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    LIQUID-COOLED, COMPOSITE HEAT SINK ASSEMBLIES
    22.
    发明申请
    LIQUID-COOLED, COMPOSITE HEAT SINK ASSEMBLIES 审中-公开
    液体冷却，复合散热装置

    公开(公告)号：US20170043437A1

    公开(公告)日：2017-02-16

    申请号：US14922338

    申请日：2015-10-26

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Dylan J. BODAY ,  Levi A. CAMPBELL ,  Milnes P. DAVID ,  Dustin W. DEMETRIOU ,  Michael J. ELLSWORTH, JR. ,  Roger R. SCHMIDT ,  Robert E. SIMONS ,  Prabjit SINGH ,  Jason T. WERTZ

    IPC: B23P15/26

    CPC classification number: B23P15/26 ,  B23P2700/10 ,  F28F3/02 ,  F28F3/12 ,  H01L23/473 ,  H01L23/4735 ,  H05K7/20254 ,  H05K7/20772

    Abstract: A method of fabricating a liquid-cooled heat sink assembly, including: providing a heat transfer element including a heat transfer base having opposite first and second sides, and a plurality of thermally conductive fins extending from the first side of the heat transfer base, the second side of the heat transfer base to couple to a component(s) to be cooled; providing a coolant-carrying structure including a coolant-carrying base and a coolant-carrying compartment through which liquid coolant flows, the coolant-carrying base including a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins of the heat sink base to extend through; and attaching the heat transfer element and coolant-carrying structure together with the plurality of thermally conductive fins extending through the fin-receiving openings in the coolant-carrying base into the coolant-carrying compartment.

    Abstract translation: 一种制造液冷式散热器组件的方法，包括：提供包括具有相对的第一和第二侧的传热基底的传热元件和从所述传热基体的第一侧延伸的多个导热翅片， 传热基座的第二侧以耦合到待冷却的部件; 提供一种冷却剂承载结构，其包括冷却剂承载基座和液体冷却剂流过的冷却剂输送室，所述冷却剂承载基座包括多个翅片接收开口，所述多个翅片接收开口的大小和位置用于多个导热翅片的热量 水槽底部延伸穿过; 以及将传热元件和冷却剂承载结构连同多个导热翅片连接在一起，所述导热翼片延伸穿过冷却剂承载基座中的翼片接收开口进入冷却剂携带舱室。

    RELEASABLE, THREADLESS CONDUIT CONNECTOR FOR LIQUID MANIFOLD
    24.
    发明申请
    RELEASABLE, THREADLESS CONDUIT CONNECTOR FOR LIQUID MANIFOLD 有权
    可拆卸的，用于液体歧管的无螺纹连接器

    公开(公告)号：US20160061364A1

    公开(公告)日：2016-03-03

    申请号：US14469891

    申请日：2014-08-27

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Thomas J. BRUNSCHWILER ,  Evan G. COLGAN ,  Michael J. ELLSWORTH, JR. ,  Gerd SCHLOTTIG

    IPC: F16L21/03 ,  F28F1/00

    CPC classification number: F16L21/03 ,  F16L37/0985 ,  F16L37/138 ,  F28F1/00 ,  F28F3/12 ,  F28F9/0258 ,  F28F9/027

    Abstract: Conduit connectors for liquid manifolds and methods of fabrication are provided. In one embodiment, a conduit connector is integrated, at least in part, within a liquid manifold, and includes a conduit-receiving opening or socket and at least one releasable retention component. The conduit-receiving opening is disposed within the liquid manifold and in fluid communication with at least one liquid-carrying channel of the liquid manifold. The releasable retention component(s) is selectively operative to threadlessly secure in a fluid-tight manner a conduit within the conduit-receiving opening in fluid communication with the at least one liquid-carrying channel of the liquid manifold to facilitate flow of liquid through the liquid-carrying channel(s), or to release the conduit from the conduit-receiving opening of the conduit connector. The releasable retention component(s) resides at least partially within the liquid manifold when operatively holding the conduit within the conduit-receiving opening.

