申请日：2013-04-01

Applicant: INTEL CORPORATION

Inventor： Hans-Joachim Barth

IPC: H01L21/768 ,  H01L23/532 ,  H01L23/14 ,  H01L23/64 ,  H01L23/00 ,  H01L29/16 ,  H01L23/498

CPC classification number: H01L51/0048 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/768 ,  H01L21/76805 ,  H01L21/76849 ,  H01L21/76852 ,  H01L21/76879 ,  H01L23/147 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49872 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/53276 ,  H01L23/645 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L29/1606 ,  H01L2221/1094 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for hybrid carbon-metal interconnect structures in integrated circuit assemblies. In one embodiment, an apparatus includes a substrate, a metal interconnect layer disposed on the substrate and configured to serve as a growth initiation layer for a graphene layer and the graphene layer, wherein the graphene layer is formed directly on the metal interconnect layer, the metal interconnect layer and the graphene layer being configured to route electrical signals. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及集成电路组件中的混合碳 - 金属互连结构的技术和配置。 在一个实施例中，一种装置包括衬底，设置在衬底上并被配置为用作石墨烯层和石墨烯层的生长起始层的金属互连层，其中石墨烯层直接形成在金属互连层上， 金属互连层和石墨烯层被配置为路由电信号。 可以描述和/或要求保护其他实施例。