    Abstract translation: 提供了用于液体歧管的管道连接器和制造方法。 在一个实施例中，导管连接器至少部分地集成在液体歧管内，并且包括导管接收开口或插座和至少一个可释放的保持部件。 导管接收开口设置在液体歧管内并与液体歧管的至少一个液体输送通道流体连通。 可释放的保持部件选择性地可操作地以流体密封的方式无螺纹地固定在导管接收开口内的与液体歧管的至少一个液体输送通道流体连通的导管，以促进液体流过 液体输送通道，或者从管道连接器的导管接收开口释放导管。 当可操作地将管道保持在导管接收开口内时，可释放的保持部件至少部分地位于液体歧管内。

    MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING
    25.
    发明申请
    MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING 有权
    具有整体冷却冷却功能的多组分电子模块

    公开(公告)号：US20160050790A1

    公开(公告)日：2016-02-18

    申请号：US14925110

    申请日：2015-10-28

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Amilcar R. ARVELO ,  Levi A. CAMPBELL ,  Michael J. ELLSWORTH, JR. ,  Eric J. McKEEVER

    IPC: H05K7/20

    CPC classification number: H05K7/20263 ,  F28D15/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/34 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20281 ,  H01L2924/00

    Abstract: A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.

    Abstract translation: 提供冷却剂冷却的电子模块，其包括多组件组件和具有在各个电子部件上对齐的开口的模块盖。 导热元件设置在开口内，每个包括相对的冷却剂冷却和传导表面，导电表面热耦合到相应的电子部件。 设置在模块盖上方的歧管组件包括内部和外部歧管元件，内部元件构造成便于冷却剂流入冷却剂冷却表面。 外部歧管元件设置在内部歧管元件上并且联接到模块盖，其中内部和外部歧管元件限定冷却剂供应歧管，并且外部歧管元件和模块盖限定冷却剂返回歧管。 冷却剂供应开口与冷却剂供应歧管流体连通，并且冷却剂排放通道与冷却剂回流歧管流体连通。

    SELECTIVE CLAMPING OF ELECTRONICS CARD TO COOLANT-COOLED STRUCTURE
    26.
    发明申请
    SELECTIVE CLAMPING OF ELECTRONICS CARD TO COOLANT-COOLED STRUCTURE 有权
    电子卡选择性夹紧冷却冷却结构

    公开(公告)号：US20150359140A1

    公开(公告)日：2015-12-10

    申请号：US14827699

    申请日：2015-08-17

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Amilcar R. ARVELO ,  Mark A. BRANDON ,  Levi A. CAMPBELL ,  Tan D. DOAN ,  Michael J. ELLSWORTH, JR. ,  Randall G. KEMINK ,  Eric J. McKEEVER

    IPC: H05K7/20

    CPC classification number: H05K7/20254 ,  B23P15/26 ,  G06F1/20 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20772 ,  Y10T29/4935 ,  H01L2924/00

    Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure.

    Abstract translation: 提供了冷却装置和冷却剂冷却的电子组件，其包括被配置为耦合到可操作地插入到电子系统中的电子卡的热转印结构。 热传递结构包括可在打开位置和夹紧位置之间移动的夹紧结构。 与电子系统可操作地插入的电子系统相关联的冷却剂冷却结构驻留在电子卡之间，并且至少部分地通过将电子卡插入电子系统中的夹持结构。 夹紧结构的打开位置便于电子系统内的电子卡与卡之间的冷却剂冷却结构与至少部分地夹持结构之间的卡止结构，并且夹紧结构向夹紧位置的移动有利于夹紧 冷却剂冷却结构的热传递结构以及从卡到冷却剂冷却结构的热传导。

    COOLANT-COOLED HEAT SINK CONFIGURED FOR ACCELERATING COOLANT FLOW
    28.
    发明申请
    COOLANT-COOLED HEAT SINK CONFIGURED FOR ACCELERATING COOLANT FLOW 有权
    用于加速冷却液流动的冷却冷却热水槽

    公开(公告)号：US20150107801A1

    公开(公告)日：2015-04-23

    申请号：US14058562

    申请日：2013-10-21

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

    IPC: H05K7/20

    CPC classification number: H05K7/2039 ,  H05K7/20254 ,  H05K7/20772

    Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.

    Abstract translation: 提供冷却装置，冷却的电子模块和制造方法，其有助于从一个或多个电子部件到冷却剂的热传递。 该冷却装置包括具有导热结构的冷却剂冷却的散热器，该导热结构具有一个带有冷却剂输送隔室，该冷却剂输送室包括变化的横截面冷却剂流动区域，冷却剂流动区域通过冷却剂流动区域大致平行于结构的主传热表面 电子组件。 冷却剂冷却的散热器包括冷却剂入口和与冷却剂携带室流体连通的冷却剂出口，并且冷却剂承载室的冷却剂流动区域至少部分地沿冷却剂流过 冷气携带舱。 减少的冷却剂流动面积有助于通过至少部分地加速冷却剂供给室内的冷却剂流而增加主传热表面和冷却剂之间的有效传热系数。

    FABRICATING MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING
    29.
    发明申请
    FABRICATING MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING 有权
    整体冷却冷却制造多组分电子模块

    公开(公告)号：US20150055299A1

    公开(公告)日：2015-02-26

    申请号：US14528098

    申请日：2014-10-30

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Amilcar R. ARVELO ,  Levi A. CAMPBELL ,  Michael J. ELLSWORTH, JR. ,  Eric J. McKEEVER

    IPC: H05K7/20

    CPC classification number: H05K7/20263 ,  F28D15/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/34 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20281 ,  H01L2924/00

    Abstract: Methods for fabricating a coolant-cooled component assembly are provided, which include providing a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.

    Abstract translation: 提供了制造冷却剂冷却部件组件的方法，其包括提供具有在各个电子部件上对准的开口的多部件组件和模块盖。 导热元件设置在开口内，每个包括相对的冷却剂冷却和传导表面，导电表面热耦合到相应的电子部件。 设置在模块盖上方的歧管组件包括内部和外部歧管元件，内部元件构造成便于冷却剂流入冷却剂冷却表面。 外部歧管元件设置在内部歧管元件上并且联接到模块盖，其中内部和外部歧管元件限定冷却剂供应歧管，并且外部歧管元件和模块盖限定冷却剂返回歧管。 冷却剂供应开口与冷却剂供应歧管流体连通，并且冷却剂排放通道与冷却剂回流歧管流体连通。

    VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S)
    30.
    发明申请
    VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S) 有权
    阀门控制，双相加热器的水位蒸汽冷凝（S）

    公开(公告)号：US20150036288A1

    公开(公告)日：2015-02-05

    申请号：US14519422

    申请日：2014-10-21

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    IPC: G06F1/20

    CPC classification number: H05K7/20818 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/2029 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20809

    Abstract: Methods of facilitating cooling an electronic system are provided, which include: providing a heat sink(s) configured to cool an electronic component(s), the heat sink(s) including a coolant-carrying channel for a first coolant, the first coolant providing two-phase cooling to the electronic component(s) and being discharged from the heat sink(s) as coolant exhaust with coolant vapor; providing a node-level condensation module coupled in fluid communication with the heat sink(s), the condensation module receiving first coolant exhaust from the heat sink(s) and being liquid-cooled via a second coolant to condense coolant vapor before return to a rack-level return manifold; automatically controlling at least one of liquid-cooling of the heat sink(s), or liquid-cooling of the condensation module(s); and providing a control valve for adjusting flow rate of the second coolant to the condensation module(s), the control valve being automatically controlled based on a characterization of the coolant vapor in the coolant exhaust.

    Abstract translation: 提供了方便冷却电子系统的方法，其包括：提供被配置为冷却电子部件的散热器，所述散热器包括用于第一冷却剂的冷却剂传送通道，所述第一冷却剂 向电子部件提供两相冷却，并以冷却剂蒸气作为冷却剂排出从散热器排出; 提供与所述散热器流体连通的节点级冷凝模块，所述冷凝模块从所述散热器接收第一冷却剂排出物，并经由第二冷却剂进行液冷，以冷却冷却剂蒸汽，然后返回到 机架式回流歧管; 自动控制散热器的液体冷却中的至少一个或冷凝模块的液体冷却; 并且提供用于调节第二冷却剂到冷凝模块的流量的控制阀，基于冷却剂排气中的冷却剂蒸汽的表征来自动控制控制阀。

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